Name: Sensor IC Substrate
Brand: PCB Printed Circuit Board and PCBA manufacturing
Rating: 5 (1 reviews)

Description
Data Sheet

Shengyi SI10U is a halogen-free high-Tg substrate specifically engineered for sensor IC packaging, featuring a glass transition temperature (Tg) of 280°C. It delivers ultra-low coefficient of thermal expansion (CTE) and high modulus, which effectively mitigates warpage during sensor IC substrate fabrication and assembly. The material also exhibits exceptional thermal and moisture resistance, excellent PCB process compatibility, and full compliance with global environmental regulations, making it an ideal solution for high-reliability sensor applications.

Sensor IC Substrate

MEMS Sensor Technology Overview

MEMS (Micro-Electro-Mechanical Systems) is an advanced manufacturing platform evolved from semiconductor fabrication technology. It enables the batch production of integrated micro-devices and systems that combine micro-mechanical structures, micro-sensors, micro-actuators, signal processing and control circuits, communication interfaces, and power supplies on a single silicon chip.

Compared with traditional mechanical sensors, MEMS sensors offer transformative advantages:

Ultra-compact form factor, with dimensions ranging from a few microns to no more than one centimeter, and extremely low profile
Superior material properties: silicon-based substrates provide electrical performance equivalent to semiconductors, mechanical strength comparable to iron, density similar to aluminum, and thermal conductivity close to molybdenum and tungsten
High cost-effectiveness: leveraging mature IC manufacturing processes for mass production, with excellent batch consistency and low power consumption

These characteristics have made MEMS sensors the preferred solution for applications demanding miniaturization and high performance. For example, MEMS microphones integrate 7-8 discrete mechanical components into a single chip, drastically reducing size and weight while improving production efficiency.

Core Application Markets for MEMS Sensors

MEMS sensor applications have expanded from early industrial and military aviation sectors to the mass consumer market. Military and aviation applications represent high-value but low-volume segments, with an annual market size of approximately $40 million and limited growth potential. Medical electronics also offer attractive margins, with higher average selling prices for sensors compared to other segments. Collectively, high-value MEMS applications generate around $300 million in annual revenue.

The automotive electronics and consumer electronics markets dominate the MEMS sensor industry, accounting for over 60% of total market share. In automotive electronics, MEMS sensors are integral to vehicle control systems, collecting critical data on engine performance, vehicle dynamics, and environmental conditions. However, the harsh automotive operating environment—characterized by extreme temperatures, corrosion, dust, and vibration—poses significant challenges to sensor reliability.

Critical Role of Sensor IC Substrates

The performance and longevity of MEMS sensors are directly dependent on the quality of their underlying sensor IC substrates. These substrates serve as the mechanical foundation and electrical interconnect for MEMS chips, requiring exceptional dimensional stability and environmental resistance to ensure consistent sensor operation under demanding conditions.

Shengyi SI10U addresses the unique requirements of sensor IC substrates through its optimized material properties. Its low CTE and high modulus minimize warpage during high-temperature packaging processes, ensuring precise alignment of MEMS micro-structures. The material's excellent thermal and moisture resistance protects sensors from degradation in automotive and industrial environments, while its robust PCB processability enables high-yield mass production.

FAQ

What materials are used in your Sensor IC Substrate?
We use Shengyi SI10U material for our Sensor IC Substrate, which features a high Tg of 280°C, ultra-low CTE, and a high modulus. This combination ensures excellent dimensional stability and moisture resistance, meeting stringent requirements for reliable sensor packaging and high-performance pcb circuit board applications.

Can I request customization of layers, thickness, or finishes for the Sensor IC Substrate?
Customization options such as varying PCB layers, thickness, and surface finishes may be available. Although specific lead times and customization details are not listed on the product page, we encourage you to contact us directly to discuss your custom pcb board requirements and feasibility.

How does the Sensor IC Substrate support reliable sensor IC packaging?
Our substrate offers a Tg of 280°C and ultra-low thermal expansion to minimize warpage and maintain precise alignment. These properties, combined with high modulus and excellent PCB process compatibility, support MEMS and sensor devices in demanding thermal and moisture environments, ensuring integrity during production and operation.

What quality standards and certifications does MaxiPCB follow for your circuit boards?
We operate under strict adherence to IPC standards and hold ISO9001, UL, and RoHS certifications. Our production employs imported precision equipment and thorough quality control systems, ensuring consistent quality and compliance for all printed circuit board products supplied to our global clients.

Product Name: Sensor IC Substrate

Material: Shengyi SI10U

Minimum width / spacing: 35 / 35um

Surface: Immersion Gold

PCB thickness: 0.25mm

Layer: 4Layers

Structure: 1L-4L,1L-2L,3L-4L

Solder mask ink: TAIYO PSR4000 AUS308

Aperture: Laser hole 0.075mm, Mechanical hole 0.1mm

Application: Sensor IC Substrate

Sensor IC Substrate

Description

Data Sheet

Core Application Markets for MEMS Sensors

Critical Role of Sensor IC Substrates