PCB LAYOUT

Mastering Analysis Methods for Electrostatic Discharge (ESD) Issues

2026-04-28

The interference mechanism and coupling paths of electrostatic discharge have been analyzed in depth previously. From now on, we will enter the next highly concerned section: Analysis and Debugging of Electrostatic Discharge Issues. Mastering the analysis methods for ESD problems allows rapid localization of sensitive equipment or coupling paths, achieving twice the result with half the effort.

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Power Integrity and PDN Design for PCB Routing

2026-04-28

SI (Signal Integrity) focuses on the waveform quality of signals, while PI (Power Integrity) focuses on the waveform quality of power supplies. The research object of PI is PDN (Power Distribution Network), which studies power issues from a more systematic perspective, eliminates or mitigates power noise, meets the load demand for current at different frequencies, and provides clean, stable and reliable power for loads.

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A Manufacturing Method for High Thermal Conductivity PCB Substrate Materials

2026-04-27

Thermal performance has always been a primary concern for PCB design and manufacturing engineers, and PCB substrate materials with high thermal conductivity play a crucial role in improving the thermal performance of PCBs. Based on this fundamental principle, this paper mainly introduces a manufacturing method for high thermal conductivity PCB substrate materials.

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Stackup Principles in PCB Design

2026-04-27

For multi-layer PCB design, the layer stackup of the PCB is an extremely critical step. The quality of the layer stackup has a direct impact on product performance. Below we summarize the basic principles of multi-layer board layer stackup.

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EMI Layout Scheme for PCB Design in DC-DC Conversion

2026-04-27

DC-DC converters enable efficient power conversion and power supply at various voltage levels. However, with rising demands for higher power density, higher efficiency, and smaller form factors, PCB design for DC-DC conversion has become increasingly critical.

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Brief Discussion on Four Types of Interference in PCB Design

2026-04-27

In electronic system design, PCB design is a core link that determines the overall anti-interference performance of the circuit. Unreasonable layout and routing will introduce various interference problems, affect signal integrity, and even lead to abnormal operation of electronic equipment. This article analyzes four common interference forms in PCB design and corresponding optimization design schemes.

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What is a Microstrip Line? History and Structure of Microstrip Line

2026-04-25

Microwave transmission lines are the foundation of radio frequency (RF) systems. We provided a detailed summary of common microwave transmission lines in Summary of RF Transmission Lines. Today, we will introduce the most widely used microwave transmission line — microstrip line.

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Long-Term Reliability of High-Frequency Circuit Materials and Printed Circuit Boards

2026-04-25

As complexity and density continue to rise, the long-term reliability of RF/microwave circuit assemblies has become increasingly difficult to characterize. Printed circuit boards (PCBs) contain numerous active and passive components whose performance degrades over time and with operating temperature.

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PCB Layout

Mastering Analysis Methods for Electrostatic Discharge (ESD) Issues

Power Integrity and PDN Design for PCB Routing

A Manufacturing Method for High Thermal Conductivity PCB Substrate Materials

Stackup Principles in PCB Design

EMI Layout Scheme for PCB Design in DC-DC Conversion

Brief Discussion on Four Types of Interference in PCB Design

What is a Microstrip Line? History and Structure of Microstrip Line

Long-Term Reliability of High-Frequency Circuit Materials and Printed Circuit Boards