12OZ Heavy Copper PCB for power supply

Product Model: 12oz Heavy Copper Printed Circuit Board for Power Supply Applications
Base Material: FR-4 Glass Epoxy Laminate
Layer Structure: 2-layer
Solder Mask Color: Black / White
Board Finished Thickness: 2.0 mm
Base Copper Weight: 1oz
Surface Finish: Electroless Nickel Immersion Gold (ENIG)
Minimum Trace Width: 40mil (1.0mm)
Minimum Trace Spacing: 40mil (1.0mm)
Product Feature: Heavy copper structure design, applicable for 2oz heavy copper PCB requirements
Typical Application: Power supply circuit boards

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Description
Data Sheet

Heavy copper printed circuit boards are constructed by bonding high‑conductivity copper foils to glass‑epoxy dielectric substrates. In accordance with common industry definitions and IPC specifications, PCBs with a copper thickness of 2oz (approximately 70μm) or greater are generally categorized as heavy copper PCBs.

Material & Performance Characteristics

Heavy copper PCBs offer excellent ductility and formability, with processing stability across a wide temperature range. They support high‑temperature oxygen‑blowing processes at elevated melting points and maintain structural integrity under low‑temperature conditions.

The substrate and copper assembly exhibits outstanding flame resistance and is classified as a non‑combustible structural material. When exposed to highly corrosive atmospheric environments, the copper surface forms a dense, non‑toxic passivation layer, providing long‑term anti‑corrosion protection and enhanced reliability in harsh operating conditions.

Application Advantages

Heavy copper PCBs are widely adopted in power supply systems, industrial control, automotive electronics, medical devices, home appliances, and high‑end electronic equipment.

By utilizing heavy copper structures, electronic assemblies achieve improved current‑carrying capacity, enhanced heat dissipation, and extended service life. The design also supports higher integration and miniaturization of end products while maintaining mechanical robustness and electrical stability.

Manufacturing Process & Technical Barriers

The production of heavy copper PCBs involves specialized electroplating, etching, and lamination processes with high technical thresholds and strict process control requirements. Due to its complexity, relatively high material cost, and demanding manufacturing conditions, heavy copper boards are often limited or avoided by general PCB manufacturers.

Maxipcb Manufacturing Capabilities

Maxipcb is a professional provider of global PCB prototyping and medium‑volume production services, focusing on high‑precision boards, special structures, and customized processes to resolve industry pain points in difficult‑to‑fabricate PCB applications.

We support a full range of special processes including heavy copper plating, multilayer special stack‑up structures, electroless nickel immersion gold (ENIG), gold fingers, special‑shaped vias, and controlled‑depth routing. Our production efficiency enables lead times approximately one‑third shorter than standard manufacturers.

Key Capabilities for Heavy Copper PCB

Layer count: 2–16 layers (orders above 6 layers require engineering review)
Maximum copper weight: up to 40oz
Minimum via aperture: 0.1mm – 0.6mm
Compliant with IPC‑6012, UL94 V‑0, RoHS and REACH requirements

We welcome customers to consult for customized heavy copper PCB solutions.

Model : 12OZ Heavy Copper PCB for power supply

Material : FR4

Layer : 2Layers

Color : Black/White

Finished Thickness : 2.0mm

Copper Thickness : 1OZ

Surface Treatment : Immersion Gold

Min Trace : 40mil(1mm)

Min Space : 40mil(1mm)

characteristic : 2OZ Heavy Copper PCB

Application : power supply pcb