Rogers RO4350B + FR4 Hybrids Printed Circuit Board

Product Model: Rogers RO4350B + FR4 Hybrid Multilayer PCB

Dielectric Constant (Dk): 3.48 @ 10GHz

Stack-Up Structure: 2-layer RO4350B + 2-layer FR4 mixed dielectric composite construction

Layer Configuration: 4-layer multilayer PCB

Finished Board Thickness: 1.0 mm

Dielectric Layer Thickness: 0.254 mm

Base Copper Foil: ½ oz (18 μm), HH/HH grade

Finished Copper Thickness: 1 oz / 0.5 oz / 0.5 oz / 1 oz

Surface Finish: Electroless Nickel Immersion Gold (ENIG)

Application: RF circuit boards for communication equipment

Key Performance Features

Low insertion loss and stable dielectric properties to guarantee reliable high-frequency signal transmission
Optimized hybrid stack-up design with precise impedance control and outstanding signal integrity
Superior dimensional stability and low Z-axis CTE, ensuring durable and stable via interconnection
Enhanced thermal endurance and anti-warpage performance against repeated thermal cycling
High interlayer bonding strength and excellent process compatibility for standard SMT assembly
Cost-effective hybrid structure, well-suited for mass production of communication devices

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Description
Data Sheet

Maxipcb is a professional RF and microwave PCB manufacturer headquartered in China, with over 17 years of dedicated expertise in the design and fabrication of high-frequency circuit boards. We possess profound understanding of how dielectric material properties directly influence the electrical performance and long-term reliability of RF circuits. Key indicators including operating frequency, microwave power level, temperature range, current-carrying capacity and dielectric voltage endurance are systematically evaluated to deliver optimized material selection for diverse high-frequency PCB applications.

We maintain comprehensive mastery of mainstream RF/microwave substrate characteristics and keep sufficient inventory to support efficient prototype delivery and mass production scheduling. Product quality is safeguarded by our seasoned engineering and manufacturing teams, working in close coordination with a rigorous quality assurance system to ensure consistent conformance to technical specifications. A high rate of recurring customer orders serves as strong validation of our product reliability and service satisfaction.

Quality constitutes the core value of our long-term development strategy. Over 17 years of sustained growth, we have continuously upgraded our manufacturing capabilities and technical processes through in-depth collaboration with global clients, forging stable and win-win cooperative partnerships.

RF & Microwave PCB Materials

Rogers series: RO4350B, RO3003, RO4003, RO3006, RT/Duroid 5880, RT5870
Other high-performance substrates: Arlon, Isola, Taconic, PTFE F4BM, Teflon-based dielectric materials

Hybrid Mixed-Dielectric Stack-Up Solutions

RO4350B + FR4, RO4350B + IT180, RO4003C + FR4, RO3010 + FR4, RO3003 + FR4, RO3010 + FR4 and customized hybrid laminate structures

Typical Applications

Consumer electronics, military and aerospace, antenna and communication systems, high-power equipment, medical devices, automotive electronics, industrial control, handheld communication terminals, cellular & Wi-Fi antennas, automotive telematics and infotainment, computer systems, radar systems, power amplifiers and other RF/microwave modules.

Model : Rogers RO4350B + FR4 Hybrids Printed Circuit Board

DK:3.48

Structure :2Layers rogres ro4350B+2layers Fr4

Layer : 4Layers pcb

Finished Thickness : 1.0mm

Dielectric Thickness : 0.254mm

Material CoThickness :½(18um)HH/HH

Finished Co Thickness : 1/0.5/0.5/1(OZ)

SurfaceTreatment :lmmersion Glod

Application :Communication pcb