PCB Layout

Notes on Impedance Routing for Multilayer PCBs
2026-03-26
the tips for routing impedance‑controlled traces on multilayer PCBs.
A Basic Guide to PCB Design and Manufacturing
2026-03-26
Design professionals often talk about design-for-manufacturing guidelines, but what exactly are these guidelines and how are they implemented in your PCB design software? In PCB development, design for manufacturing has a very simple meaning: you should only implement a design choice if it ensures maximum manufacturable yield.
How to Select PCB Pads
2026-03-26
In PCB manufacturing, solder bridging (unintended solder connection between adjacent pads) is a common issue, mainly caused by improper pad design. If left unaddressed, it can lead to short circuits and functional failure. This article introduces three pad types to prevent solder bridging.
The Mystery and Feasibility of Right‑Angle PCB Routing
2026-03-26
Recently I came across a 2020 blog post by Zachariah Peterson: The Great PCB Layout Rules of Thumb Debate Rages On, which discusses widely debated PCB design rules of thumb.
Detailed Explanation of PCB Trace Width Definition and Calculation Methods
2026-03-26
This article covers PCB trace width, trace width calculation, and the relationship between trace width and current.
Key Factors to Consider When Designing a PCB
2026-03-25
Board-level engineers, especially RF board-level engineers, often have to design PCBs themselves. So what should we consider before starting PCB layout?
How to Achieve Stable and Efficient Power Supply on PCBs
2026-03-25
As the heart of electronic equipment, the design, layout and routing of the power supply directly determine the stability and efficiency of the entire system. How can electronic engineers design a power supply PCB to ensure stable, efficient and safe power delivery?
Is It Still Necessary to Use Via‑in‑Pad After Adding Blind/Buried Vias on a PCB?
2026-03-25
In PCB design, via types include blind vias, buried vias, and via‑in‑pad vias, each with different applications and advantages. Blind and buried vias are mainly used for electrical connections between layers of multilayer PCBs, while via‑in‑pad vias are used for component mounting and soldering. If blind and buried vias have been added to a PCB, is it still necessary to use via‑in‑pad vias?
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