Name: Rogers RO6002 PCB
Brand: PCB Printed Circuit Board and PCBA manufacturing
Availability: InStock
Rating: 5 (1 reviews)

Description
Data Sheet

1. Overview of Rogers RT/Duroid RO6002 PCB Material

Rogers RT/Duroid RO6002 PCB microwave material is a low dielectric constant laminate, which can meet the strict requirements of mechanical reliability and electrical stability in the design of complex microwave structures. The temperature dependence of its dielectric constant was measured in the range of -55℃ to +150℃. The results show that the dielectric constant of the material has excellent resistance to temperature change, which can meet the requirements of filter, oscillator and delay line designers for stable electrical performance in the design process.

2. Main Advantages of Rogers RO6002 PCB

Rogers RO6002 PCB material integrates multiple outstanding advantages, making it suitable for high-demand microwave circuit applications. Its main advantages are as follows:

Low loss ensures excellent performance at high frequencies, effectively reducing signal attenuation and ensuring signal integrity.
Strictly controlled permittivity and thickness tolerance, ensuring consistent performance of batch products and facilitating precision circuit design.
Excellent electrical and mechanical properties, providing reliable support for the fabrication of complex microwave structures.
Very low rate of change of dielectric constant with temperature, maintaining stable electrical performance in a wide temperature range (-55℃ to +150℃).
Surface expansion coefficient equivalent to copper foil, avoiding board warpage caused by thermal expansion mismatch and ensuring dimensional stability.
Low Z-axis expansion, enhancing the reliability of plated through-holes (PTH) in multi-layer PCBs.
Low exhaust rate, making it an ideal material for aviation applications with high environmental requirements.

rogers ro6002 Technical Specifications

3. PCB Applications of Rogers RO6002

Benefiting from its excellent comprehensive performance, Rogers RO6002 PCB is widely applied in high-end microwave and high-frequency fields, including:

Phase array antenna
Ground based and airborne radar systems
Global positioning system
Power backplane
High reliability complex multilayer circuit
Commercial aviation anti collision system
Beamforming network

4. Rogers RO6002 Technical Specifications

For more technical information about Rogers RO6002 material, please visit: rogers ro6002 Technical Specification

5. Overview of Rogers High-Frequency PCB Material Series

Rogers RT/Duroid 6000 series, RO3000 series and RO3200 series™ high-frequency PCB board materials are all polytetrafluoroethylene (PTFE) composite materials, which contain ceramic filling particles with a volume fraction of more than 50%. The high filling properties of RT/Duroid 6002, RO3000 series and RO3200 series PCB board materials endow them with the following advantages:

Low Z-axis thermal expansion coefficient (CTE), ensuring good dimensional stability.
Excellent plated through-hole (PTH) reliability, improving the service life of multi-layer PCBs.
The flat CTE closely matches with copper, avoiding thermal expansion mismatch and reducing board warpage.

In contrast, the fillers in RT/Duroid 6006 and 6010 have high dielectric constants, which can effectively reduce the size of the circuit, making them suitable for miniaturized microwave device applications.

6. Key Notes on Material Characteristics

The high filling capacity of the above materials is also prone to the formation of pores with a volume fraction of about 5%. These micropores in the composite material exist at the interface between the filler and PTFE, even though they cannot be detected in the cross section by scanning electron microscopy. Due to the low surface energy of PTFE and the processed ceramic filler, these micropores will not lead to high water absorption. However, low surface tension liquids such as organic solvents and aqueous solutions containing surfactants can penetrate into the micropores.

Since PTFE and ceramic fillers are chemically inert to most processing chemicals, liquid absorption only fills the micropores and does not change the physical properties of these PCB board materials. However, before the plates are processed at high temperatures (such as lamination, Sn/Pb reflow soldering, etc.), the volatiles that penetrate the composite materials must be removed. In addition, the plates should be rinsed thoroughly immediately after contact with processing chemicals to ensure that no non-volatile soluble substances are left behind when baking the parts.

7. Volatile Removal

Failure to remove volatiles prior to high-temperature processes such as lamination or reflow soldering can result in dielectric foaming or delamination. The following baking treatments have been found to eliminate problems associated with volatiles during high temperature processes.

BASIC GUIDE FOR BAKING

Before lamination: Before lamination, the inner laminate to be laminated should be baked for at least half an hour in vacuum or at 300 degrees F (about 149℃) of nitrogen. If the plates are pressed together in a high-pressure sterilizer, the baking process can precede the pressing process.
Before the chemical deposit of copper: Bake the plates for at least 1 hour in vacuum or at 300 degrees F (about 149℃) of nitrogen before chemical precipitation of copper. This is the key to baking because once the edges and mechanical properties of the multilayer plates are covered by electroless copper plating, ethylene glycol ether absorbed from commercially available sodium etchants or alcohol from flushing is difficult to remove.
Before reflow soldering: Before reflux bonding or hot air leveling (HASL), the board is baked for at least 2 hours in a vacuum or in nitrogen at 300 degrees F (about 149℃). After baking, the residence time after applying flux is not more than 30 seconds. If re-processing is required, the above baking treatment must be repeated.

When baking sheets in a nitrogen purification bag, the nitrogen airflow from the bag is needed to ensure that the volatiles in the bag are removed. Similarly, care must be taken when using vacuum bags to ensure that the vacuum pipeline is not blocked by the bag material. If volatiles remain in the bag, they will condense on the board when it cools down. This significantly reduces the effectiveness of baking. If the oven is not preheated, the recommended baking time should be used to bring the oven to the required temperature.

8. Dielectric Pollution

Failure to flush these PCB board materials sufficiently after contact with processing chemicals can sometimes lead to dielectric contamination or increase dielectric loss. These problems can be prevented by minimizing exposure to low-surface-energy solvents containing non-volatile components and using a reasonable flushing process. For example, it is not allowed to immerse the plate in the etchant longer than the etching time required. In addition, the plate must be flushed immediately after etching.

Basic Guidelines for Preventing Dielectric Pollution

Minimize exposure to low surface energy solvents containing non-volatile components.
Dump and rinse regularly to prevent non-volatile residues.
If the dielectric surface is in contact with a water-soluble solution with low surface energy or a water-soluble organic solution containing non-volatile substances, the plate should be immersed in 70°F (about 21℃) hot distilled water for 15 minutes immediately.
If the dielectric surface is in contact with water-insoluble solvents containing non-volatile substances, the plate should be immersed in water-soluble organic solvents (e.g. methanol, ethanol or isopropanol) for 15 minutes immediately, and then in hot distilled water for 15 minutes.

Model：Rogers RO6002 PCB

Dielectric Constant：2.94 ± 0.04

Layer：2Layers pcb

DielectricsThickness ：1.524mm(60mil)

Finished Thickness ：1.6mm

Material Copper Thickness ：½(17μm)H/H

Finished Copper Thickness ：1OZ(35μm)

SurfaceTreatment ：Immersion Gold

Application ：Phase array antenna,Ground based and airborne radar systems,Global positioning system,Power backplane,High reliability complex multilayer circuit,Commercial aviation anti collision system,Beamforming network

Rogers RO6002 PCB

Description

Data Sheet