Rogers RO4350B Hybrid Mixed-Dielectric PCB

Name: Rogers RO4350B Hybrid Mixed-Dielectric PCB
Brand: PCB Printed Circuit Board and PCBA manufacturing
Availability: InStock
Rating: 5 (1 reviews)

Product Model: Rogers RO4350B Hybrid Mixed-Dielectric PCB

Dielectric Constant (Dk): 3.48 @ 10GHz

Stack-Up Structure: 2-layer RO4350B + 2-layer FR4 composite stack design

Layer Configuration: 4-layer multilayer circuit board

Finished Board Thickness: 1.0 mm

Dielectric Layer Thickness: 0.254 mm

Base Copper Foil: ½ oz (18 μm), HH/HH grade

Finished Copper Weight: 1 oz / 0.5 oz / 0.5 oz / 1 oz

Surface Finish: Electroless Nickel Immersion Gold (ENIG)

Application: High-frequency communication equipment

Key Performance Features

Low insertion loss and stable dielectric loss (Df), delivering superior RF signal transmission performance
Optimized hybrid stack-up structure with high-precision impedance control capability
Outstanding dimensional stability and low Z-axis CTE, ensuring durable PTH interconnection
Robust thermal reliability and anti-warpage performance under long-term thermal cycling
Compatible with conventional PCB fabrication processes and lead-free SMT assembly

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Description
Data Sheet

Rogers RO4350B High-Frequency Laminate & Hybrid PCB Technical Description

Rogers RO4350B is a glass-reinforced hydrocarbon-ceramic thermoset substrate with a stable dielectric constant (Dk) of 3.48, specifically engineered to satisfy the performance and manufacturability requirements of commercial RF and microwave equipment.

Key Performance Advantages

Ultra-low RF insertion loss and dissipation factor for efficient high-frequency signal transmission
Excellent temperature stability of dielectric constant (TC-Dk) minimizing performance drift
Low Z-axis coefficient of thermal expansion (CTE) for enhanced plated via reliability
Low in-plane dimensional expansion for improved registration and assembly yield
Tight dielectric constant tolerance ensuring consistent electrical performance
Stable electrical properties across wide operating frequency ranges
Excellent compatibility with FR-4 lamination and multilayer processing, enabling cost-effective hybrid designs and high-volume production

RO4350B Hybrid Mixed-Dielectric PCB

Hybrid integration of high-frequency substrates and FR-4 has become a mainstream solution in RF circuit design, addressing material compatibility and cost optimization challenges.

By combining standard FR-4 materials, high-performance prepregs, and specialized high-frequency dielectrics (including ceramic, PTFE, hydrocarbon, and PPO-based substrates), the hybrid stack-up achieves superior high-frequency signal integrity and secure transmission performance while enabling dedicated RF circuit design. This co-laminated structure effectively reduces consumption of high-cost microwave substrates and lowers overall manufacturing cost.

Maxipcb possesses mature mass-production capabilities for Rogers RO4350B + FR-4 hybrid multilayer PCBs, delivering reliable and cost-competitive solutions for communication and wireless applications.

Model : Rogres RO4350B Hybrid PCB

DK : 3.48

Structure : 2Layers rogres ro4350B+2layers Fr4

Layer: 4Layers pcb

Finished Thickness : 1.0mm

Dielectric Thickness : 0.254mm

Material CoThickness : ½(18um)HH/HH

Finished Co Thickness : 1/0.5/0.5/1(OZ)

SurfaceTreatment : lmmersion Glod

Application : Communication Rogers ro4350B PCB

Rogers RO4350B Hybrid Mixed-Dielectric PCB

Description

Data Sheet

Rogers RO4350B High-Frequency Laminate & Hybrid PCB Technical Description

Key Performance Advantages

RO4350B Hybrid Mixed-Dielectric PCB