Single side aluminum based PCB for LED board

Description
Data Sheet

Single‑sided aluminum based PCB adopts a three‑layer composite structure, composed of aluminum substrate, thermally conductive insulating layer and copper circuit foil. The aluminum base acts as the main heat dissipation carrier, the intermediate insulating layer realizes electrical isolation and efficient heat transfer, and the surface copper layer undertakes circuit conduction and signal transmission.

In mainstream structural design, conductive circuits are fabricated on only one side of single‑sided aluminum based PCB, while the reverse aluminum surface remains smooth and circuit‑free. As the most widely applied metal substrate in the industry, it is extensively used in street lamps, fluorescent lighting, spotlights and diverse high‑power lighting equipment. The circuit layer is arranged on the upper face, and the bottom aluminum base is closely attached to equipment shells or thermal conductive adhesives to form a reliable heat dissipation structure. Replacing conventional FR4 glass fiber circuit boards, this aluminum substrate features superior heat dissipation efficiency, high structural toughness, fracture resistance and flexible mechanical adaptability.

Multiple standard thickness specifications are available, including 1.0 mm, 1.2 mm, 1.5 mm, 1.6 mm, 2.0 mm, 3.0 mm and 5.0 mm, which can be selected and customized according to the overall assembly thickness of terminal products. Its circuit layout design is highly flexible, supporting independent series connection, parallel connection and hybrid series‑parallel wiring modes.

Single sided aluminum based PCB

Structural Composition of Aluminum Based PCB

1. Metal Substrate

Common aluminum base materials include LF, L4M and LY12 series, with a tensile strength of 30 kgf/mm² and an elongation of 5%. Imported aluminum substrates are supplied in four mainstream thicknesses of 1.0 mm, 1.6 mm, 2.0 mm and 3.2 mm, adopting high‑performance 6061T6 or 5052H34 aluminum alloy. Well‑known industrial brands such as Panasonic and Sumitomo provide serialized aluminum clad copper materials, with aluminum base thickness steadily covering 1.0 mm to 3.2 mm for standardized mass production.

2. Insulating Layer

The thickness of the intermediate insulating material is controlled within 50 μm to 200 μm. An over‑thick insulating layer enhances dielectric strength and prevents short circuits between the metal base and components, yet restricts heat conduction efficiency. An ultra‑thin insulating layer optimizes heat dissipation performance but raises the risk of electrical breakdown. After anodization and insulation treatment of the aluminum base, the prepreg insulating material is combined with the surface copper foil through high‑pressure lamination, forming an integrated and tightly bonded composite structure.

Aluminum based circuit boards deliver far better dimensional stability than traditional organic insulating substrates. In the temperature range from 30 ℃ to 150 ℃, the dimensional variation rate of aluminum based PCB and aluminum sandwich PCB is controlled between 2.5% and 3.0%, effectively suppressing thermal deformation.

3. Comprehensive Auxiliary Advantages

Aluminum based PCB comes with inherent electromagnetic shielding capability. It can replace fragile ceramic substrates and fully adapt to SMT surface mounting technology, helping reduce product installation space. It also integrates heat dissipation functions to eliminate the need for independent heat sink components, which improves the high temperature resistance and mechanical comprehensive performance of finished products, and effectively controls production and assembly costs.

Core Performance Characteristics

Heat Dissipation

High‑density, high‑power double‑layer and multilayer PCBs are prone to concentrated heat accumulation. Traditional substrates such as FR4 and CEM3 show poor thermal conductivity, resulting in blocked internal heat diffusion and localized overheating, which may cause permanent damage to electronic components. Aluminum based PCB fundamentally solves such heat dissipation bottlenecks with efficient planar heat conduction.

Thermal Expansion Control

All materials produce thermal expansion and contraction under temperature changes, and different materials feature distinct expansion coefficients. With excellent heat exchange capacity, aluminum based PCB can balance the temperature difference of on‑board components, alleviate thermal stress deformation, and improve the long‑term stability and service life of complete equipment. It presents prominent optimization effects especially for SMT mass production applications.

Dimensional Stability

Low thermal expansion characteristics guarantee consistent structural dimensions in alternating high and low temperature environments, meeting the operating requirements of precision electronic modules under complex working conditions.

Product Classification of Aluminum Based Copper Clad PCB

Three major types are divided by material formula and application orientation:

General‑purpose type: The insulating layer adopts epoxy glass cloth prepreg, suitable for conventional low and medium power scenarios.
High heat dissipation type: High thermal conductivity resin composite materials are used for the insulating layer to meet high‑power heat dissipation demands.
High‑frequency dedicated type: Equipped with polyolefin or polyimide glass cloth adhesive materials, applicable to high‑frequency signal transmission circuits.

The most essential performance difference between aluminum based PCB and conventional FR‑4 PCB lies in heat dissipation. For substrates with a unified thickness of 1.5 mm, the thermal resistance of FR‑4 PCB is 20 ℃ to 22 ℃, while the thermal resistance of aluminum based PCB is only 1.0 ℃ to 2.0 ℃, delivering overwhelming advantages in heat conduction and temperature control.

Model : Single side aluminum based PCB

Material : aluminum base

Layer : 1Layers

Color : White/Black

Finished Thickness : 1.2mm

Copper Thickness : 2OZ

Surface Treatment : osp

Thermal Conductivity : 1.0w/m.k

Application : LED pcb board