Rogers RO4350B Hybrid PCB

Maxipcb is a specialized RF PCB manufacturer based in China with over 17 years of industry experience. We fully recognize the critical influence of high-performance dielectric materials on the electrical performance of RF and microwave circuits. Key indicators including microwave power rating, operating frequency band, temperature stability, current-carrying capacity and withstand voltage are strictly evaluated during material selection for high-frequency PCB manufacturing. Proficiency in the characteristics and application scenarios of RF microwave substrates is one of our core technical strengths. A full range of mainstream high-frequency materials is kept in stock to support rapid prototype and mass production delivery.

RO4350B + FR4, RO4350B + IT180, RO4003C + FR4, RO3010 + FR4, RO3003 + FR4 and other custom mixed laminate combinations.

OSP, ENIG (Electroless Nickel Immersion Gold), lead-free HASL, hard gold plating, flash gold, immersion tin, immersion silver, electrolytic gold.

Gold finger, heavy copper circuitry, blind and buried vias, controlled impedance design, resin plug vias, carbon ink printing, back drilling, countersinking, depth-controlled drilling, half-plated holes, press-fit holes, peelable blue mask, peelable solder mask, extra-thick copper, oversized board manufacturing.

Consumer electronics, military and aerospace, antenna and communication systems, high-power equipment, medical devices, automotive electronics, industrial control, handheld communication terminals, cellular and Wi-Fi antennas, automotive telematics and infotainment, computing systems, radar systems, power amplifiers and other RF microwave applications.