Chip components: SOT, SOP, QFP, chip resistors and chip capacitors
Positioning → solder paste printing → placement by placement machine → reflow soldering → inspection
Surface-mount packages are placed by machine and fixed in a reflow oven, which is why paste printing and placement accuracy drive the result.
Buyer decision: confirm the SMT line is automated and that inspection happens after reflow, not just at final packing.



