pcb design, pcb layout, pcb assembly, smt, pcba

Avoiding production trap: common mistakes in PCB design and their solutions

2026-03-06

The success of the prototype does not mean that the design is ready for production. Engineers must fully consider various potential problems in the manufacturing process at the design stage.

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Detailed explanation of PCB process route

2026-03-06

Detailed explanation of PCB process route: additive process vs reduction method, understand the core differences and future trends in one article.

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Thermal shock test: the key link to ensure PCB reliability

2026-03-05

In the field of electronic equipment manufacturing, the quality and reliability of printed circuit board (PCB) directly determine the performance and life of the final product. Among many test items, thermal shock test has become one of the important means to evaluate PCB reliability because of its harsh conditions and efficient screening ability.

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Ion Cleanliness Test of Printed Circuit Board (PCB)

2026-03-05

In the electronic manufacturing industry, the ionic cleanliness of printed circuit board (PCB) is a key index to evaluate its quality and reliability. In the production process, PCB goes through many processes such as electroplating, wave soldering, reflow soldering and chemical cleaning, which may introduce ionic pollutants, thus affecting the function and long-term reliability of electronic products.

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Relevant parameters for evaluating the quality of PCB substrate

2026-03-05

The related parameters to evaluate the quality of PCB substrate mainly include glass transition temperature Tg, thermal expansion coefficient CTE, PCB decomposition temperature Td, heat resistance, electrical properties and PCB water absorption.

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The Essential difference between solder resist layer and solder aid layer of PCB

2026-03-05

A clear understanding of "makeup" of PCB: the essential difference between solder mask and solder mask.

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Discussion on EMI in PCB design

2026-03-04

It is well known that reasonable laminated structure and continuous reference plane can effectively suppress EMI problems, but sometimes the design involves the problem of analog and digital signal isolation.

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PCB Design: Technical Characteristics and Design Challenges of Arbitrary Layer VIA

2026-03-04

In recent years, in order to meet the needs of miniaturization of some high-end consumer electronic products, the integration of chips is getting higher and higher, the pitch of BGA pins is getting closer and closer (less than or equal to 0.4pitch), the layout of PCB is becoming more and more compact, and the wiring density is getting larger and larger. In order to improve the routing rate of the design without affecting the performance such as signal integrity, ANYLAYER technology is applied.

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Avoiding production trap: common mistakes in PCB design and their solutions

Detailed explanation of PCB process route

Thermal shock test: the key link to ensure PCB reliability

Ion Cleanliness Test of Printed Circuit Board (PCB)

Relevant parameters for evaluating the quality of PCB substrate

The Essential difference between solder resist layer and solder aid layer of PCB

Discussion on EMI in PCB design

PCB Design: Technical Characteristics and Design Challenges of Arbitrary Layer VIA