Description
Data Sheet

1. Design Philosophy

In the circuit and PCB design phase, full integration with the manufacturing process is mandatory to avoid non-standard designs that may increase processing difficulty and production costs. Critically, any major redesign or modification of the PCB will render the reliability tests conducted during trial production invalid, as they will no longer reflect the production requirements of the final automotive product. Therefore, design rationality and process compatibility must be prioritized from the initial stage.

2. Core Design Requirements

All components shall be provided with detailed specifications. During circuit design, it is necessary to verify that the devices comply with automotive industry standards (automotive-grade requirements) and that lead-free models are available. In the PCB design process, the soldering temperature profile shall be checked for compliance with production process requirements. If the profile cannot meet the specified standards, the pad size and component packaging must be designed in strict accordance with the recommendations provided by the component manufacturer to avoid processing difficulties caused by non-standard designs.

For chip resistors and capacitors (SMR type), the pad size shall be expanded based on standard specifications; specific dimensions shall refer to the corresponding design documentation. This measure ensures sufficient solder joint strength, which is critical for automotive applications to prevent desoldering and cold soldering caused by long-term vehicle vibration.

Vias and pads for through-hole components shall be designed in accordance with the manufacturer’s specifications. If the specifications do not include relevant dimensions, a written reference size must be requested from the component manufacturer to ensure processing accuracy.

Chip aluminum electrolytic capacitors shall be placed on the side that undergoes only one reflow soldering process. Secondary reflow soldering will cause irreversible damage to the aluminum electrolytic capacitors.

For components processed via reflow soldering, the minimum gap between adjacent components shall be ≥ 0.4mm, calculated based on the outermost dimensions of the components.

The minimum gap between through-hole components and surface-mount device (SMD) components shall be ≥ 3mm to facilitate manual rework soldering or local reflow soldering operations.

Large and heavy components shall be placed on the side that undergoes only one reflow soldering process to prevent component detachment and cold soldering caused by secondary reflow.

No components shall be placed within 5mm of the PCB processing edge, and no test points shall be placed within 3mm of the processing edge. Wiring is permitted in this area, but a protective white glaze shall be applied to the wiring to avoid scratches during the manufacturing process.

The maximum height of components shall be determined based on the capabilities of the processing equipment (e.g., mounter, reflow oven) to prevent processing failures due to excessively high components.

Components within the 10–20mm range near the soldering side shall be arranged as sparsely as possible to avoid insufficient soldering caused by excessive component density.

Large-sized components shall not be placed close to each other, as this will hinder rework operations and cause uneven heating during reflow soldering, leading to poor soldering quality.

Through-hole components shall be placed on the same side of the PCB as much as possible to optimize the manufacturing process efficiency.

Polarized components (e.g., aluminum capacitors, tantalum capacitors, diodes) shall be arranged in the same direction whenever possible to facilitate visual inspection. If this is not feasible due to performance requirements, local alignment shall be implemented to ensure consistency.

Component reference designators (tag numbers) shall be clear and consistent across the entire PCB. Components of the same type shall follow uniform specifications to facilitate rework and testing operations.

The pad size for ICT (In-Circuit Test) shall be 0.99mm. Each circuit network must be equipped with test points, which shall be added during the circuit design phase. If component density in a specific area makes it impossible to place test points, the circuit designer and PCB designer shall jointly evaluate and determine the necessary test points, which shall not be modified arbitrarily.

Components requiring adhesive fixation shall be clearly marked during circuit design, enabling PCB designers and factory processing personnel to pre-plan and implement corresponding fixation measures during design and manufacturing.

The soldering side of manually inserted components shall be marked with white silk screen to clearly indicate the designated soldering area for operators and facilitate visual inspection personnel to quickly locate the areas to be inspected.

The same type of components shall be placed on the same side of the PCB as much as possible. For example, if 10 components of a specific model are required, placing 9 on Side A and 1 on Side B shall be avoided, as this will increase the burden of SMT mounting and dispensing processes.

No components shall be placed within 4mm of the V-CUT edge to prevent component damage during PCB separation.

Connector selection requirements: Connectors shall be designed for easy insertion and extraction to facilitate assembly and maintenance operations.

3. Surface Finishing Options

OSP (Organic Solderability Preservative), Electroless Nickel Immersion Gold (ENIG), Lead-Free HASL (Hot Air Solder Leveling), Electroplated Hard Gold, Flash Gold, Immersion Tin, Immersion Silver, Electrolytic Gold.

4. Manufacturing Capabilities

Gold Finger, Heavy Copper Circuits, Blind/Buried Vias, Controlled Impedance, Resin Plugging, Carbon Ink Printing, Back Drilling, Countersink Drilling, Depth-Controlled Drilling, Semi-Plated Holes (Half-Holes), Press-Fit Holes, Peelable Blue Mask, Peelable Solder Mask, Thick Copper Design, Oversized PCB Manufacturing.

5. Substrate Material Options

Rogers Series: RO4350B, RO3003, RO4003, RO3006, RT/Duroid 5880, RT5870; Arlon, Isola, Taconic Series; PTFE F4BM, Teflon, and other high-performance dielectric materials.

6. PCB Layer Range

2-Layer, 4-Layer, 6-Layer, 8-Layer, 10-Layer, 12-Layer, 14-Layer, 16-Layer, 18-Layer, 20-Layer, 22-Layer, 24-Layer, 26-Layer, 28-Layer, 30-Layer.

7. Dielectric Constant (Dk) Specifications

2.20, 2.55, 3.00, 3.38, 3.48, 3.50, 3.6, 6.15, 10.2.

8. Target Application Fields

Consumer Electronics, Military & Aerospace, Antenna & Communication Systems, High-Power Equipment, Medical Electronics, Automotive Electronics, Industrial Control, Handheld Cellular Devices, WiFi Antennas, Telematics & Infotainment Systems, WiFi/Computing Equipment, Radar Systems, Power Amplifiers.

Model : Multilayer vehicle wifi module pcb

Material : FR4

Layer : 6Layers

Color : Green/White

Finished Thickness : 1.0mm

Copper Thickness : 1OZ

Surface Treatment : Immersion Gold

Min Trace : 3mil(0.75mm)

Min Space : 3mil(0.75mm)

characteristic : Half hole PCB

Application : WiFi Bluetooth Module pcb

Multilayer vehicle wifi module pcb manufacturing

Description

Data Sheet