Name: Smart Phone Main board PCB
Brand: PCB Printed Circuit Board and PCBA manufacturing
Availability: InStock
Rating: 5 (1 reviews)

Description
Data Sheet

1. Lead Time for Smartphone Motherboard HDI PCB

For 12-layer 3-level HDI PCB used in smartphone motherboards, the prototype lead time is 15–18 working days, and mass production lead time is 15–25 working days. Delivery schedules for special multilayer or customized PCB shall be confirmed through separate technical negotiation. Maxipcb supports rapid prototyping services for smartphone motherboard HDI PCB, with an expedited lead time as fast as 7 working days for 12-layer 3-level HDI products.

For more details about Maxipcb’s HDI PCB process capabilities, please refer to the HDI PCB Process Capability documentation.

2. Core Product: AnyLayer HDI PCB for Android Smartphones

In response to the miniaturization and high-integration trend of mobile electronic products, Maxipcb® has independently developed AnyLayer HDI PCB dedicated to Android smartphone motherboards. Adopting advanced laser drilling, sequential lamination and via-filling technologies, the product significantly improves circuit density and signal integrity, meeting the high-performance requirements of smartphone motherboards for compact layout, stable signal transmission and low power consumption, while supporting the continuous upgrading of mobile smart devices.

3. Company Overview

Maxipcb Circuits Limited (Maxipcb®) is a high-tech enterprise specializing in R&D and manufacturing of high-precision PCB prototypes. The company independently developed the industry’s first PCB Automatic Quotation System (PAQS), enabling intelligent interconnection with production bases to realize efficient intelligent services and rapid prototype manufacturing. With the vision of building an “Internet + Industry 4.0” intelligent PCB manufacturing cluster, Maxipcb is committed to providing global customers with professional PCB technical support and reliable manufacturing services.

4. Product Portfolio

Maxipcb® provides a full range of high-precision PCB products, including:

Microwave RF PCB & hybrid high-frequency PCB
Multilayer PCB (1–70 layers)
HDI PCB, rigid-flex PCB, metal-based PCB & ceramic PCB

The company also possesses mature R&D and manufacturing capabilities for special-process PCBs, including blind/buried via PCB, back-drilled PCB, step-slot PCB, IC carrier PCB and ultra-thick copper PCB.

5. HDI PCB Core Advantages

Cost Efficiency: For PCB designs over 8 layers, HDI technology offers lower manufacturing costs compared with traditional complex lamination processes.
High Integration: Improved interconnection efficiency and higher wiring density to meet the miniaturization requirements of electronic products.
Advanced Process Compatibility: Supports stacked vias, laser direct drilling and other high-end manufacturing processes.
Superior Electrical Performance: Excellent signal integrity and transmission stability for high-speed and high-frequency applications.
High Reliability: Stable operation in harsh environments including high temperature, high humidity and strong electromagnetic interference.
Enhanced Thermal Performance: Efficient heat conduction reduces overheating risks of high-power components.
Strong EMC Performance: Effectively suppresses RFI, EMI and ESD, meeting strict electromagnetic compatibility requirements.

6. Quality Assurance System

Quality Policy

Centered on product quality and refined process control, Maxipcb® adheres to the policy of focusing on details, producing high-quality products, and providing customers with satisfactory products and services throughout R&D, production and service.

Quality Targets

On-time delivery rate: 100%
Production qualification rate: 98%
Finished product inspection pass rate: 99%

Product Acceptance Standards

Products are manufactured and inspected in strict accordance with authoritative international and industrial standards:

IPC-A-600G (PCB Acceptance Quality Level, AQL)
IPC-6018A (High-Frequency PCB Acceptance Standard)
GJB326A-96 (Military PCB Standard)

Full-Process Inspection Control

Incoming Material Inspection: Raw materials are inspected before warehousing; non-conforming materials are rejected and returned.
Tooling & Fixture Verification: Production tooling is professionally inspected; only qualified fixtures are put into use.
In-Process Inspection: Products pass inspection before entering the next process, supported by regular patrol inspection to ensure stable process quality.

7. Customer Service System

Service Targets

Customer satisfaction rate: 99.9%
Customer complaint rate / return rate: 0.5% / 0.5%
Complaint response: response within 1 hour, processing within 4 hours

Engineering Document Review

Maxipcb® implements a strict engineering document review mechanism. Professional engineers conduct detailed checks on customer design files and technical requirements, identify potential manufacturability risks in advance, and provide optimized suggestions to ensure smooth production.

8. HDI PCB Design & Cooperation Guidelines

To ensure manufacturability and cost-effectiveness, customers are recommended to consult Maxipcb’s technical team before finalizing HDI stack-up and layout design to comply with DFM guidelines. With rich experience in high-precision HDI manufacturing, Maxipcb supports ultra-thin, high-density multilayer HDI PCB production. Close technical communication helps reduce costs, avoid process risks, and guarantee product quality and on-time delivery.

9. Business Contact

Maxipcb® is a professional high-precision PCB manufacturer with a complete product system, strict quality control system and professional technical team, dedicated to providing customers with high-quality, cost-effective PCB products and full-process support.

For PCB quotations or technical consulting, please contact us via email, and our team will respond promptly and professionally.

Model : Smart Phone Main board PCB

Layers : 12Layers

Material : IT180A TG170 FR4

Construction : 3+6+3 HDI PCB

Finished Thickness：1.0mm

Copper Thickness : 0.5OZ

Color : Blue/White

Surface treatment: Immersion gold

Min Trace / Space：2.5mil/2.5mil

Application : Smart phone main board PCB

Smart Phone Main board PCB

Description

Data Sheet