8L Multilayer Rigid-Flex PCB(R-FPCB) Manufacturer in China

Product Model: 8Layers Rigid-Flex PCB

Material: FR-4 + PI

Layer Structure: 4 Rigid Layers / 4 Flexible Layers

Solder Mask: Green / White

Finished Thickness: 1.0mm

Copper Thickness: 1oz

Surface Treatment: Immersion Gold

Gold Thickness: 3U

Min. Trace / Space: 4mil/4mil

Application: Communication Equipment

Description
Data Sheet

1. R-FPCB Definition & Structural Features

The development of FPC (Flexible Printed Circuit Board) and PCB (Rigid Printed Circuit Board) has promoted the emergence of Rigid-Flex PCB (R-FPCB). As a composite circuit substrate, R-FPCB integrates the characteristics of both FPC and PCB, formed by laminating flexible and rigid circuit boards through professional processes in accordance with relevant technical requirements.

2. R-FPCB Advantages & Disadvantages

2.1 Core Advantages

Integrating the merits of FPC and PCB, R-FPCB is applicable to products with special structural requirements. It features both flexible and rigid areas, which effectively saves internal product space, reduces finished product volume, and enhances overall product performance.

2.2 Technical Disadvantages

R-FPCB has complex manufacturing processes, high production difficulty, low yield rate, and high material and labor consumption, resulting in relatively high unit price and long production cycle.

3. R-FPCB Application Scenarios

R-FPCB is widely used in consumer electronics and related fields, including mobile phone PCBs, keyboard PCBs, side button PCBs, computer PCBs, LCD screen PCBs, mainboard PCBs, display PCBs, disk drive PCBs, notebook PCBs and hard disk drive PCBs.

4. Maxipcb Core Technical Capabilities

4.1 Surface Finishing Solutions

Maxipcb provides a full range of surface finishing options to meet the reliability and soldering requirements of high-end PCBs (including R-FPCB and RF/microwave PCB), including OSP, ENIG (Electroless Nickel Immersion Gold), lead-free HASL (Hot Air Solder Leveling), full-plate gold plating, flash gold, immersion tin, immersion silver and electrolytic gold.

4.2 Key Manufacturing Capabilities

The company has comprehensive high-precision processing capabilities, covering golden finger fabrication, heavy copper production, blind/buried via processing, precision impedance control, resin plug hole, carbon ink printing, backdrilling, countersink hole, depth-controlled drilling, half-plated hole, press-fit hole, peelable blue mask, peelable solder stop, thick copper manufacturing and oversized PCB production, fully supporting customization needs of high-end PCBs.

4.3 Layer & Dielectric Constant (DK)

Layer coverage: 2L~30L, supporting flexible customized layer design for high-density, high-frequency and miniaturized application requirements. Customizable DK: 2.20, 2.55, 3.00, 3.38, 3.48, 3.50, 3.6, 6.15, 10.2, matching the electrical performance requirements of high-end PCBs to ensure stable signal transmission.

5. Maxipcb Enterprise Advantages & Service Commitment

With over 17 years of RF PCB manufacturing experience, Maxipcb is committed to building an Industry 4.0 smart PCB factory under the "Internet +" strategy, and has independently developed an industry-leading automatic PCB quotation and ordering system. The company implements Total Quality Management (TQM), holds UL, ISO9001 and SGS RoHS certifications, and provides global customers with professional technical support and one-stop production services.

Backed by professional material expertise, sufficient inventory support and strict quality control, Maxipcb has established long-term cooperative relationships with global customers, and continuously improves technological capabilities to deliver stable, high-performance PCB solutions.

Model : 8Layers Rigid-Flex PCB

Material : FR-4 + PI

Layer : Rigid 4L / Flex 4L

Color : Green/White

Finished Thickness : 1.0mm

Copper Thickness : 1OZ

Surface Treatment : Immersion Gold

Gold thickness 3U

Min Trace / Space : 4mil/4mil

Application : Communication