As the core foundational component of the global electronics manufacturing industry, Printed Circuit Boards (PCBs) directly determine the performance, reliability, and total cost of ownership of end electronic products. With over 10 years of deep industry accumulation, MaxiPCB is a professional one-stop PCB manufacturing service provider, focusing on high-reliability, high-complexity PCB R&D and mass production. We are committed to delivering high-quality, cost-effective PCB manufacturing solutions for global customers, covering the full cycle from rapid prototyping, small-batch trial production to large-scale mass manufacturing.
Our 23,000-square-meter modern PCB manufacturing base is equipped with a full set of imported high-precision PCB fabrication and testing equipment, with 280 dedicated employees, more than 35% of whom are professional technical and R&D personnel. We have a stable senior engineering team with rich experience in solving complex process and technical problems, continuously optimizing manufacturing processes to improve production efficiency and product yield.
Full Range Product Manufacturing Coverage
Our manufacturing capabilities cover the full spectrum of PCB products, fully meeting the diversified needs of customers in various industries:
- High-Frequency & Microwave PCB: Including PTFE-based high-frequency substrates (Rogers, Taconic, Isola, etc.), for 5G/6G communications, radar systems, and RF applications
- High-Density Interconnect (HDI) PCB: Up to 8th order Anylayer HDI, for high-end consumer electronics, high-performance computing, and portable devices
- IC Packaging Substrate: PBGA, FCCSP, FCBGA, SiP substrate, for semiconductor advanced packaging applications
- Rigid-Flex PCB: 2~20 layer rigid-flex structures, for aerospace, medical, automotive electronics, and miniaturized devices
- Multilayer Rigid PCB: 2~64 layer mass production capability, up to 108 layer R&D prototype capability, for industrial control, communications, power supply, and computing applications
- Special PCB: Metal core PCB, embedded component PCB, high-Tg low-loss PCB, for automotive, new energy, and high-reliability industrial scenarios
Our products are widely used in Industry 4.0, telecommunications, industrial control, digital electronics, power supply, computing, automotive electronics, medical devices, aerospace, precision instrumentation, and the Internet of Things (IoT). Our customers are located in mainland China, Taiwan China, South Korea, Japan, the United States, Brazil, India, Russia, Southeast Asia, Europe, and other major global markets.
Core Manufacturing Capabilities
| Core Parameter |
Mass Production Capability |
Prototype Capability |
| Maximum Layer Count |
64 Layers |
Up to 108 Layers |
| Minimum Line Width/Line Spacing |
2/2mil (50/50μm) |
1/1mil (25/25μm) |
| Minimum Mechanical Drill Hole Diameter |
0.15mm |
0.1mm |
| Minimum Laser Microvia Diameter |
50μm |
30μm |
| Maximum Aspect Ratio |
24:1 |
Up to 48:1 |
| Impedance Control Tolerance |
±5% |
±3% |
| Panel Size |
Up to 2000mm × 650mm |
Up to 2300mm × 700mm |
Standardized Full-Process Manufacturing System
PCB manufacturing is a complex, multi-disciplinary production process integrating mechanical processing, chemical reaction, photochemical, electrochemical, thermochemical processes, and computer-aided manufacturing (CAM). We have established a standardized, closed-loop full-process manufacturing system, with strict controls over every production link to ensure product consistency and reliability.
Core Manufacturing Process Chain
Our standardized manufacturing process covers the full production cycle:
CAM Engineering Audit → Inner Layer Pattern Transfer → Inner Layer AOI Inspection → Lamination → Drilling → Desmear & Electroless Copper Deposition → Pattern Electroplating → Outer Layer Etching → Outer Layer AOI Inspection → Solder Mask Application → Silkscreen Printing → Surface Treatment → Electrical Testing → Final Inspection & Packaging
Key Process Control Specifications
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Substrate Material Selection & Qualification
PCB substrates are divided into organic and inorganic material systems, each with unique performance characteristics. We have established a strict incoming material qualification system, with comprehensive evaluation of dielectric properties, copper foil type, core thickness, and process adaptability before material approval. For fine-line fabrication, we strictly control copper foil thickness, as thinner copper foil delivers higher etching precision and finer line geometry consistency, which is critical for high-density circuit fabrication.
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Production Environment Control
We maintain a constant temperature and humidity production workshop, with strict environmental control throughout the manufacturing process. Excessive temperature fluctuations will cause substrate deformation and drilling accuracy deviation, while high humidity will lead to moisture absorption of the substrate, resulting in irreversible changes in dielectric properties and reduced interlayer bonding reliability. Our workshop environment is monitored in real time 24/7, ensuring stable production conditions to avoid environmental-induced product defects.
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Customized Process Adaptation
PCB fabrication is highly sensitive to product design characteristics. Factors such as layer count, via structure, surface treatment, and special material requirements will directly affect the final product quality. We formulate customized process solutions for each order based on product characteristics, equipment capabilities, and customer requirements, with flexible process adjustment to ensure the manufacturability and reliability of different types of PCBs.
DFM Design Support & Manufacturability Optimization
PCB design is the core factor determining product manufacturability, quality, and cost. We provide free professional Design for Manufacturability (DFM) audit services for all customer orders, with a senior engineering team to check design files, identify potential manufacturing risks, and provide optimization suggestions before production, to avoid design-induced defects, reduce scrap rate, and shorten production cycle.
Key Design Risk Mitigation Services
We help customers avoid common design mistakes that lead to manufacturing defects:
- Pad & Via Overlap Check: Avoid overlapping pads that cause drill hole breakage, and short circuit risks caused by overlapping connection pads and isolation pads in multilayer boards
- Graphic Layer Standardization Check: Ensure compliance with industry standard layer design specifications, avoid component surface design on the solder side, and eliminate invalid design debris such as broken lines, useless borders, and redundant labels
- Silkscreen Design Optimization: Avoid silkscreen characters covering SMD pads, which affects soldering and electrical testing; standardize character size to ensure clear silkscreen printing (minimum character height >40mil)
- Pad & Aperture Design Check: Standardize single-sided pad aperture design, avoid missing drill hole definitions, and ensure inner layer isolation pad integrity for SMD pads
- Gerber File Integrity Check: Ensure the completeness and standardization of production files, avoid missing aperture tables, layer definitions, and manufacturing specification notes
Quality Management & Compliance Certification
We have established a perfect full-process quality management system, and have passed ISO9001 quality management system certification, UL safety certification, and fully comply with RoHS, REACH and other global environmental regulations. All products are manufactured in strict accordance with IPC-A-600 and IPC-6012 Class 2/Class 3 international acceptance standards, with a closed-loop quality control system covering raw material incoming inspection, in-process SPC statistical process control, and finished product reliability testing.
We adhere to the quality concept of "excellence in every link, prevention first", continuously optimize the manufacturing process, improve production efficiency, reduce production costs, and deliver high-reliability PCB products that fully meet customer requirements.
Order Requirements & File Specifications
Quotation Request Requirements
To provide you with an accurate and timely quotation, please provide the following information:
- PCB specification parameters (layer count, board thickness, copper thickness, surface treatment, color, etc.)
- Production quantity and delivery requirements
- Special process requirements (impedance control, blind & buried vias, special materials, etc.)
Production File Requirements
For formal production orders, please provide the following complete files:
- Original PCB design files (Altium Designer, KiCad, Cadence, etc.) or standard Gerber files (including aperture table)
- Detailed PCB fabrication drawing notes, including layer stack-up, impedance requirements, tolerance specifications, testing requirements, and other special instructions
- Delivery address and logistics requirements
