PCB Assembly

What are the differences between solder paste printing and reflow soldering?----MaxiPC

2026-03-13

The cavity problem in the process of solder paste printing and reflow is usually related to the bad phenomenon in the welding process. So what are the differences between solder paste printing and reflow soldering? This article is simply analyzed by Shenzhen Jiajinyuan solder paste manufacturer:

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Modern printed circuit board assembly technology

2026-03-11

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Analysis of common problems in Stencil testing

2026-03-10

from missing printing to collapse, I will teach you how to eliminate printing hidden dangers.

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Detailed explanation of red glue technology in SMT

2026-03-06

In SMT, red glue process and solder paste process are two commonly used welding methods. Although their purpose is to fix electronic components on PCB, there are obvious differences between the two processes in materials, equipment, operation flow and product application. Today, let's introduce in detail the "red glue" process that we often hear but are not commonly used.

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The Essential difference between solder resist layer and solder aid layer of PCB

2026-03-05

A clear understanding of "makeup" of PCB: the essential difference between solder mask and solder mask.

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