RO4350B + IT180 High Frequency PCB

Product Model: RO4350B + IT180 Mixed-Dielectric High-Frequency Multilayer PCB

Material System: Rogers RO4350B & IT180 hybrid laminated structure

Layer Count: 6-layer

Dielectric Constant (Dk): 3.48 @ 10GHz

Finished Board Thickness: 1.5 mm

Base Copper Thickness: 1 oz (35 μm)

Impedance Control: 50Ω precise controlled impedance

Dielectric Layer Thickness: 0.508 mm

Thermal Conductivity: 0.69 W/(m·K)

Via Structure: L1–L2 HDI blind vias

Surface Finish: Electroless Nickel Immersion Gold (ENIG)

Key Performance Features

Low insertion loss and steady dielectric loss, ensuring stable high-frequency RF signal transmission
Custom hybrid stack-up design with highly consistent impedance performance
Superior thermal conductivity and outstanding thermal cycling reliability
HDI blind via design enables high-density wiring and product miniaturization
High interlayer bonding strength and reliable dimensional stability
Fully adaptable to lead-free SMT assembly and large-scale mass production

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Description
Data Sheet

Maxipcb is a professional manufacturer of RF and microwave PCBs based in China, with over 17 years of dedicated manufacturing experience in high-frequency circuit boards. We recognize that the selection of high-performance dielectric materials directly determines the electrical performance and reliability of RF circuits. Key parameters including operating frequency band, microwave power rating, temperature range, current-carrying capacity and dielectric withstand voltage are fully evaluated to provide the most suitable material solutions for each high-frequency PCB application.

We maintain in-depth professional knowledge of a full range of RF/microwave substrates and keep comprehensive inventory to support rapid prototype delivery and mass production. Our consistent product quality is guaranteed by an experienced engineering team, standardized production system, and strict quality assurance process. High customer satisfaction and continuous repeat orders reflect our stable delivery capacity and reliable product performance.

Quality is the core value of our long-term development strategy. Over the past 17 years, we have continuously upgraded our manufacturing capabilities and technical processes through close cooperation with global customers, establishing a stable foundation for long-term strategic partnerships.

RF & Microwave PCB Materials

Rogers series: RO4350B, RO3003, RO4003, RO3006, RT/Duroid 5880, RT5870
Other high-frequency substrates: Arlon, Isola, Taconic, PTFE F4BM, Teflon-based dielectric materials

Hybrid Mixed-Dielectric Laminate Solutions

RO4350B + FR4, RO4350B + IT180, RO4003C + FR4, RO3010 + FR4, RO3003 + FR4, RO3010 + FR4 and customized hybrid stack-up structures

Surface Finishing Options

OSP, ENIG (Electroless Nickel Immersion Gold), lead-free HASL, hard gold plating, flash gold, immersion tin, immersion silver, electrolytic gold

Special Processing Capabilities

Gold finger, heavy copper circuitry, blind & buried vias, controlled impedance, resin plug vias, carbon ink printing, back drilling, countersinking, depth-controlled drilling, half-plated holes, press-fit holes, peelable blue mask, peelable solder mask, extra-thick copper, oversized board manufacturing

Product Specifications

Layer count: 2–30 layers
Dielectric constant (Dk): 2.20, 2.55, 3.00, 3.38, 3.48, 3.50, 3.6, 6.15, 10.2

Typical Applications

Consumer electronics, military & aerospace, antenna & communication systems, high-power equipment, medical devices, automotive electronics, industrial control, handheld communication terminals, cellular & Wi-Fi antennas, automotive telematics & infotainment, computer systems, radar systems, power amplifiers and other RF/microwave applications

Model : RO4350B +|T180 Mix Laminate High Fequency PCB BoardMaterial : Rogers RO4350B+IT180 Mixing Press

Layer : 6L

DK : 3.48

Finished Thickness : 1.5MM

Copper Thickness : 1OZ

Impedence Control : 50ohm

Dielectric Thickness : 0.508mm

Thermal Conductivity : 0.69w/m.k

Blind Hole : 1L~2L HDI

Surface Treatment : lmmersion Gold

Application : Communication Instrument pcb