
Product Model: RO4350B High-Frequency Hybrid PCB Material System: Rogers RO4350B & FR4 Composite Laminate (Co-Pressed Structure) Layer Configuration: 6-layer printed circuit board Dielectric Constant (Dk): 3.48 (at 10 GHz, 23°C, per IPC-TM-650 standard) Finished Board Thickness: 1.6 mm Core Dielectric Thickness: 0.762 mm Copper Weight: 1 oz (35 μm) Thermal Conductivity: 0.69 W/(m·K) (25°C, typical value) Flammability Rating: UL 94 V-0 Surface Finish: Immersion Gold (ENIG), ensuring excellent solderability and corrosion resistance Target Application Fields: Communication Equipment, Industrial Instrumentation, Radio Frequency (RF) PCB Assemblies
Designed for engineers and manufacturers specializing in RF and microwave applications, the Rogers 4350B Hybrid PCB delivers a reliable platform combining Rogers RO4350B and FR4 laminates. This product targets users requiring stringent impedance control and thermal management in complex electronic assemblies. It supports design verification by providing a stable dielectric environment, which directly benefits clients who rely on specialized pcb prototype service for testing. These characteristics make it highly applicable in communication systems requiring precise signal integrity and robust component integration.
This high-frequency PCB features a 6-layer co-pressed structure utilizing Rogers RO4350B and FR4 composite laminates, with a dielectric constant of 3.48 at 10 GHz ensuring controlled impedance. Its typical thickness of 1.6 mm and copper weight of 1 oz (35 碌m) optimize signal transmission while the Immersion Gold (ENIG) finish enhances solderability and corrosion resistance. Thermal conductivity measured at 0.69 W/(m路K) supports heat dissipation, meeting UL 94 V-0 flammability standards. The combined technical features establish it as a robust solution within pcb assembly manufacturer frameworks focused on high-frequency pcb solutions.
Utilized across telecommunications, industrial instrumentation, and vehicle tracking systems, the Rogers 4350B Hybrid PCB enables high-reliability RF circuit performance. Its design accommodates integration into complex communication modules and GPS navigation circuits where stable impedance and heat management are critical. This product stands as a key component within pcb solutions portfolios aimed at improving system integration, reliability, and durability in demanding operational environments. It supports manufacturers who require consistent quality and adherence to industry standards in their product offerings.
The Rogers 4350B Hybrid PCB employs a co-pressed laminate design that synergizes the high-frequency properties of Rogers RO4350B with the cost-effectiveness and mechanical strength of FR4. This 6-layer configuration offers optimal layer stack flexibility and controlled dielectric thickness, facilitating fine impedance matching essential in RF circuit design. The integration of an Immersion Gold (ENIG) surface finish enhances both durability and solderability, critical factors acknowledged by pcb assembly services providers. This product's design supports scalable customization and efficient manufacturing workflows typical for advanced custom pcb assembly projects.
Providing consistent electrical characteristics under thermal stress, this PCB guarantees stable high-frequency signal transmission and effective thermal management, key to maintaining long-term operational reliability. Its compatibility with IPC standard production processes ensures seamless integration into existing assembly lines, benefiting procurement teams and engineers utilizing pcb prototype service to validate performance before large-scale production. The balance between performance and cost optimizes ROI for manufacturers investing in high-frequency pcb solutions requiring both precision and reliability.
Model: Ro4350B Hybrid High Frequency PCBMaterial: Rogers RO4350B+FR4 Mixing Press
Layer: 6L
D K: 3.48
Finished Thickness:1.6MM
Copper Thickness:1OZ
Dielectric Thickness:0.762mm
Thermal Conductivity: 0.69w/m.k
Flammability:94y-0
Surface Treatment: lmmersion Gold
Application: Communication,Instrumentation, Radio Frequency PCB
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