Multilayer golden finger PCB for USB Connector

Product Model: Multilayer Gold Finger PCB for USB Connector Module

Material: FR-4 flame retardant epoxy laminate

Layer: 6-layer multilayer structure

Color: Green solder mask, white silkscreen

Finished Thickness: 1.0 mm (Tolerance: ±0.1 mm)

Copper Thickness: 1 oz (35 μm)

Surface Treatment: Electroless Nickel Immersion Gold (ENIG)

Minimum Trace: 4 mil (0.1 mm, IPC-6012 standard)

Minimum Space: 4 mil (0.1 mm, IPC-6012 standard)

Characteristic: Integrated gold finger structure, applicable for plug-in connection

Application: Dedicated PCB for USB connector assemblies

Description
Data Sheet

Company Profile

Maxipcb has been dedicated to the research, development and manufacturing of RF (Radio Frequency) PCBs in China for over 17 years. With profound industry experience, we fully recognize that the selection of appropriate RF materials is critical to the overall performance of printed circuit boards. When fabricating high-frequency PCBs, key parameters including RF microwave energy levels, operating frequency range, working temperature scope, current rating and voltage tolerance must be taken into comprehensive consideration to ensure optimal material matching.

As a professional RF PCB manufacturer, we possess in-depth expertise in various RF PCB materials. A detailed list of commonly used materials is provided below for your reference. We maintain sufficient inventory of these materials to guarantee rapid order delivery and shorten the production lead time effectively.

Our confidence in product quality stems from our professional engineering and production teams. These teams work closely with our Quality Assurance (QA) department throughout the entire production process, implementing strict quality control measures to ensure that every delivered product meets the specified technical standards and customer requirements. While we do not actively seek public recognition, the continuous increase in repeat orders from our customers is a direct reflection of their satisfaction with our products and services.

Quality is the core value that underpins Maxipcb’s long-term development. We deeply understand the decisive role of product quality in establishing stable and long-term cooperative relationships with customers. Over the past 17 years, we have continuously improved our production capacity and technical capabilities with the support and companionship of our valued customers, for which we express our sincere gratitude.

RF/Microwave PCB Materials

We offer a comprehensive range of high-performance RF/microwave PCB materials, including but not limited to:

Rogers series: RO4350B, RO3003, RO4003, RO3006, RT/Duroid 5880, RT5870
Other mainstream materials: Arlon, Isola, Taconic, PTFE F4BM, Teflon

Hybrid PCB Materials (Mixed Dielectric/Laminate)

To meet diverse application requirements, we provide hybrid PCB solutions with mixed dielectric materials, such as:

Rogers RO4350B + FR4, RO4350B + IT180, RO4003C + FR4, RO3010 + FR4, RO3003 + FR4, RO3010 + FR4, etc.

RF/Microwave PCB Application Fields

RF/microwave PCBs manufactured by Maxipcb are widely applied in various high-end fields, including Consumer Electronics, Military & Aerospace, High-Power Equipment, Medical Devices, Automotive Electronics, Industrial Control, etc.

Surface Finishing Options

We provide a full range of surface finishing technologies to meet different performance and cost requirements, including OSP (Organic Solderability Preservative), ENIG (Electroless Nickel Immersion Gold), LF HASL (Lead-Free Hot Air Solder Leveling), Plated Gold, Flash Gold, Immersion Tin, Immersion Silver, and Electrolytic Gold.

Production Capabilities

Our advanced production equipment and mature technical processes enable us to support the following special PCB manufacturing requirements:

Golden Finger, Heavy Copper, Blind/Buried Vias, Impedance Control, Resin Filling, Carbon Ink Printing, Backdrilling, Countersinking, Depth Drilling, Half-Plated Holes, Press-Fit Holes, Peelable Blue Mask, Peelable Solder Stop, Thick Copper, and Oversize PCB Fabrication.

Key Technical Parameters

Materials: Rogers RO4350B, RO3003, RO4003, RO3006, RT/Duroid 5880, RT5870, Arlon, Isola, Taconic, PTFE F4BM, Teflon, etc.
Layer Count: 2L, 4L, 6L, 8L, 10L, 12L, 14L, 16L, 18L, 20L, 22L, 24L, 26L, 28L, 30L
Dielectric Constant (DK): 2.20, 2.55, 3.00, 3.38, 3.48, 3.50, 3.6, 6.15, 10.2
Extended Application Fields: Consumer Electronics, Military & Aerospace, Antenna & Communications Systems, High-Power Equipment, Medical Devices, Automotive Electronics, Industrial Control, Handheld Cellular Devices, WiFi Antennas, Telematics & Infotainment Systems, WiFi/Computing Equipment, Radar, Power Amplifiers.

Model : Multilayer golden finger PCB for USB Connector

Material : FR4

Layer : 6Layers

Color : Green/White

Finished Thickness : 1.0mm

Copper Thickness : 1OZ

Surface Treatment : Immersion Gold

Min Trace : 4mil(0.1mm)

Min Space : 4mil(0.1mm)

characteristic : golden finger PCB

Application : USB Connector pcb