Name: Teléfono móvil HDI PCB
Brand: PCB Printed Circuit Board and PCBA manufacturing
Availability: InStock
Rating: 5 (1 reviews)

Description
Data Sheet

A scientific and reasonable lamination design is the foundation for realizing high-performance PCB products. With the increasingly fierce competition in the mobile phone market, cost control has become a core factor for enterprise survival—especially for entry-level cost-effective mobile phones. 6-layer first-order HDI PCB, with its relatively simple production process, controllable process parameters and cost advantage, has become the preferred solution for such products. This document focuses on the definition, classification, manufacturing process of HDI PCB, and details the technical points of 6-layer first/second-order HDI, combined with Maxipcb®'s product advantages and quality assurance system.

1. HDI PCB Definition & Core Technical Indicators

HDI (High-Density Interconnect) PCB refers to a high-precision multilayer PCB manufacturing technology that adopts non-mechanical drilling methods, with micro-blind hole ring width up to 6 mils, inner-outer layer wiring width and spacing less than 4 mils, and pad diameter less than 0.35mm. It is mainly used in compact electronic products such as mobile phones, realizing high-density interconnection between components and optimizing product miniaturization design.

HDI PCB

2. Key Terminology Definition for HDI PCB

Blind Hole: A via that connects and conducts the outer layer and the inner layer (without penetrating the entire board). It is a small-diameter via with a diameter ranging from 0.05mm to 0.15mm, mainly formed by laser drilling, plasma etching or photo-induced drilling. Among them, laser drilling is the most commonly used process, which is divided into CO₂ laser drilling and YAG (UV) laser drilling according to the laser type.
Buried Hole: A via that realizes interconnection between inner layers (not connected to any outer layer), with a larger diameter than blind holes, and is also formed by laser drilling or other precision drilling processes.

3. HDI PCB Level Classification & 6-Layer HDI Technical Details

HDI PCB is classified by the number of laser drilling and lamination cycles, and 6-layer HDI PCB is mainly divided into first-order and second-order types, which are widely used in mobile phone motherboards and other products that require high-density interconnection.

3.1 6-Layer First-Order HDI PCB

The blind hole distribution of 6-layer first-order HDI PCB is: 1-2 layers, 2-5 layers, 5-6 layers. Among them, the 1-2 layer and 5-6 layer vias need to be processed by laser drilling, while the 2-5 layer vias can be completed by conventional drilling. The production process of first-order HDI is relatively simple, the process parameters are easy to control, and the production cost is relatively low, which is suitable for cost-sensitive products such as entry-level mobile phones.

3.2 6-Layer Second-Order HDI PCB

The blind hole distribution of 6-layer second-order HDI PCB covers 1-2 layers, 2-3 layers, 3-4 layers, 4-5 layers, 5-6 layers, which requires two laser drilling and two lamination processes. The specific process flow is as follows:

First, drill 3-4 layer buried holes;
Perform the first lamination to form 2-5 layer core board;
Conduct the first laser drilling to process 2-3 layer and 4-5 layer blind holes;
Perform the second lamination to form 1-6 layer complete board;
Conduct the second laser drilling to process 1-2 layer and 5-6 layer blind holes;
Finally, drill through holes (if needed) to complete the whole board processing.

According to the blind hole distribution, 6-layer second-order HDI PCB is further divided into two types:

Second-Order Staggered HDI PCB: Blind holes of adjacent layers (such as 1-2 layers and 2-3 layers) are arranged in a staggered manner without overlapping, which is relatively simple in process control.
Second-Order Stacked HDI PCB: Blind holes of adjacent layers (such as 1-2 layers and 2-3 layers) are stacked and overlapped, such as blind hole distribution of 1-3 layers, 3-4 layers and 4-6 layers. This type has higher density but higher process difficulty.

It should be noted that the classification logic of third-order, fourth-order and higher-order HDI PCB is consistent with the above, which is realized by increasing the number of laser drilling and lamination cycles, and is mainly used in ultra-high-density electronic products.

4. Core Product: Maxipcb AnyLayer HDI PCB for Android Mobile Phones

Focusing on the development trend of miniaturization and high integration of mobile electronic products, Maxipcb® has independently developed AnyLayer HDI PCB specially for Android mobile phones. The product adopts advanced laser drilling, sequential lamination and via filling technologies, which effectively improves the circuit density and signal integrity, meets the high-performance requirements of Android mobile phone motherboards for compact layout, stable signal transmission and low power consumption, and provides reliable technical support for the upgrading of mobile electronic products.

5. Maxipcb HDI PCB Core Advantages

As a core product of Maxipcb®, HDI PCB has obvious comprehensive advantages in performance, cost and applicability, which are specifically reflected in:

Cost Optimization: For PCBs with more than 8 layers, the manufacturing cost of HDI technology is lower than that of traditional complex lamination processes, helping customers reduce overall procurement costs.
High Integration: Effectively improves the interconnection efficiency between circuit boards and components, realizes higher integration, and meets the miniaturization needs of electronic products such as mobile phones.
Advanced Process Compatibility: Compatible with advanced processes such as stacked vias and laser direct drilling, providing technical support for the design and production of high-end electronic products.
Superior Electrical Performance: Compared with standard PCB, it has better electrical performance and signal integrity, ensuring stable signal transmission in high-frequency and high-speed scenarios.
High Reliability: The optimized structure and strict production control ensure stable operation in harsh working environments such as high temperature, high humidity and strong interference.
Improved Thermal Performance: Enhanced heat conduction efficiency effectively reduces the risk of overheating of high-power components, extending the service life of electronic products.
EMC Optimization: Effectively improves the resistance to radio frequency interference (RFI), electromagnetic interference (EMI) and electrostatic discharge (ESD), meeting the electromagnetic compatibility requirements of high-end electronic products.

6. Maxipcb Quality Assurance System

6.1 Quality Policy

Maxipcb takes product quality as the core of enterprise development, focuses on details, adheres to the quality policy of "taking quality as the core inspection point, starting from details, manufacturing high-quality products, and providing customers with satisfactory products and services", and implements this policy in every link of R&D, production and service.

6.2 Quality Targets

On-time delivery rate: 100%
Production qualification rate: 98%
Finished product inspection rate: 99%

6.3 Service Targets

Customer satisfaction rate: 99.9%
Customer complaint rate / return rate: 0.5% / 0.5%
Customer complaint handling standards:
- Response time: within 1 hour
- Processing time: within 4 hours

6.4 Document Review Process

Maxipcb has established a strict customer document review mechanism. We conduct detailed engineering review on all customer-provided design documents, technical requirements and other information, timely identify and solve potential problems in the design and production process, and put forward reasonable optimization suggestions based on our rich manufacturing experience, to avoid production risks and ensure the smooth progress of the production process.

6.5 Product Inspection Process

To ensure product quality, Maxipcb® implements full-process inspection control, covering three key links:

Incoming material inspection: All raw materials must pass strict inspection before warehousing; unqualified raw materials are rejected and returned to ensure the quality of the source.
Tooling fixture inspection: All tooling fixtures used in production are inspected by professional departments; only qualified fixtures can be put into use, and unqualified fixtures are rejected and returned for maintenance or replacement.
Production process inspection: Each process product must pass the inspection before entering the next process; at the same time, patrol inspection is added during the production process to timely find and correct potential quality problems, ensuring the stability of product quality in the whole process.

6.6 Product Acceptance Standards

Maxipcb strictly implements international and industry authoritative acceptance standards to ensure that products meet the highest quality requirements. The specific acceptance standards are as follows:

IPC-A-600G Standard (PCB Acceptance Quality Level, AQL)
IPC-6018A Standard (High-Frequency PCB Acceptance Standard)
GJB326A-96 Military Standard (for military-grade PCB products)

7. HDI PCB Manufacturing & Cooperation Guidelines

Maxipcb® suggests that customers consult with our technical team before finalizing the HDI PCB stack-up design or starting the layout, to ensure that the design scheme complies with our Design for Manufacturability (DFM) guidelines. As a professional HDI PCB manufacturer, we have rich experience in high-precision HDI PCB manufacturing and assembly, and can produce ultra-thin, high-density multi-layer HDI PCBs. Close communication between customers and our team can effectively reduce manufacturing costs, avoid process risks, and ensure the quality and delivery cycle of PCB products.

8. About Maxipcb

Maxipcb is a professional PCB manufacturer rooted in China, focusing on the R&D and production of high-precision PCB products. We have a complete product system, strict quality control system and professional technical service team, and are committed to providing customers with high-quality, cost-effective PCB products and intimate technical support. If you need a quotation for any PCB product or have related technical consulting needs, please feel free to send us an email, and our team will reply to you in a timely manner.

Model: HDI PCB mobile phone

Layer: 60 layers

Material: Sy s1000 - 2

Construction: 1 + 4 + 1 first order HDI

Finished product thickness: 0,8 mm

Copper Thickness: 0.5 Oz

COLOUR: green / white

Surface treatment: gold immersion

Tracking / minimum spacing: 3mil / 3mil

Application: HDl PCB board for mobile phones

Teléfono móvil HDI PCB

Description

Data Sheet