Name: RT Duroid6035 High Frequency RF PCB
Brand: PCB Printed Circuit Board and PCBA manufacturing
Rating: 5 (1 reviews)

Description
Data Sheet

1. Overview of Rogers RT/Duroid 6035HTC PCB Material

Rogers RT/Duroid 6035HTC is a high-performance high-frequency circuit material composed of ceramic-filled polytetrafluoroethylene (PTFE) composites, specifically engineered for high-power RF and microwave applications. With its unique material composition and advanced manufacturing technology, this material effectively addresses the core pain points of high-power equipment, such as poor heat dissipation and high signal loss, providing reliable material support for the stable operation of high-frequency devices.

2. Core Performance Advantages

RT/Duroid 6035HTC stands out in high-power RF microwave applications due to its exceptional performance, with two key highlights:

Superior thermal conductivity: Its thermal conductivity is 2.4 times that of the copper foil (including electrolytic copper and reverse-treated copper) of the RT/Duroid 6000 series, and it maintains excellent long-term thermal stability. This outstanding thermal performance enables efficient heat dissipation, making it an ideal choice for high-power RF applications where temperature control is critical.
Excellent drillability and cost-effectiveness: Rogers’ advanced filler system endows the material with high drillability. Compared with standard high-thermal-conductivity materials using hard alumina fillers, RT/Duroid 6035HTC significantly reduces drilling costs and extends the service life of drilling tools, effectively lowering the overall manufacturing cost of PCBs

3. Main Advantages

Building on its core performance, RT/Duroid 6035HTC integrates multiple comprehensive advantages, fully meeting the strict requirements of high-power high-frequency applications:

High thermal conductivity: The enhanced dielectric heat dissipation capability can significantly reduce the operating temperature of high-power equipment, avoiding performance degradation or damage caused by overheating, and improving the long-term reliability of the equipment. Its thermal conductivity reaches 1.44 W/m/K at 80°C, ensuring efficient heat transfer.
Low dielectric loss factor (DF): It features an extremely low dielectric loss factor of 0.0013 measured at 10GHz, which effectively reduces signal attenuation during high-frequency transmission, ensuring excellent high-frequency performance and signal integrity.
Thermally stable low-roughness reverse-treated copper: The low-roughness reverse-treated copper foil not only reduces insertion loss but also maintains excellent thermal stability, ensuring consistent signal transmission performance even in high-temperature working environments, which is crucial for high-power RF circuits.
Advanced filler system: Compared with materials containing alumina fillers, the advanced filler system of RT/Duroid 6035HTC greatly prolongs the service life of drilling tools, reduces drilling difficulty and costs, and improves production efficiency while ensuring processing quality.

4. Application Fields

Benefiting from its excellent high-power adaptability, low loss, and high thermal conductivity, RT/Duroid 6035HTC is widely applied in high-power RF and microwave fields, including:

High-power RF and microwave amplifiers
Power amplifiers, couplers, filters, combiners, and power dividers

These applications cover aerospace, communication, military, and other high-end fields, fully demonstrating the material’s outstanding performance in high-power high-frequency scenarios.

5. Real Project Display

In practical engineering projects, Duroid™ 6035HTC laminates have been fully verified for their excellent performance. As a ceramic-filled PTFE high-frequency circuit material with high thermal conductivity, it is specifically designed for high-power RF and microwave applications, and has been successfully applied in a variety of high-precision high-power projects, winning wide recognition from customers.

It is worth noting that Duroid 6000 series laminates also have excellent electronic performance, and are widely used in high-reliability and aerospace applications. In addition, all Rogers materials, including RT/Duroid 6035HTC, comply with RoHs standards, meeting the environmental protection requirements of modern electronic product manufacturing. Meanwhile, RT/Duroid 6035HTC also meets UL 94 V-0 flame-retardant rating, further enhancing the safety of its application in high-power equipment.

6. Rogers 6035HTC Technical Specifications

For more detailed technical parameters, performance data, and application guidelines of Rogers RT/Duroid 6035HTC, please visit the official technical documentation: Rogers 6035HTC Technical Specifications. The material has a dielectric constant (DK) of 3.50±0.05 (measured at 10GHz), with a recommended design DK of 3.60, and maintains stable electrical performance over a wide temperature range (-50°C to 150°C).

ROGERS 6035HTC Technical Specifications

7. RF/Microwave PCB Application Overview

Radio frequency (RF) printed circuit boards (PCBs) have become an increasingly indispensable technology in the PCB industry, with their application scope expanding rapidly alongside the development of new electronic technologies. They are classified based on operating frequency:

RF PCBs: Operate at frequencies above 100 MHz, suitable for a variety of high-frequency electronic devices and communication systems.
Microwave PCBs: Operate at frequencies above 2 GHz, mainly used in high-frequency communication, radar, millimeter wave, and high-power equipment.

RF PCBs are widely applied in various fields, including remote controls (wireless controls), security systems, smartphones, sensors, and other electronic products. The continuous advancement of new technologies such as 5G, millimeter wave communication, and high-power electronic equipment has further increased the demand for RF applications, which in turn imposes higher requirements on PCB manufacturing quality standards and material selection.

Understanding the properties of various RF materials is crucial for PCB manufacturing. For high-power RF and microwave applications, choosing the right material such as Rogers RT/Duroid 6035HTC—with its high thermal conductivity, low loss, and excellent processability—is perhaps the most critical decision in the production process of RF PCBs, as it directly determines the performance, reliability, and service life of the final product.

Model ：Rogers RT/Duroid6035 High Frequency Board

Material：Rogers RT/Duroid 6035

Finished Thickness ：1.6mm

Dielectric Thickness ：1.524MM(60MIL)

Volume Resistivity：1*10⁸

Surface Resistivity：1*10⁸

Surface Treatment：Immersion Gold

Copper Thickness ：1OZ

Trace / Space ：NA

Application： Communication base station, Instrument

RT Duroid6035 High Frequency RF PCB

Description

Data Sheet