Name: Rogers RO4730G3 Microwave Printed Circuit Board
Brand: PCB Printed Circuit Board and PCBA manufacturing
Rating: 5 (1 reviews)

Description
Data Sheet

1. Overview of Rogers RO4730G3 UL 94 V-0 Antenna-Grade Laminate

Rogers has launched the RO4730G3 UL 94 V-0 antenna-grade laminate, which is specifically designed to meet the current and future high-performance requirements of active antenna arrays, small base stations, 4G base transceivers, Internet of Things (IoT) devices, and emerging 5G wireless systems. As a derivative of Rogers' well-trusted and widely used circuit materials for base station antenna applications, this flame-retardant (UL 94 V-0) thermosetting laminate integrates excellent electrical and mechanical properties, providing a reliable material solution for high-frequency communication applications.

2. Core Performance Characteristics of RO4730G3 Laminate

The RO4730G3 laminate is composed of ceramic hydrocarbon material and low-loss LoPro® copper foil, with the following core performance advantages:

Stable Dielectric Performance: It features a low dielectric constant (DK) of 3.0, which is highly favored by antenna designers. At 10 GHz, the z-direction dielectric constant deviation is only ±0.05, ensuring stable signal transmission. Within the temperature range of -50 °C to +150 °C, the z-direction dielectric constant has an extremely low thermal change rate (+26 ppm/°C at 10 GHz), maintaining consistent performance under temperature fluctuations.
Excellent Passive Intermodulation (PIM) Performance: It can provide superior PIM performance (typically better than -160 DBC), making it highly suitable for intermodulation-sensitive high-frequency (HF) antennas, which is crucial for ensuring signal integrity in communication systems.
Lightweight and High-Temperature Resistance: Compared with PTFE materials, the RO4730G3 PCB material is 30% lighter, reducing the overall weight of the equipment. Its high glass transition temperature (Tg) exceeds +280 °C, ensuring compatibility with automatic assembly processes and stable performance in high-temperature environments.
Superior Thermal Expansion and Through-Hole Reliability: Within the temperature range of -55 °C to +288 °C, the z-direction coefficient of thermal expansion (CTE) is only 30.3 ppm/°C, which is conducive to improving the reliability of plated through-hole (PTH) structures in multi-layer circuit assemblies. The x and y-axis CTE is similar to that of copper foil, reducing stress in PCB antennas caused by thermal expansion mismatch.
Low High-Frequency Loss: The laminate has extremely low high-frequency loss, with a dielectric loss (DF) of 0.0023 at 2.5 GHz and 0.0029 at 10 GHz, effectively reducing signal attenuation during high-frequency transmission.
Good Mechanical and Process Compatibility: The RO4730G3 laminate has better flexural strength than RO4000JXR material and excellent lead-free process resistance. It is compatible with conventional RF-4700 laminates, with no special requirements for high-temperature soldering of RF-4700 laminates, simplifying the manufacturing process.

3. Performance Comparison with RO4730JXR Laminate

Due to the addition of flame-retardant fillers, the loss of RO4730G3 is slightly higher than that of RO4730JXR. Specifically, at a frequency of 3.5 GHz, the loss of RO4730G3 with a thickness of 30.7 mil increases by 0.0009 dB/cm compared with RO4730JXR at the same frequency. Despite this slight difference, RO4730G3 still maintains excellent comprehensive performance and is more cost-effective in scenarios requiring flame retardancy.

4. Application Scenarios and Cost Advantages of RO4730G3

The RO4730G3 laminate provides a practical and cost-effective material solution for PCB antennas and active antenna arrays in current 4G, IoT wireless devices, and future 5G wireless devices. As an economical alternative to PTFE antenna materials, it helps designers achieve a balance between cost performance, performance, and durability. Its core application advantages include:

Cost advantage: More economical than PTFE materials, reducing the overall cost of PCB manufacturing.
High-performance adaptation: Suitable for high-performance PCB antennas and active antenna arrays in 5G and IoT applications.
Broad application coverage: Meets the high-cost-performance and high-performance requirements of PCB antennas and active antenna arrays in 4G, 5G, and IoT fields.

For more detailed technical information about the RO4730 series, please refer to the professional technical specifications.

5. Maxipcb Company Introduction

Based in China, Maxipcb has specialized in RF PCB manufacturing for more than 17 years. We deeply understand the critical impact of selecting the right RF material on PCB performance—key parameters such as RF microwave energy levels, operating frequency, operating temperature range, current, and voltage are crucial in the selection of materials for high-frequency PCB fabrication. Familiarity with various RF PCB materials is our core strength; we maintain sufficient stock of related materials to ensure fast delivery and meet tight project timelines.

Our confidence in product quality stems from our experienced engineers and production team, who work closely with our quality assurance (QA) department to deliver qualified and reliable products. We do not pursue superficial recognition; instead, the increasing number of repeat orders from customers is the best proof of their satisfaction. Quality is the core value of Maxipcb, and we fully recognize its importance for long-term business partnerships. We are deeply grateful to our customers who have accompanied us over the past 17 years, helping us continuously develop and improve our production capacity and technical capabilities.

6. RF/Microwave PCB Materials Supplied by Maxipcb

Maxipcb offers a comprehensive range of high-performance RF/microwave PCB materials, including:

Rogers series: RO4350B, RO3003, RO4003, RO3006, RT/Duroid 5880, RT5870, RO4730, etc.
Other high-performance materials: Arlon, Isola, Taconic, PTFE F4BM, Teflon, etc.

7. Hybrid PCB Materials (Mixed Dielectric/Laminate)

To meet the complex performance requirements of different applications, Maxipcb also provides hybrid PCB materials (mixed dielectric/laminate), such as:

Rogers RO4350B + FR4, RO4350B + IT180, RO4003C + FR4, RO3010 + FR4, RO3003 + FR4, etc.

8. RF/Microwave PCB Application Fields

RF/microwave PCBs are widely used in various industries and scenarios, and their application scope is constantly expanding with the development of new technologies. Specifically, they are applied in:

Consumer electronics, military/space, high-power equipment, medical devices, automotive, and industrial fields.
Wireless control (remote controls), security systems, smartphones, sensors, and other daily and industrial electronic products.
High-frequency scenarios: RF PCBs working above 5G and microwave PCBs working above 5 GHz.
Specific products: Antenna & communications systems, handheld cellular devices, WiFi antennas, telematics and infotainment systems, WiFi/computing/radar equipment, power amplifiers, etc.

The manufacturing of RF/microwave PCBs requires strict quality standards, and the selection of appropriate RF materials according to specific applications is the most critical decision in the production process. Maxipcb relies on rich experience to provide customers with professional material selection and manufacturing services.

9. Maxipcb's RF/Microwave PCB Manufacturing Capabilities

9.1 Surface Finishing

OSP, ENIG (Electroless Nickel Immersion Gold), HASL LF (Lead-Free Hot Air Solder Leveling), Plated Gold, Flash Gold, Immersion Tin, Immersion Silver, Electrolytic Gold.

9.2 Manufacturing Capacity

Golden Finger, Heavy Copper, Blind/Buried Via, Impedance Control, Resin Filling, Carbon Ink, Backdrill, Countersink, Depth Drilling, Half-Plated Hole, Pressfit Hole, Peelable Blue Mask, Peelable Solder Stop, Thick Copper, Oversize Processing.

9.3 Material Range

Rogers RO4350B, RO3003, RO4003, RO3006, RT/Duroid 5880, RT5870, RO4730, as well as Arlon, Isola, Taconic, PTFE F4BM, Teflon and other materials.

9.4 Number of Layers

2L, 4L, 6L, 8L, 10L, 12L, 14L, 16L, 18L, 20L, 22L, 24L, 26L, 28L, 30L.

9.5 Dielectric Constant (DK) Range

2.20, 2.55, 3.00, 3.38, 3.48, 3.50, 3.6, 6.15, 10.2.

Model：Rogers RO4730 High Frequency Board

Material ：Ceramic PTFE Composite Rogers RO4730

D K：3.0±0.05

Layer：2Layers

DielectricsThickness ：0.762mm(30mil)

Finished Thickness ：0.86mm

Material CoThickness ：½(17μm)HH/HH

Finished Co Thickness ：1OZ(35μm)

SurfaceTreatment ：Immersion Gold

Min Trace / Space：4mil/4mil

Application ：PCB antenna,active antenna array for 5g,IOT pcb

Rogers RO4730G3 Microwave Printed Circuit Board

Description

Data Sheet