Multilayer PCB supplier for GPS Module

Product Model: Multilayer Printed Circuit Board for GPS Module Applications

Base Material: FR-4 Glass Epoxy Laminate

Layer Count: 4-layer multilayer structure

Appearance: Green solder mask with white silkscreen

Finished Board Thickness: 1.0 mm

Base Copper Weight: 1 oz (35 μm)

Surface Finishing: Electroless Nickel Immersion Gold (ENIG)

Minimum Line Width: 4 mil (0.1 mm)

Minimum Line Spacing: 4 mil (0.1 mm)

Special Process Features: Semi-plated hole (half-hole) structure

Application: GPS module circuit control board

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Description
Data Sheet

Company Profile

Maxipcb is a professional RF and high-frequency PCB manufacturer based in China with over 17 years of industry experience. We deeply understand that the selection of high-performance RF substrate materials directly determines the electrical performance and stability of the finished circuit board. Key indicators including RF microwave power level, operating frequency band, temperature range, current and voltage parameters are strictly considered in the material selection and high-frequency PCB manufacturing process.

Proficient in the performance and application characteristics of various RF microwave materials, we maintain a rich inventory of mainstream high-frequency substrates to support rapid order response and on-time delivery. Our reliable product quality is guaranteed by an experienced technical team and production personnel, who work closely with the quality assurance department to implement full-process quality control and deliver qualified products consistently.

Customer satisfaction is best reflected in continuous repeat orders rather than mere praise. Quality has always been the core value of the company, as we recognize it as the foundation of long-term business partnerships. We sincerely appreciate the trust and support from global customers over the past 17 years, which has continuously promoted the improvement of our production capacity and technical strength.

Surface Finishing

OSP, Electroless Nickel Immersion Gold (ENIG), Lead-free HASL, Electroplated Hard Gold, Flash Gold, Immersion Tin, Immersion Silver, Electrolytic Gold

Process Capabilities

Gold finger, heavy copper circuit, blind and buried vias, controlled impedance, resin plug hole, carbon ink printing, back drilling, countersink drilling, depth-controlled drilling, semi-plated holes, press-fit holes, peelable blue mask, peelable solder mask, thick copper design, oversized board manufacturing

Special RF & High-Frequency Materials

Rogers RO4350B, RO3003, RO4003, RO3006, RT/Duroid 5880, RT5870; Arlon, Isola, Taconic series; PTFE F4BM, Teflon and other high-performance dielectric materials

Layer Range

2-layer, 4-layer, 6-layer, 8-layer, 10-layer, 12-layer, 14-layer, 16-layer, 18-layer, 20-layer, 22-layer, 24-layer, 26-layer, 28-layer, 30-layer

Dielectric Constant (Dk)

2.20, 2.55, 3.00, 3.38, 3.48, 3.50, 3.6, 6.15, 10.2

Target Applications

Consumer electronics, military & aerospace, antenna & communication systems, high-power equipment, medical electronics, automotive electronics, industrial control, handheld terminals, cellular communication, WiFi antenna, telematics & infotainment, computer equipment, radar systems, power amplifiers

Model : multilayer PCB supplier for GPS Module

Material : FR4

Layer : 4Layers

Color : Green/White

Finished Thickness : 1.0mm

Copper Thickness : 1OZ

Surface Treatment : Immersion Gold

Min Trace : 4mil(0.1mm)

Min Space : 4mil(0.1mm)

characteristic : Half hole PCB

Application : GPS Module pcb