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Power Integrity and PDN Design for PCB Routing
2026-04-28
SI (Signal Integrity) focuses on the waveform quality of signals, while PI (Power Integrity) focuses on the waveform quality of power supplies. The research object of PI is PDN (Power Distribution Network), which studies power issues from a more systematic perspective, eliminates or mitigates power noise, meets the load demand for current at different frequencies, and provides clean, stable and reliable power for loads.
Why Should Series Termination Resistors Be Placed Close to the Transmitter for Impedance Matching on Transmission Lines
2026-04-28
During impedance matching, a series termination resistor can be placed at the signal source. However, due to space constraints, the resistor may be placed slightly farther away. This raises a common question: if the resistor is placed far from the transmitter or at the receiver, can it still eliminate reflections on the transmission line? The following simulation results verify this.
Key Points of LDO PCB Layout and Routing
2026-04-28
LDO stands for Low Drop-Out, also known as a low-dropout regulator. It is an electronic component mainly used to step down high voltage to a lower voltage and provide stable power supply. An LDO module usually consists of a DC voltage regulator and a current amplifier. Its working principle is to create a stable voltage difference between the input and output to ensure the output voltage stays within a reliable range.
Brief Discussion on PCBs and Circuit Anti-Interference Measures
2026-04-28
A Printed Circuit Board (PCB) is the support for circuit components and devices in electronic products. It provides electrical connections between circuit components and devices. With the rapid development of electronic technology, the density of PCBs has become increasingly high. The quality of PCB design has a significant impact on anti-interference capability.
Mastering Analysis Methods for Electrostatic Discharge (ESD) Issues
2026-04-28
The interference mechanism and coupling paths of electrostatic discharge have been analyzed in depth previously. From now on, we will enter the next highly concerned section: Analysis and Debugging of Electrostatic Discharge Issues. Mastering the analysis methods for ESD problems allows rapid localization of sensitive equipment or coupling paths, achieving twice the result with half the effort.
EMI Layout Scheme for PCB Design in DC-DC Conversion
2026-04-27
DC-DC converters enable efficient power conversion and power supply at various voltage levels. However, with rising demands for higher power density, higher efficiency, and smaller form factors, PCB design for DC-DC conversion has become increasingly critical.
Brief Discussion on Four Types of Interference in PCB Design
2026-04-27
In electronic system design, PCB design is a core link that determines the overall anti-interference performance of the circuit. Unreasonable layout and routing will introduce various interference problems, affect signal integrity, and even lead to abnormal operation of electronic equipment. This article analyzes four common interference forms in PCB design and corresponding optimization design schemes.
Manufacturing Process of Multilayer Ceramic Capacitors (MLCC)
2026-04-27
This article is based on a 2-minute-41-second video from Murata, introducing the complete manufacturing process of Multilayer Ceramic Capacitors (MLCC).
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