The Rogers RO4700 series antenna-grade circuit materials represent a cost-effective and high-reliability alternative to conventional PTFE-based microwave substrates, delivering balanced electrical performance and manufacturability for modern wireless communication applications.

RO4725JXR, RO4730JXR and RO4730G3 laminates are engineered to meet the rigorous electrical and mechanical requirements of antenna design. These materials feature stable dielectric constants (Dk) of 2.55 and 3.0 respectively, with a consistent dissipation factor (Df) of 0.0022, enabling minimal signal transmission loss while supporting high antenna gain performance. The series exhibits outstanding passive intermodulation (PIM) characteristics, with typical values better than -160 dBc under 1900 MHz excitation at 43 dBm input power, ensuring low interference in high-sensitivity RF systems.

RO4700 series antenna-grade laminates are fully compatible with standard epoxy-based PCB processes and high-temperature lead-free assembly profiles, eliminating the specialized preparation steps required for traditional PTFE materials such as hole plating pre-treatment. Multilayer constructions can be reliably fabricated via lamination with RO4400 series bondplys at 175°C. Featuring a glass transition temperature (Tg) exceeding 280°C, the material system delivers extremely low Z-axis coefficient of thermal expansion (CTE), significantly enhancing plated through-hole (PTH) reliability and improving robustness in lead-free reflow environments.

RO4725 LoPro also serves as a high-performance, cost-competitive replacement for conventional PTFE antenna substrates. At 2.5 GHz, the laminate provides a stable Dk of 2.55 and Df of 0.0022, supporting optimized antenna efficiency with low insertion loss. Its PIM performance exceeds -153 dBc (tested per Rogers internal methodology). Compatible with standard PCB fabrication and lead-free soldering processes, RO4725 LoPro requires no special hole preparation procedures. With Tg above 280°C and reduced Z-axis thermal expansion, the material ensures excellent plated via reliability in mass production environments.

Rogers RO4730G3 is a specialized antenna-grade laminate formulated with standard electrodeposited copper foil and UL 94 V-0 flammability rating, designed to satisfy the demands of current and next-generation active antenna arrays, micro base stations, IoT infrastructure and 5G wireless communication systems. It offers broad copper foil selection for enhanced design flexibility and optimized cost-performance balance. As a ceramic-filled hydrocarbon laminate, RO4730G3 was initially launched with low-profile, low-loss LoPro® copper foil, delivering industry-leading PIM performance typically better than -160 dBc for high-intermodulation-sensitive antenna applications. With evolving 5G design requirements, the standard EDC foil option extends its applicability by providing an optimal balance of cost, electrical performance and structural durability. RO4730G3 features a tightly controlled through-thickness Dk of 3.0 ±0.05 at 10 GHz. Approximately 30% lighter than PTFE-based materials and with Tg >280°C, it supports high compatibility with automated assembly lines. The Z-axis CTE is controlled at 30.3 ppm/°C (-55°C to +288°C), guaranteeing reliable PTH performance in multilayer RF boards and full compatibility with lead-free manufacturing processes.