Name: Optical Module HDI PCB
Brand: PCB Printed Circuit Board and PCBA manufacturing

Optical Module HDI PCB

Product Model: Optical Module HDI PCB

Layer Quantity: 8 Layers

Substrate Material: FR4, High‑Tg 170℃

HDI Configuration: 2+4+2 stack‑up HDI structure

Board Finished Thickness: 0.8 mm

Copper Foil Thickness: 0.5 oz

Solder Mask Color: Green / White (optional)

Surface Finish Process: Electrolytic Hard Gold

Special Manufacturing Technology: Gold finger beveling design

Minimum Trace Width / Spacing: 3 mil / 3 mil

Description
Data Sheet

Product Technical Characteristics

Designed for miniaturized optical communication applications, the board area is controlled within 3–5 cm², realizing ultra-compact PCB structure for optical module scenarios.
Featuring high-precision line and aperture capabilities to support integrated IC packaging; high-grade designs adopt blind/buried vias and HDI structures, with partial products supporting 2nd-order HDI manufacturing process.
Strict contour dimension control per Class 3 industry standards, ensuring high matching accuracy with metal enclosures; dimensional tolerance is precisely regulated to avoid assembly interference caused by oversized or undersized boards.
Integrated with staggered gold finger (long-short gold finger) design to meet pluggable and sequential electrical connection requirements of optical modules.
Commonly employs high-performance substrate materials including Rogers series and Panasonic M6, catering to high-speed signal transmission and stability demands of optical communication products.

Optical Module Basic Composition

Optical modules are mainly composed of optoelectronic devices, functional circuit modules and optical interfaces, in which the optoelectronic section is divided into transmitting assembly and receiving assembly.

5G Network Architecture & Optical Module Demand

The 5G access network adopts a three-tier CU-DU-AAU architecture, which further drives the demand for optical modules. It is estimated that the domestic demand for 5G fronthaul and midhaul optical modules will reach approximately 40.8 million units and 13.6 million units respectively, representing 2.67 times the total volume of the 4G era.

5G Optical Cable Demand Analysis

5G construction is expected to drive demand for nearly 250 million core-kilometers of optical cables. It should be noted that uncertainties exist in 5G bearer network deployment schemes, such as the C-RAN deployment ratio and fronthaul WDM equipment application ratio, which may lead to actual optical fiber demand deviating from forecast levels.

Under the 5G SA networking architecture, substantial optical fiber resources are required not only for fronthaul networks, but also for backhaul and bearer networks. The projected optical fiber consumption is expected to exceed market expectations by approximately 100 million core-kilometers, bringing marginal improvement to the entire optical communication industry chain.

About Maxipcb

Maxipcb is a professional PCB manufacturer dedicated to providing high-reliability circuit board solutions for the electronics industry. Core product portfolio includes multilayer PCB, prototype PCB, high-speed PCB, high-frequency PCB, gold finger PCB, gold-plated PCB, impedance control PCB, ceramic circuit board, fine-pitch PCB and other high-standard printed circuit board products.

FAQ

What materials are used in the Optical Module HDI PCB?
We manufacture the Optical Module HDI PCB using high Tg 170°C FR4 substrate and offer material options like the Rogers series and Panasonic M6. These materials ensure high-speed signal integrity and durability for your printed circuit board applications.

Can I customize solder mask colors and surface finishes?
Yes, we provide optional solder mask colors including Green or White to suit your design needs. The surface finish is an electrolytic hard gold plating, ensuring robust and reliable contact points for your HDI PCB manufacturer requirements.

What precision standards do you maintain for dimension control?
Our Optical Module HDI PCB adheres to Class 3 contour dimension control, guaranteeing dimensions within strict tolerances. This precision is crucial for compact optical modules fitting tightly within metal housings and meeting your high-density interconnect needs.

How do you support the integration and testing of optical modules?
We design our 8-layer multilayer PCB with features like blind and buried vias and staggered gold finger beveling to facilitate reliable mating and signal integrity. This supports mechanical fit testing and functional integration of optoelectronic devices within your assemblies.

Model : Optical Module HDI PCB

Layers : 8Layers

Material : TG170 FR4

Construction : 2+4+2 HDI PCB

Finished Thickness：0.8mm

Copper Thickness : 0.5OZ

Color : Green/White

Surface treatment: Electric hard gold

Special technology: golden finger bevel

Min Trace / Space：3mil/3mil

Application : Optical Module HDI PCB