Hybrid PCB

Description
Data Sheet

Hybrid PCB is a core component widely applied in microwave and RF series products. As electronic communication technology advances rapidly, the demand for high-speed, high-fidelity signal transmission in communication equipment continues to rise, driving the extensive adoption of microwave RF PCBs. The dielectric materials employed in high-frequency hybrid PCBs feature excellent electrical performance and stable chemical properties, which are specifically reflected in the following four aspects:

Low signal transmission loss, short transmission delay, and minimal signal distortion, ensuring high-quality signal transmission in high-frequency scenarios;
Superior dielectric properties, characterized by low relative dielectric constant (DK) and low dielectric loss factor (DF), with stable DK and DF parameters under variations in frequency, humidity, and temperature;
High-precision characteristic impedance control, meeting the strict impedance matching requirements of microwave RF circuits;
Excellent heat resistance (TG value), processability, and environmental adaptability, compatible with mainstream PCB manufacturing processes and complex working environments.

FR4+RO3010 Hybrid PCB board

FR4+RO3010 Hybrid PCB

Microwave high-frequency hybrid PCBs are extensively used in key communication equipment such as wireless antennas, base station receiving antennas, power amplifiers, radar systems, and navigation systems. In the lamination design of high-frequency composite laminates, to achieve cost reduction, bending strength improvement, and electromagnetic interference (EMI) control, it is necessary to adopt high-frequency prepregs with low resin fluidity and FR-4 substrates with smooth dielectric surfaces. However, this design brings significant challenges to the bonding control of products during the pressing process, requiring strict process parameter control to ensure lamination quality.

Manufacturing Method and Characteristics of Microwave High-Frequency Hybrid PCB Stack-Up

A high-frequency hybrid PCB with a controlled-depth composite laminate structure sequentially includes the following layers: L1 copper layer (high-frequency sheet), L2 copper layer (prepreg sheet), L3 copper layer (epoxy resin substrate), and L4 copper layer. Consistently positioned slot holes of the same specification are provided on the L2, L3, and L4 copper layers. On the L4 copper layer, a three-in-one buffer material, steel plate, and kraft paper are stacked sequentially from the inside out; on the L1 copper layer, an aluminum sheet, steel plate, and kraft paper are stacked sequentially from the inside out.

The three-in-one buffer material refers to a buffer medium sandwiched between two release films, which plays a key role in pressure buffering and gap filling during pressing;
The high-frequency sheet adopted in the controlled-depth hybrid high-frequency PCB stack-up is a polytetrafluoroethylene (PTFE) substrate, which ensures excellent high-frequency performance and dielectric stability.

hybrid PCB stack up

The expansion and contraction characteristics of high-frequency hybrid PCB composite laminates differ from those of ordinary epoxy resin substrates, leading to difficulties in controlling board warpage and dimensional shrinkage. The processing method of slotting first and then pressing is prone to sheet depression. To solve this problem, a three-in-one buffer material is arranged on one side of the slot hole; during the pressing process, the buffer material can fill the slot hole, effectively avoiding depression defects. Kraft paper is arranged on both sides of the board to buffer pressure and achieve balanced heat transfer; steel plates are used to ensure uniform heat conduction during pressing, ensuring the flatness of the pressed board and balancing heat and pressure distribution, thereby effectively controlling board warpage and expansion/contraction.

With the rapid development of 5G communication technology, communication equipment has higher requirements for operating frequency, and the types of microwave high-frequency hybrid PCBs on the market are becoming increasingly diverse, putting forward higher standards for manufacturing technology. Maxipcb, with more than 10 years of professional processing experience, provides multi-layer hybrid PCB manufacturing services. The company is equipped with a complete set of equipment required for the entire production process of multi-layer hybrid PCBs, complies with the ISO9001-2000 international standard management system, and has passed IATF16949 and ISO 14001 system certifications. Its products have obtained UL certification and meet the requirements of IPC-A-600G and IPC-6012A standards, providing high-quality, high-stability, and high-adaptability microwave high-frequency hybrid PCB prototypes and batch production services for global customers.

Product Name: Hybrid PCB

Material: Teflon, ceramic + fr4

Quality standard: Maxipcb6012 Class2 or Class3

pcb material dielectric constant: 2.2-16

the texture of material: Hybrid pcb, Mixed PCB

Layers: 2layer - multilayer hybrid PCB

Thickness: 0.1mm - 12mm

Copper thickness: 0.5oz - 3oz

Surface technology: Silver, Gold, OSP

Application: High-frequency microwave hybrid PCB

Hybrid PCB

Description

Data Sheet

FR4+RO3010 Hybrid PCB

Manufacturing Method and Characteristics of Microwave High-Frequency Hybrid PCB Stack-Up