Aluminum nitride ceramic PCB

Name: Aluminum nitride ceramic PCB
Brand: PCB Printed Circuit Board and PCBA manufacturing
Availability: InStock
Rating: 5 (1 reviews)

Product Model: Aluminum Nitride Ceramic PCB

Base Material: Ceramic Substrate

PCB Layers: 2 Layers

Color: White

Substrate Thickness: 0.635mm Aluminum Nitride

Copper Thickness: 1OZ (35μm)

Surface Treatment: Immersion Gold

Gold Layer Thickness: ≥3μ"

Minimum Aperture: 0.8mm

Process Features: Through hole processing, ceramic dam technology

Get The Latest Quote

Description
Data Sheet

Possessing excellent electrical characteristics and mechanical properties, ceramic substrate PCBs have achieved growing application popularity across high-end electronics industries.

This material series features a thermal conductivity of 20~200 W/(m·K), which is 20 to 200 times higher than common aluminum-based copper substrates. Its dielectric withstand voltage reaches 17000 V/mm, with insulating performance 17 times greater than conventional circuit board products. The ceramic board maintains a fine surface roughness of 0.2~0.7 μm, and its compressive strength exceeds 450 MPa, outperforming all mainstream PCB base materials. Even in complex and harsh working conditions including high temperature, high humidity, high pressure and severe corrosion, it can sustain stable and reliable electrical operation.

ceramic substrate PCB

Ceramic Substrate PCB Manufacturing Capability

Maxipcb provides professional customized processing for ceramic circuit boards. The factory supports 3 mil / 3 mil ultra-fine precision circuit production, with adjustable conductor thickness ranging from 0.01 mm to 0.5 mm. Advanced manufacturing technologies such as micro hole filling, inorganic dam sealing and 3D stereo circuit patterning are fully covered.

Multiple standard substrate thickness options are available: 0.25 mm, 0.38 mm, 0.5 mm, 0.635 mm, 1.0 mm, 1.5 mm, 2.0 mm, 2.5 mm and 3.0 mm, to satisfy diversified structural design requirements.

In terms of surface treatment, diversified processes can be customized: gold plating (1~30 μm), nickel-palladium plating (1~5 μm), silver plating (3~30 μm), nickel plating (3~10 μm) and immersion tin (1~3 μm), to match different welding, anti-oxidation and conductive application scenarios.

Model : Aluminum nitride ceramic PCB

Material : Ceramic PCB, Ceramic Substrate

Layer : 2Layer Ceramic PCB

Color : White

Thickness : Aluminum nitride 0.635mm

Copper Thickness : 1OZ(35um)

Surface Treatment : Immersion Gold

Gold thick : >=3U"

Minimum aperture : 0.8mm

Process features : through hole, ceramic dam technology

Aluminum nitride ceramic PCB

Description

Data Sheet

Ceramic Substrate PCB Manufacturing Capability