Plugged with epoxy resion Multilayer PCB

A double-sided PCB features a dielectric core layer with conductive routing layers on both upper and lower surfaces. In contrast, a multilayer PCB consists of multiple conductive routing layers, with a thin dielectric layer sandwiched between every two adjacent conductive layers. A standard multilayer PCB contains at least three conductive layers—two outer layers and one or more inner layers embedded within the insulating substrate. Electrical interconnection between these layers is typically achieved through plated through-holes (PTHs) fabricated on the PCB cross-section.

1. PCB Signal Layers

Altium Designer supports up to 32 signal layers, including top, bottom, and middle signal layers. Interconnection between these layers can be realized via through-holes, blind holes, or buried holes to ensure reliable signal transmission.

(1) Top Signal Layer

Also referred to as the component layer, this layer is primarily used for mounting electronic components. For both double-sided and multilayer PCBs, the top signal layer can also be utilized for routing and copper pouring to optimize signal integrity and electromagnetic compatibility (EMC).

(2) Bottom Signal Layer

Known as the solder layer, this layer is mainly used for routing and solder joint formation. Similar to the top signal layer, it can also be used for component placement in both double-sided and multilayer PCB designs.

(3) Middle Signal Layers

A maximum of 30 middle signal layers can be configured, which are exclusively used for routing signal lines in multilayer PCBs. These layers are dedicated to signal transmission and do not accommodate power lines or ground lines, ensuring separation of signal and power/ground networks for improved performance.

2. PCB Internal Power Layers

Commonly referred to as inner layers, these are unique to multilayer PCBs. The total number of PCB layers is generally the sum of signal layers and internal power layers. Like signal layers, interconnection between internal power layers, and between internal power layers and signal layers, can be achieved through through-holes, blind holes, or buried holes—ensuring stable power supply and ground connection across the entire PCB. For the precise fabrication of such layer structures and process implementation, Maxipcb provides professional, reliable solutions.

About Maxipcb: As a high-tech enterprise focusing on high-precision PCB fabrication and integrated PCBA solutions, Maxipcb has profound technical accumulation in developing and producing double-sided, multilayer, and epoxy resin plugged PCBs. Adhering to international standards (IPC-A-610, ISO, RoHS, UL), we have established a complete quality control system to ensure product stability and reliability—perfectly matching the technical requirements of PCB layer structure design and process implementation outlined above.

Model :  Plugged with epoxy resion Multilayer PCB

Material :  FR4

Layer :  8Layers

Color : Green/White

Finished Thickness :  1.2mm

Copper Thickness :  1OZ

Surface Treatment :  Immersion Gold

Min Trace :  4mil(0.1mm)

Min Space :  4mil(0.1mm)

characteristic : Plugged with epoxy resion

Application : Plugged with epoxy resion Multilayer PCB