Name: SiP Package Substrate
Brand: PCB Printed Circuit Board and PCBA manufacturing
Rating: 5 (1 reviews)

SiP Package Substrate

Product Model: SiP Package Substrate

Material: Shengyi SI10U

PCB Layers: 6 Layers

PCB Thickness: 0.5–0.6mm

Single Unit Size: 35 × 35mm

Solder Mask Ink: PSR-4000 AUS308

Surface Treatment: ENEPIG

Min. Aperture: 0.075mm / 0.1mm

Min. Line Width: 50μm

Min. Line Spacing: 30μm

Application: SiP Package IC Substrate PCB Board

Description
Data Sheet

With continuous expansion of product functions, electronic devices face prominent constraints in PCB spatial layout. When conventional board space cannot accommodate additional discrete components and routing circuits, designers adopt System-in-Package (SiP) solutions. This technology integrates multiple active and passive components as well as complex functional circuits into a single miniature packaging unit, enabling streamlined overall product development through chip-level hybrid integration.

Key Advantages of SiP Packaging IC Substrate

1. Ultra-Compact Dimension

Under equivalent functional configuration, SiP integrates multiple chips and electronic components inside one package. Compared with discrete independently packaged ICs, it greatly compresses board occupancy and effectively releases limited PCB layout space.

2. Shortened R&D Cycle

As a complete system or sub-system unit, SiP modules support rapid performance evaluation and design pre-verification in terminal product development. It accelerates project progress and shortens overall product launch cycles.

3. Optimized Comprehensive Cost

Though a single SiP module costs slightly more than individual discrete devices, it delivers holistic cost benefits. It reduces PCB area occupation, lowers long-term failure rate, cuts system testing expenses, and simplifies overall hardware architecture, realizing effective control of total manufacturing and maintenance costs.

4. Higher Mass Production Efficiency

By internally integrating and embedding passive components, SiP minimizes defects caused by discrete mounting and soldering. Advanced IC packaging processes further stabilize quality, lift final product yield, and reduce system-level failure risks.

5. Reduced System Design Complexity

SiP encapsulates complex peripheral circuits into standardized modules, lowering the difficulty of high-density PCB routing and hardware design. Meanwhile, the modular plug-and-play feature allows engineers to flexibly expand and upgrade product functions.

6. Streamlined System Testing

All SiP modules undergo complete functional and reliability testing before delivery. Pre-verified modules greatly reduce whole-machine testing workload and shorten mass production validation cycles.

7. Simplified Supply Chain & Production Management

SiP integration reduces material types and warehouse stocking quantities, optimizes production workflows, and simplifies procurement, material scheduling and on-site manufacturing management for terminal manufacturers.

Product Name: SiP Package Substrate

Material: Shengyi SI10U

Layers: 6L

Thickness: 0.5-0.6mm

Single size: 35 * 35mm

Resistance welding: PSR-4000 AUS308

Surface treatment: ENEPIG

Minimum aperture: 0.075/0.1mm

Minimum line distance: 30um

Minimum line width: 50um

Application: SiP package IC Substrate PCB Board