Name: Bonding Circuit Board
Brand: PCB Printed Circuit Board and PCBA manufacturing

Description
Data Sheet

Product Advantages

Structural and Design Superiority in Bonding PCB

The Bonding PCB exhibits a highly specialized pad configuration, arranged with ultra-fine pitch layouts that precisely accommodate wire bonding mechanics. Its solder mask is strategically designed with targeted open windows facilitating clean and exact bonding locations, significantly reducing bonding inconsistencies. The use of immersion gold surface treatment and tight dimensional control (卤10% bonding foot width tolerance) evidences a design that is adaptable for various ultrasonic bonding equipment parameters. These features combine in a product optimized by a professional bonding PCB manufacturer to meet specific electrical and mechanical integration demands, supporting modular assembly and quality assurance requirements in semiconductor production.

Enhanced Performance and Operational Value

Functionally, this wire bonding PCB delivers robust bonding pad adhesion and secure wire-to-pad connections, critical for long-term device reliability. The integration of epoxy encapsulation post-bonding protects the interface from corrosion, static discharge, and mechanical abrasion, extending product lifecycle in end applications. Its consistent dimensional accuracy facilitates repeatable process control, reducing rework and enhancing yield rates. The high-frequency ultrasonic bonding applied ensures uniform atomic contact, optimizing electrical performance. As a product spotlighting advanced bonding strength and stability, it provides engineering teams with confidence in performance metrics while easing integration into the existing production and testing frameworks managed by experienced custom IC bonding circuit board suppliers.

What is Bonding PCB?

Bonding PCB is a specialized circuit board tailored for chip wire bonding processes in semiconductor packaging. Before encapsulation, it adopts gold wire or aluminum wire bonding to electrically connect chip internal circuits with packaging pins or gold-plated copper foil pads on the PCB.

Relying on ultrasonic bonding technology, an ultrasonic generator outputs 40~140 kHz high-frequency vibration. Vibration energy is transmitted to the bonding capillary via a transducer and amplitude transformer. Under precise pressure and high-frequency friction, the oxide layer on metal surfaces is destroyed to produce micro plastic deformation. Two pure metal surfaces form atomic-level close contact, creating high-strength mechanical and electrical integration. After wire bonding is completed, the chip and connecting wires are fully sealed and protected with black epoxy adhesive to finish packaging.

How to Identify Bonding PCB

Bonding PCB has distinct structural features for quick identification:

Bonding pads are arranged in a regular rectangular array, with compact square or circular pad design and ultra-fine pitch;
Solder mask adopts targeted open-window design, with independent regular open-window pads reserved in the central IC bonding area, and leading-out traces for most bonding terminals;
Dimensional acceptance standards: bonding foot width tolerance ±10%, pad spacing ≥ 3mil;
No broken bonding pins are allowed, and etching edges cannot be narrowed to reduce the designed spacing.

Advantages of Bonding PCB Packaging

Compared with traditional SMT mounting technology, bonding packaging delivers comprehensive performance upgrades:

Higher resistance to corrosion, shock and long-term operational stability;
Chips are connected to PCB pads through fine gold wires and fully covered by high-performance organic protective adhesive;
Sealed isolation effectively prevents damage from humidity, static electricity and chemical corrosion;
The protective colloid melts and cures at a specific high temperature to form a seamless fit with the chip, eliminating mechanical wear of core components and greatly improving product service life and environmental adaptability.

PCB Bonding Standard Process Requirements

Complete Process Flow

PCB Cleaning → Dispensing → Die Attach → Wire Bonding → Glue Encapsulation → Finished Product Testing

1. PCB Surface Cleaning

Wipe off oil stains, dust and oxide layers on bonding areas. Auxiliary cleaning with soft brushes or air guns is required to ensure pad surface cleanliness and improve bonding firmness.

2. Dispensing

Control glue volume moderately, with four glue points evenly distributed at four corners of the chip area. Strictly avoid adhesive overflow and contamination of bonding pads to prevent bonding failure.

3. Die Attach

Use a flat-nozzle vacuum suction pen to pick and place chips to avoid wafer surface scratches. Verify chip orientation strictly during lamination to ensure three core requirements:

Flat: The wafer is parallel and closely fitted with the PCB without gaps;
Stable: The chip is firmly attached and not easy to fall off during subsequent processing;
Accurate: Align with the reserved position without deflection or reverse installation.

4. Wire Bonding

Unified industrial inspection standards for wire bonding quality:

Pull strength: 1.0mm wire ≥ 3.5G; 1.25mm wire ≥ 4.5G;
Aluminum wire tail specification: 0.3~1.5 times of wire diameter;
Solder joint shape: standard oval structure;
Solder joint length: 1.5~5.0 times of wire diameter;
Solder joint width: 1.2~3.0 times of wire diameter.

Operators conduct full-process microscopic monitoring to eliminate defects such as wire breakage, offset, cold solder joint, thermal welding and aluminum layer peeling. First-piece inspection is mandatory before mass production; regular sampling inspection is required every 2 hours during continuous production.

5. Glue Encapsulation

Check the flatness and integrity of the plastic ring in advance to ensure no deformation. The bottom of the plastic ring must fit closely with the wafer without blocking the photosensitive area.

The black sealing glue shall fully cover bonding aluminum wires and chips without exposure or overflowing the PCB boundary. Prohibit the glue from penetrating into the chip through the plastic ring, and avoid scratching wafers and bonding wires during dispensing.

Strict segmented curing parameters:

Preheating: 120 ± 5°C, 1.5~3.0 minutes;
Curing: 140 ± 5°C, 40~60 minutes.

After curing, the glue surface is free of pores and cracks, and the glue height shall not exceed the plastic ring.

6. Bonding PCB Comprehensive Testing

Multiple testing methods are combined to fully verify overall quality:

Manual visual inspection for appearance and structural defects;
Automatic bonding machine detection for wire connection quality;
AOI automatic optical analysis;
X-ray internal scanning to detect hidden defects of underlying solder joints.

FAQ

What materials are used in the construction of your Bonding PCB?

We manufacture our Bonding PCB using FR-4 base material rated at Tg 130掳C, with a copper thickness of 0.5 oz and surface treatment via immersion gold. This combination ensures durability and high-frequency performance tailored for precise chip wire bonding applications.

Can you customize Bonding PCBs for specific IC bonding requirements?

Yes, we offer tailored solutions for custom IC bonding circuit board designs, including specialized pad layouts, fine pitch arrangements, and solder mask openings to meet your exact chip bonding specifications. Our advanced fabrication processes ensure your custom needs are fully met.

How do you ensure the reliability of wire bonding on your Bonding PCB?

We utilize ultrasonic bonding technology and precise solder mask designs to guarantee strong mechanical and electrical connections. Our quality control includes microscopic inspections, AOI, and X-ray testing to verify every wire bonding PCB meets rigorous standards.

What is the typical lead time and delivery process for Bonding PCB orders?

Our production lines operate with efficient scheduling to meet your project timelines. After rigorous testing and inspection stages, we pack and ship globally, ensuring you receive your bonding circuit board on time and in optimal condition for assembly.

Model: Bonding Circuit Board

Material: FR-4 Tg=130

Layer: 2 layer PCB

Color: Green/White

Finished Thickness: 1.0mm

Copper Thickness: 0.5OZ

Surface Treatment: Immersion Gold

Min Trace: 4mil(1.0mm)

Min Space: 4mil(1.0mm)

Characteristic: Bonding Circuit

Application: IC Bonding

Bonding Circuit Board

Description

Data Sheet