Taconic RF-35 PCB Board

1. Real Project Display of Taconic RF-35 PCB

2. Core Benefits of Taconic RF-35

• Low cost: It has obvious cost advantages compared with other high-frequency materials, which is suitable for high-volume commercial production and helps reduce the overall manufacturing cost of products.
• Excellent peel strength: Even when using standard epoxy materials, the 1/2OZ and 1OZ copper foil boards of RF-35 still have excellent peel strength (1/2OZ copper ≥8.0 lbs/linear inch, 1OZ copper ≥10.0 lbs/linear inch), and can be reworked at any time, improving production efficiency and reducing scrap rate.
• Exceptionally low DF: The dielectric loss factor (DF) is as low as 0.0018 (measured at 1.9GHz), which effectively reduces signal attenuation during high-frequency transmission and ensures signal integrity.
• Low moisture absorption: The moisture absorption rate is only 0.02% (for 0.060" thick boards), which can avoid performance degradation caused by moisture absorption, ensuring stable operation of PCBs in various environments.
• Very high thermal reliability: The glass transition temperature (Tg) exceeds 315℃, with excellent high-temperature stability, adapting to the high-temperature working environment of high-power electronic devices and ensuring long-term reliable operation.

3. Key Material Characteristics of Taconic RF-35

1. RF-35 is an organic ceramic laminate material belonging to Taconic’s ORCER product series, integrating the advantages of organic materials and ceramic materials.
2. It is a glass-reinforced material based on glass fiber cloth, which is a perfect combination of Taconic’s advanced ceramic filling technology and glass fiber-coated Teflon (PTFE) PCB technology, balancing mechanical strength and high-frequency performance.
3. RF-35 is specially designed for low-cost, high-volume commercial microwave and wireless frequency applications, and is recognized as the best material choice in such scenarios due to its cost-performance ratio.
4. The glass transition temperature (Tg) of RF-35 exceeds 315℃, which endows it with excellent high-temperature resistance and thermal reliability, meeting the working requirements of high-power high-frequency devices.
5. RF-35’s ultra-low moisture absorption and low dielectric loss factor effectively minimize the phase shift in the working frequency range, ensuring stable signal transmission and reducing signal distortion.
6. The use of glass fiber cloth in the design and development of RF-35 ensures excellent dimensional stability of the material, avoiding board warpage during processing and use, and ensuring the accuracy of component mounting.
7. Taconic RF-35 Teflon PCB materials are generally clad with 1/2OZ (17μm), 1OZ (35μm) and 2OZ (70μm) thick electrolytic copper foil on single or double sides, and plates of different sizes and thicknesses (0.254mm, 0.508mm, 0.762mm, 1.524mm, etc.) can be selected according to actual project requirements.
8. Taconic RF-35 boards with 1/2OZ and 1OZ copper foil have excellent peel strength even when using standard epoxy materials, and can be reworked at any time, which is convenient for production and maintenance and reduces production costs.
9. It can be processed by standard epoxy/glass methods, avoiding the need for sodium naphthalene treatment and special drilling procedures, which is consistent with the processing process of ordinary FR-4 PCBs, greatly reducing processing difficulty and improving production efficiency.