10 Layer ENIG PCB

Product Model: 10-Layer ENIG Finished PCB

Base Laminate: TU-768 high-performance epoxy glass cloth substrate

Layer Structure: 10-Layer conductive multilayer PCB

Solder Mask & Silkscreen: Green solder mask with white legend

Finished Board Thickness: 1.0 mm

Copper Weight: 2–3 oz

Surface Finish: Electroless Nickel Immersion Gold (ENIG)

Minimum Trace Width: 3 mil

Minimum Trace Spacing: 3 mil

Description
Data Sheet

High-End Multilayer PCB Substrate Application & Material System Classification

Name: 10 Layer ENIG PCB
Brand: PCB Printed Circuit Board and PCBA manufacturing
Rating: 5 (1 reviews)

PCBs with 10 or more layers are mainly designed for high-end electronic equipment, and high-Tg high-performance epoxy glass fiber laminates are generally adopted as the core substrate material.

TU-768 series substrate has been widely used in high-layer-count PCB products due to its excellent comprehensive performance. This material features outstanding conductive anode filament (CAF) resistance, stable coefficient of thermal expansion, excellent heat resistance, strong chemical corrosion resistance, and low water absorption. As a classic high-Tg laminate, it supports reliable processing and long-term operation of complex multilayer boards.

Classification of Glass Fiber Reinforcement Systems

E-Glass (Electronic Grade Glass Fiber)
It is a type of calcium aluminosilicate glass with an alkali metal oxide content generally lower than 1%, belonging to the non-alkali glass fiber system. It features high volume resistivity and excellent electrical insulation. E-Glass is the most mainstream reinforcing material for printed circuit board substrates. Unless otherwise specified, conventional laminates adopt the E-Glass system by default.
NE-Glass (Low-DK Glass Fiber)
Also known as low dielectric glass fiber, developed by Nitto Boseki, mainly for high-speed and low-loss applications. Its dielectric constant εr (1MHz) is approximately 4.6 (vs. 6.6 for E-Glass), and dissipation factor Tanδ (1MHz) is about 0.0007 (vs. 0.0012 for E-Glass). Typical laminates supporting NE-Glass include M7NE, IT968SE, IT988GSE, etc.

Mainstream High-Performance Substrate Series by Manufacturer

ITEQ: IT180A, IT170GRA1, IT958G, IT968, IT968SE, IT988GSE
TUC: TU862HF, TU872LK, TU872SLK, TU872SLK-SP, TU883, TU933+
Panasonic: Megtron4, M4S, Megtron6, M6G, M7E, M7NE
Park MeteorWave: MW1000, MW2000, MW3000, MW4000, MW8000
Shengyi: S1000-2(M), S7439, S6 series
Rogers: RO4003, RO3003, RO4350B (special RF & high-frequency substrates)

The above material systems can be used to manufacture double-sided PCBs, multilayer PCBs (4 layers and above), and hybrid high-frequency circuit boards.

Classification by Dielectric Loss Level

Standard loss laminates: DF ≥ 0.02
Medium loss laminates: 0.01 ＜ DF ＜ 0.02
Low loss laminates: 0.005 ＜ DF ＜ 0.01
Ultra-low loss laminates: DF ＜ 0.005

The above is a general industry classification; the range definition may vary slightly in different application scenarios and standard systems.

Classification by Flame Retardancy

Flame-retardant grades: UL94 V-0, UL94 V-1
Non-flame-retardant grade: UL94 HB

Other classification methods (such as by dielectric constant, thermal conductivity, structural type, etc.) are not elaborated here.

In medium-high-speed and high-end PCB design, material selection is usually based on specific grades from manufacturers, such as IT180A, S1000-2, IT968, M4S, etc. Among them, conventional high-Tg laminates such as IT180A, S1000-2(M), TU752 and TU768 have similar dielectric loss performance and outstanding cost performance, making them the most widely used high-Tg substrates in the current industry.

Maxipcb specializes in the R&D and manufacturing of high-quality 10-layer and high-layer-count printed circuit boards, providing stable and reliable mass delivery solutions for high-layer-count PCBs.

Model : 10Layer ENlG Board

Material: TU-768

Layer: 10Layer

Color : Green/wVhite

Finished Thickness:1.0mm

Copper Thickness:2-3OZ

Surface Treatment : lmmersion Gold

Min Trace : 3mil

Min Space : 3mil