Smart Wear Rigid-Flex PCB(R-FPCB)

Product Model: 8L Smart Wear Rigid-Flex PCB

Material: FR4 + PI Composite Substrate

Layer Structure: 6 Rigid Layers + 2 Flexible Layers

Copper Weight: 1oz

Finished Thickness: 1.2mm

Surface Finish: Immersion Gold (Gold Thickness: 2U)

Min. Aperture: 0.2mm

Min. Trace / Space: 3mil/3mil

Application: Smart Wear Equipment PCB

Description
Data Sheet

The wearable device industry has entered a critical development stage, forming two mainstream application directions: sports health monitoring and home medical care. Driven by the iterative upgrading of sensors and control chips, wearable products are gaining broader application value in professional medical scenarios.

Characteristics of Rigid-Flex PCB

Core Advantages

Rigid-flex composite boards integrate the structural merits of rigid PCB and flexible FPC. With customizable rigid support areas and bendable flexible sections, they perfectly meet the composite structural design demands of high-density and special-shaped electronic products. This composite structure effectively optimizes internal space layout, reduces finished product overall dimensions, and improves circuit interconnection stability and comprehensive equipment performance.

Technical Limitations

Restricted by composite stacking and hybrid material processes, rigid-flex PCB features complex production flows and high manufacturing barriers. Diversified material matching and multi-step working procedures lead to limited mass production yield. Higher consumption of raw materials and labor resources results in higher unit cost, and its production lead time is notably longer than conventional single rigid boards.

Maxipcb Comprehensive Strength

Maxipcb is equipped with complete advanced production and precision testing equipment, supported by experienced technical personnel and standardized operation management. The company implements full-process quality control, adopts preventive quality management mechanisms, and steadily optimizes production efficiency, process stability and comprehensive manufacturing costs. We adhere to green production and sustainable operation standards to maintain standardized and environmentally compliant production.

Independently developed online intelligent service platforms support instant quotation, one-click ordering, payment and after-sales linkage services. With industry-leading automatic quotation systems, it shortens customer R&D cycles and accelerates new product launch progress.

The company continuously upgrades rigid-flex PCB manufacturing processes, focuses on solving customized technical difficulties, and delivers high-stability, high-performance circuit solutions for high-precision application scenarios.

Process & Application Control

For camera module dedicated rigid-flex boards, Maxipcb adopts asymmetric stacking design with warpage controlled within 0.75%. Mechanical blind routing is applied for rigid zone windowing to protect flexible substrates; laser forming is adopted for flexible areas, with outline tolerance controlled at ±0.05mm. Optimized laser cutting routing and copper layer layout improve processing efficiency, while structural heat dissipation and mechanical strength are continuously optimized.

Our products cover consumer electronics, medical devices, automotive electronics, industrial control, aerospace and other fields, and are exported to global mainstream markets to provide one-stop customized manufacturing services.

With UL, ISO9001 and SGS RoHS full qualification certification, Maxipcb selects high-reliability core materials including adhesive-free PI substrates, matched resin system rigid materials and low-flow prepreg. Supported by precision processes such as inner layer micro-etching cleaning, X-ray multi-layer alignment and optimized lamination parameters, it fully meets the production requirements of fine circuit, high flatness and impedance control for high-end rigid-flex PCB.

Model : 8L Smart Wear Rigid-Flex PCB(R-FPCB)

Material : FR4 +PI

Layer : Rigid 6L + Flex 2L

Copper Thickness : 1OZ

Finished Thickness : 1.2mm

Surface Treatment : Immersion Gold

Min Hole : 0.2mm

Gold thickness 2U

Min Trace / Space : 3mil/3mil

Application : smart wear pcb