Name: Rogers RO4350B Microwave RF Printed Circuit Board
Brand: PCB Printed Circuit Board and PCBA manufacturing
Rating: 5 (1 reviews)

Description
Data Sheet

1. Overview of Rogers RO4350B Laminate

Rogers RO4350B is a hydrocarbon/ceramic composite laminate with a dielectric constant (DK) of 3.48, which is specifically designed to meet the performance requirements of printed circuit boards (PCBs) for commercial equipment manufacturers. As a high-performance high-frequency material, it balances excellent electrical properties and processability, making it widely applicable in various commercial and industrial high-frequency scenarios.

2. Material Composition & Core Characteristics

RO4350B adopts a patented hydrocarbon resin system reinforced with ceramic fillers and woven glass cloth. Its electrical performance is highly close to that of PTFE/woven glass cloth materials, while its processability is comparable to that of epoxy resin/glass cloth materials—effectively breaking the balance between high performance and processing convenience of traditional high-frequency materials.

A key advantage of RO4350B lies in its compatibility with standard epoxy/glass cloth processing technologies. It can provide strictly controlled dielectric constant and dielectric loss, while its price is only a fraction of that of traditional microwave materials. Unlike PTFE-based microwave materials, RO4350B does not require special through-hole pretreatment or additional operating procedures, which greatly simplifies the manufacturing process, improves production efficiency, and reduces production costs.

In terms of safety performance, RO4350B material has passed the UL 94V-0 fire rating certification, making it suitable for active equipment and high-voltage RF design scenarios, ensuring the safety and reliability of equipment operation.

3. Core Advantages of RO4350B Laminate

RO4350B integrates multiple performance advantages, which can fully meet the high requirements of high-frequency PCB applications. Its main advantages are as follows:

Low RF loss: Effectively reduces signal attenuation during high-frequency transmission, ensuring signal integrity.
Low dielectric constant fluctuation with temperature: Maintains stable dielectric performance under temperature changes, ensuring the reliability of equipment in different working environments.
Low z-axis thermal expansion coefficient (CTE): Conducive to improving the reliability of plated through-hole (PTH) structures in multi-layer PCBs, reducing the risk of layer separation caused by thermal expansion mismatch.
Low in-plane expansion coefficient: Reduces internal stress of the PCB, improving the structural stability of the board.
Low dielectric constant tolerance: Ensures consistent performance of batch products, facilitating quality control in mass production.
Stable electrical characteristics at different frequencies: Adapts to a wide range of high-frequency scenarios, with strong applicability.
Easy mass production and compatibility with FR4 multi-layer mixing: It can be mixed with FR4 materials for multi-layer PCB manufacturing, with high cost performance and strong practicality.

4. Typical Application Scenarios of RO4350B

Benefiting from its excellent comprehensive performance, RO4350B is widely used in various high-frequency electronic products, including:

Cellular base station antennas and power amplifiers
Microwave point-to-point (P2P) connections
Automotive radar and sensors
Radio Frequency Identification (RFID) tags
Low Noise Block (LNB) for live satellite reception

For more detailed technical parameters and specifications of RO4350B, please refer to the professional technical specification documents.

Rogers RO4350B Technical Specifications

5. RF/Microwave PCB Materials

A complete range of high-performance RF/microwave PCB materials is available to meet diverse application needs, including:

Rogers series: RO4350B, RO3003, RO4003, RO3006, RT/Duroid 5880, RT5870, etc.
Other high-performance materials: Arlon, Isola, Taconic, PTFE F4BM, Teflon, etc.

6. Hybrid PCB Materials (Mixed Dielectric/Laminate)

To meet the complex performance requirements of advanced electronic equipment, hybrid PCB materials (mixed dielectric/laminate) combinations are provided, such as:

Rogers RO4350B + FR4, RO4350B + IT180, RO4003C + FR4, RO3010 + FR4, RO3003 + FR4, etc.

7. RF/Microwave PCB Application Fields

RF/microwave PCBs are widely used in various industries and scenarios, providing stable high-frequency signal transmission support for electronic products. Key application fields include:

Consumer Electronics, Military/Space, High-Power Equipment, Medical Devices, Automotive, and Industrial fields.

8. RF/Microwave PCB Manufacturing Capabilities

8.1 Surface Finishing

OSP, ENIG (Electroless Nickel Immersion Gold), HASL LF (Lead-Free Hot Air Solder Leveling), Plated Gold, Flash Gold, Immersion Tin, Immersion Silver, Electrolytic Gold.

8.2 Manufacturing Capacity

Golden Finger, Heavy Copper, Blind/Buried Via, Impedance Control, Resin Filling, Carbon Ink, Backdrill, Countersink, Depth Drilling, Half-Plated Hole, Pressfit Hole, Peelable Blue Mask, Peelable Solder Stop, Thick Copper, Oversize Processing.

8.3 Material Range

Rogers RO4350B, RO3003, RO4003, RO3006, RT/Duroid 5880, RT5870, as well as Arlon, Isola, Taconic, PTFE F4BM, Teflon and other high-performance materials.

8.4 Number of Layers

2L, 4L, 6L, 8L, 10L, 12L, 14L, 16L, 18L, 20L, 22L, 24L, 26L, 28L, 30L.

8.5 Dielectric Constant (DK) Range

2.20, 2.55, 3.00, 3.38, 3.48, 3.50, 3.6, 6.15, 10.2.

Radio Frequency (RF) microwave PCB application

RF Microwaves PCBs (printed circuit board) are used in various of fields, Such as Consumer Electronics / Military/Space / High power / Medical / Automotive / Industrial ect.

Surface finishing: OSP / ENIG / HASL LF / Plated gold / flash gold / Immersion Tin /Immersion silver/ Electrolytic gold

Capacity: Golden finger / Heavy copper / Blind buried via / impendance control / filled with resion / carbon ink / backdrill / countersink / depth drilling / half plated hole / pressfit hole / peelable blue mask / peelable solderstop / thick copper / oversize

Material: Rogers RO4350B / RO3003 / RO4003 / RO3006 / RT/Duroid 5880 / RT5870 and Arlon / Isola / Taconic / PTFE F4BM / Teflon material etc.

Layer: 2L 4L 6L 8L 10L 12L 14L 16L 18L 20L 22L 24L 26L 28L 30L

Dielectric Constant (DK): 2.20 / 2.55 / 3.00 / 3.38 / 3.48 / 3.50 / 3.6 / 6.15 / 10.2

Model：Immersion Silver Rogers RO4350B Printed Circuit Board
D K：3.48+/-0.05
Layer：2Layers
DielectricsThickness ：1.524mm(60mil)
Finished Thickness ：1.6mm
Material Copper Thickness ：½(17μm)HH/HH
Finished Copper Thickness ：1OZ(35μm)
SurfaceTreatment ：Immersion Silver
Application ：Instrument PCB, Radio Frequency PCB ,Radar Gauges PCB

Rogers RO4350B Microwave RF Printed Circuit Board

Description

Data Sheet