Name: Rogers 4003 PCB
Brand: PCB Printed Circuit Board and PCBA manufacturing
Rating: 5 (1 reviews)

Description
Data Sheet

Rogers RO4003C adopts hydrocarbon resin combined with ceramic filler as the core composition, with a fixed dielectric constant of 3.38. As a cost-effective commercial high-frequency substrate in the Rogers 4000 series, it delivers excellent stability and consistent electrical performance. It supports hybrid lamination with FR-4 materials, and RO4450F is the official recommended prepreg for structural bonding.

The maximum operating frequency of Rogers 4003C microwave PCB can reach up to 30GHz, applicable for most mainstream high-frequency scenarios. Its stable low-loss performance can be matched and evaluated via Rogers official MWI2018 impedance simulation software according to product loss tolerance requirements.

As a global leading high-performance material supplier, Rogers provides diversified high-frequency substrates widely deployed in microwave communication, 5G infrastructure, military radar and other high-reliability fields. The 4000 series represented by RO4003C is tailored for RF circuits, impedance matching networks and precision transmission line design.

Core Performance Advantages

Premium High-Frequency Characteristics

RO4003C thermoset laminate serves as an ideal upgraded alternative to ordinary FR-4. It features low dielectric loss, adapts to lead-free soldering processes, and is fully compatible with conventional FR-4 production workflows. It is widely used in compact base stations, antenna systems and IoT wireless devices.

Excellent Heat Dissipation

Its Z-axis thermal conductivity reaches 2.0 W/m·K, 10 times higher than standard FR-4, providing reliable overall heat conduction for multi-layer high-frequency PCBs. The RO4000 series covers a dielectric constant range of 2.55~6.15 with low Z-axis thermal expansion, showing better high-temperature stability than traditional PTFE materials. The upgraded RO4835 adds antioxidant components to achieve 10 times stronger oxidation resistance, suitable for long-term high-temperature operating environments.

Cost-Effective Processing

With outstanding machinability and chemical resistance, RO4003C controls low manufacturing cost while ensuring high reliability. It is compatible with multi-layer mixed pressing with FR-4, eliminating the special hole treatment required for pure PTFE boards, and greatly improving production efficiency for mass orders.

High Mechanical Stability

Belonging to thermoset microwave laminates, it resists cold flow and creep deformation. Multi-layer boards can adopt mixed dielectric stacking without warpage or structural failure. Combined with ultra-low loss parameters, it becomes a mainstream mass-production high-frequency material.

RO4003C Material Features

RO4003C is reinforced by woven glass cloth and patented hydrocarbon ceramic composite formula. Its electrical performance is close to PTFE glass fiber materials, while its processing operability is equivalent to epoxy FR-4. Two glass cloth specifications (1080 / 1674) are available, both meeting unified electrical specifications. With tightly controlled DK and DF parameters, it delivers microwave-level performance at a moderate cost.

Typical Application Fields

Aerospace high-reliability equipment, universal RF microwave modules, 24GHz automotive monitoring radar, base station antennas, satellite communication units and IoT wireless radio frequency systems.

Rogers 4003 PCB Stack-up

Stack-up & Material Comparison: RO4003C VS RO4350B

Fixed dielectric constant: RO4003C (3.38±0.05), RO4350B (3.48±0.05); design DK values differ, and parameters will shift with frequency, requiring targeted simulation.
Non-direct replacement: Different DK and DF values lead to inconsistent 50Ω microstrip line width and increased insertion loss; circuit simulation and layout adjustment are mandatory for material switching.
Performance differentiation: RO4003C has better loss factor and dielectric constant temperature coefficient; RO4350B owns UL certification, which is required for certified projects.
Process difference: RO4003C supports buried board design; qualified mass-produced materials from Rogers Suzhou factory have passed complete electrical, mechanical and thermal certification with stable quality.

Practical Engineering Value

For 24GHz multi-channel vehicle millimeter-wave radar, RO4003C effectively reduces high-frequency loss, boosts antenna gain, expands monitoring range and improves positioning accuracy. Its dielectric loss is as low as 0.0027. Calculated by MWI2018, the total loss of a 0.5mm-thick board at 24GHz is 19.8dB/m. Adopting Rogers LoPro low-roughness copper foil can reduce conductor loss to 2dB/m, further optimizing signal transmission efficiency.

In communication antenna and RF transceiver units, RO4003C lowers transmission attenuation, enhances signal reception gain, suppresses system noise, and stably improves overall equipment operating performance.

Rogers 4003 Datasheet

Professional Manufacturing Service

Maxipcb has long-term stock of Rogers RO4003C substrates and rich experience in high-frequency PCB processing. We provide one-stop customization including hybrid lamination, impedance control, precision routing and special surface treatment, to meet prototype proofing and mass production demands of commercial high-frequency and radar PCBs.

Material: Rogers 4003 material

rogers 4003 dielectric constant: 3.38

Layer: 4003+4450F

rogers 4003 thickness: 0.508mm(20mil)

Finished Thickness: 2.0mm

Rogers 4003 substrate Copper Thickness: 17μm

Finished Copper Thickness: 1OZ

SurfaceTreatment: Immersion Gold

Color:Green /White

Min Trace / Space:6mil/6mil

Features: Rogers PCB,tg280 high temperature resistant PCB

Rogers 4003 PCB

Description

Data Sheet