• Rogers RO4350B + FR4 Mixed Dielectrics PCB
  • Rogers RO4350B + FR4 Mixed Dielectrics PCB
  • Rogers RO4350B + FR4 Mixed Dielectrics PCB
  • Rogers RO4350B + FR4 Mixed Dielectrics PCB

Rogers RO4350B + FR4 Mixed Dielectrics PCB

Product Model: RO4350B Ceramic-Filled Hybrid High-Frequency PCB
Material System: Rogers RO4350B + FR4 mixed-dielectric laminate
Layer Count: 4-layer structure
Dielectric Constant (Dk): 3.48 @ 10GHz
Finished Board Thickness: 1.2 mm
Base Copper Thickness: 1 oz (35 μm)
Dielectric Layer Thickness: 0.508 mm
Thermal Conductivity: 0.69 W/(m·K)
Flammability Rating: UL 94 V-0
Surface Finish: Electroless Nickel Immersion Gold (ENIG)
Application: High-frequency PCBs for communication equipment and precision instrumentation
Key Performance Features
  • Low insertion loss and stable dielectric characteristics to ensure stable RF signal transmission
  • Tuned hybrid stack-up design with consistent impedance control for superior signal performance
  • High thermal conductivity delivers efficient heat dissipation and operational stability
  • Outstanding dimensional stability and robust interlayer bonding strength
  • UL 94 V-0 flame-retardant grade, meeting industrial application reliability standards
  • Fully compatible with lead-free soldering processes and high-volume mass production
  • Rogers RO4350B + FR4 Mixed Dielectrics PCB
  • Rogers RO4350B + FR4 Mixed Dielectrics PCB
  • Description

  • Data Sheet

Maxipcb is a leading China-based manufacturer specializing in RF and microwave printed circuit boards with over 17 years of professional manufacturing experience. We recognize that the selection of high-frequency substrate materials directly determines the electrical performance, stability and reliability of RF circuits. Key parameters including operating frequency band, microwave power rating, temperature range, current-carrying capacity and dielectric withstand voltage are rigorously analyzed to provide optimized material solutions for diverse high-frequency PCB applications.
We maintain extensive expertise in RF/microwave substrate properties and maintain sufficient raw material inventory to support rapid turnaround and on-time delivery. Our consistent product quality is backed by a highly experienced engineering team, standardized production management system and strict quality assurance process. High customer satisfaction and continuous repeat orders reflect our reliable performance and long-term service capabilities.
Quality is the core value of our corporate strategy. Over 17 years of development, we have continuously upgraded our manufacturing capacity and technical level through in-depth cooperation with customers worldwide, laying a solid foundation for long-term strategic partnerships.

RF & Microwave PCB Materials

  • Rogers Series: RO4350B, RO3003, RO4003, RO3006, RT/Duroid 5880, RT5870
  • Other High-Frequency Substrates: Arlon, Isola, Taconic, PTFE F4BM, Teflon-based dielectric materials

Hybrid Mixed-Dielectric Laminate Solutions

RO4350B + FR4, RO4350B + IT180, RO4003C + FR4, RO3010 + FR4, RO3003 + FR4, RO3010 + FR4 and custom multilayer hybrid stack-up structures





Surface Finishing Options

OSP, ENIG (Electroless Nickel Immersion Gold), lead-free HASL, hard gold plating, flash gold, immersion tin, immersion silver, electrolytic gold

Special Processing Capabilities

Gold finger, heavy copper circuitry, blind & buried vias, controlled impedance, resin plug vias, carbon ink printing, back drilling, countersinking, depth-controlled drilling, half-plated holes, press-fit holes, peelable blue mask, peelable solder mask, extra-thick copper, oversized board manufacturing

Product Specifications

  • Layer count: 2–30 layers
  • Dielectric constant (Dk): 2.20, 2.55, 3.00, 3.38, 3.48, 3.50, 3.6, 6.15, 10.2

Typical Applications

Consumer electronics, military & aerospace, antenna & communication systems, high-power equipment, medical devices, automotive electronics, industrial control, handheld communication terminals, cellular & Wi-Fi antennas, automotive telematics & infotainment, computer systems, radar systems, power amplifiers and other RF/microwave applications

Model : Ro4350B Ceramic Hybrid High Frequency PCB
Material : Rogers RO4350B+FR4 Mixing Press
Layer : 4L
DK : 3.48
Finished Thickness : 1.2MM
Copper Thickness : 1OZ
Dielectric Thickness : 0.508mm
Thermal Conductivity : 0.69w'm.k
Flammability : 94 V-0
Surface Treatment :lmmersion Gold
Application :Communication Instrument PCB