RO4350B PCB

Product Model: Rogers RO4350B High Frequency Board

Material: Rogers RO4350B substrate

Layer: 2 layers

Dielectric Thickness: 0.254mm - 1.524mm

Dielectric Constant: 3.48

Thermal Conductivity: 0.69w/m.k

Copper Thickness: Base 0.5OZ, Finished 1OZ

Finished Thickness: 0.35mm - 1.7mm

Surface Treatment: Immersion Gold / Immersion Silver

Trace / Spacing: 4mil / 4mil

Description
Data Sheet

RO4350B PCB is a high-frequency substrate manufactured by Rogers. It adopts hydrocarbon ceramic composite laminate as the core material with a stable dielectric constant (DK) of 3.48, serving as a cost-effective mainstream RF microwave PCB material.

Core Advantages of RO4350B

Extremely low dissipation factor (DF) for minimal high-frequency signal loss
Slight dielectric constant fluctuation against temperature changes
Low Z-axis and in-plane thermal expansion coefficient
Tight DK tolerance and consistent batch electrical performance
Stable dielectric characteristics across wide frequency bands
Compatible with FR-4 hybrid multi-layer lamination, suitable for mass production
Balanced high-frequency performance and manufacturing cost with outstanding cost performance

Typical Applications

Cellular base station antennas and power amplifiers, microwave point-to-point (P2P) communication systems, automotive radar and sensors, RFID radio frequency identification tags, and satellite receiving LNB modules.

Key Material Parameters

Fixed Dielectric Constant: Er = 3.48

Standard Dielectric Thickness:

0.101mm (0.004”), 0.168mm (0.066”), 0.254mm (0.010”), 0.338mm (0.0133”), 0.422mm (0.0166”), 0.508mm (0.020”), 0.762mm (0.030”), 1.524mm (0.060”)

Note: The 0.004” specification is not applicable for thick copper foil above 1/2 oz.

Copper Foil Options: 17μm (1/2 oz), 35μm (1 oz), 70μm (2 oz)

Standard Board Sizes: 305×457mm, 610×457mm, 610×915mm, 1224×915mm

Matching Prepreg: RO4450B, RO4450F

RO4350B VS FR-4

In wireless communication equipment, analog RF circuits and digital control circuits often need to be integrated on one single PCB. Conventional FR-4 materials suffer from poor high-frequency stability and serious signal interference when mixed with RF circuits, resulting in abnormal coexistence of digital and radio frequency modules under the same power supply.

As a professional high-frequency material, RO4350B solves such co-design pain points. Within the wide temperature range of -50℃ to 150℃, its dielectric constant fluctuation is only 4‰, ensuring long-term stable operation of communication equipment. Though higher in cost than FR-4, it supports hybrid lamination with FR-4. The optimized design can separate RF circuits on RO4350B area and digital circuits on FR-4 area, which balances performance and cost and meets the miniaturization demand of modern communication devices.

RO4350B Hybrid Stack-up Design

RO4350B can be flexibly combined with FR-4, IT180 and other conventional substrates for mixed dielectric lamination. It retains low-loss high-frequency performance for RF parts and controls overall board cost through low-cost dielectric materials for digital layers, becoming the preferred solution for hybrid RF/digital circuit boards.

Ro4350b PCB stack-up

Maxipcb Manufacturing Strength

With more than 17 years of specialized RF & microwave PCB manufacturing experience, Maxipcb deeply masters the processing technology of high-frequency materials. We fully evaluate key indicators such as operating frequency, temperature range, power load and impedance requirements to select customized high-frequency substrate solutions.

In-Stock RF & High-Frequency Materials

Rogers series: RO4350B, RO4003C, RO3003, RO3006, RT/Duroid 5880, RT5870

Other brands: Arlon, Isola, Taconic

High-frequency dielectric: PTFE F4BM, Teflon series

Hybrid Lamination Capability

RO4350B+FR4, RO4003C+FR4, RO3003+FR4 and other mixed dielectric customized boards

Comprehensive Process & Service

Surface Finishing: OSP, ENIG, lead-free HASL, hard gold plating, flash gold, immersion tin, immersion silver

Precision Processes: Golden finger, heavy copper, blind & buried via, impedance control, resin plug hole, backdrill, countersunk hole, half-plated hole, press-fit hole, peelable solder mask

Layer Range: 2–30 layers

Optional DK Range: 2.20 / 2.55 / 3.00 / 3.38 / 3.48 / 3.50 / 3.6 / 6.15 / 10.2

Wide Application Fields

Consumer electronics, aerospace and military, high-power equipment, medical devices, automotive electronics, industrial control, cellular communication, WiFi antenna, vehicle infotainment, radar systems and power amplifier modules.

We provide RO4350B official datasheet, customized quotation and one-stop high-frequency PCB fabrication service. For technical parameters and mass production consultation, please contact our team.

Model: Rogers RO4350B High Frequency Board

Material: rogers 4350 material

Layer: 2 layer pcb

Rogers 4350 dielectric Thickness: 0.254-1.524mm

Ro4350b dielectric constant: 3.48

Thermal Conductivity : 0.69w/m.k

Copper Thickness: Base 0.5OZ, Finised 1OZ

Finished Thickness: 0.35mm-1.7mm

Surface Treatment: Immersion Gold/Silver

Trace / Spacing: 4mil/4mil