Rogres RO4350B+FR4 High Frequency Hybrid PCB

Name: Rogres RO4350B+FR4 High Frequency Hybrid PCB
Brand: PCB Printed Circuit Board and PCBA manufacturing
Availability: InStock
Rating: 5 (1 reviews)

Product Model: Rogers RO4350B + FR4 High-Frequency Hybrid Multilayer PCB

Dielectric Constant (Dk): 3.48

Stack-Up Structure: 2-layer RO4350B + 2-layer FR4 mixed dielectric configuration

Layer Count: 4-layer multilayer structure

Finished Board Thickness: 1.6 mm

Base Copper Foil: ½ oz (18 μm), HH/HH grade

Finished Copper Thickness: 1 oz / 0.5 oz / 0.5 oz / 1 oz

Surface Finish: Electroless Nickel Immersion Gold (ENIG)

Application: Wireless inductive communication systems

Key Performance Features

Low insertion loss and stable dielectric properties to guarantee reliable high-frequency signal transmission
Optimized hybrid stack-up balances electrical performance and structural reliability
Precision controlled impedance design sustains excellent RF signal integrity
Superior thermal stability and low moisture absorption capacity
High interlayer bonding strength with strong resistance to thermal cycling warpage
Fully compatible with standard SMT assembly and lead-free reflow processes

Get The Latest Quote

Description
Data Sheet

Rogers RO4350B High-Frequency Laminate Overview

Rogers RO4350B is a glass-reinforced hydrocarbon-ceramic thermoset substrate, fully compatible with standard FR-4 fabrication processes, enabling cost-effective manufacturing for high-frequency circuits. With a stable dielectric constant (Dk) of 3.48 at 10 GHz, the material is widely adopted in RF power amplifier designs and high-performance microwave circuits. Its low Z-axis coefficient of thermal expansion (CTE) delivers exceptional structural stability, ensuring high reliability of plated through-hole (PTH) interconnections in multilayer PCB configurations.

Company Profile

Maxipcb is a leading China-based RF and microwave PCB manufacturer with over 17 years of specialized production experience. We recognize the critical impact of dielectric material selection on circuit performance, and rigorously evaluate key parameters including operating frequency, microwave power level, temperature range, current-carrying capacity, and dielectric voltage withstand for each high-frequency application.

Our in-depth material expertise, comprehensive raw material inventory, and streamlined supply chain support rapid prototype and volume delivery. Product quality is guaranteed by our experienced engineering and production teams, working in close coordination with our quality assurance system to maintain consistent manufacturing standards. The high rate of repeat customer orders serves as a testament to our reliable performance and long-term partnership value.

Quality is the core principle of our operation, as we understand it forms the foundation of sustainable business cooperation. Over 17 years of development, we have continuously upgraded our technical capabilities and manufacturing processes supported by the trust and collaboration of our global customers.

RF & Microwave PCB Materials

Rogers Series: RO4350B, RO3003, RO4003, RO3006, RT/Duroid 5880, RT5870
Other High-Frequency Substrates: Arlon, Isola, Taconic, PTFE F4BM, Teflon dielectric materials

Hybrid Mixed-Dielectric Stack-Up Solutions

RO4350B + FR4, RO4350B + IT180, RO4003C + FR4, RO3010 + FR4, RO3003 + FR4, and custom multilayer hybrid laminate combinations.

Typical Applications

RF and microwave PCBs are widely applied across industries including consumer electronics, military and aerospace, high-power equipment, medical devices, automotive electronics, and industrial control systems.

Model : Rogres RO4350B+FR4 High Frequency Hybrid PCB

DK : 3.48

Structure : 2Layers rogres ro4350B+2layers Fr4

Layer : 4Layers

Finished Thickness : 1.6mm

Material CoThickness : ½(18um)HH/HH

Finished Co Thickness : 1/0.5/0.5/1(OZ)

SurfaceTreatment : lmmersion Glod

Application : Wireless Induction Communication System