Rogers RO4003C + FR4 Mixed Dielectric RF PCB

Maxipcb is a professional manufacturer of RF and microwave PCBs based in China, with over 17 years of dedicated experience in high-frequency circuit board production. We fully recognize the critical impact of high-performance RF substrate materials on the electrical properties and overall reliability of finished circuit boards. Key indicators including microwave power level, operating frequency band, temperature range, current rating and voltage endurance are all rigorously considered during material selection for high-frequency PCB fabrication. Profound mastery of RF microwave laminate characteristics has long been one of our core technical strengths. A full range of mainstream high-frequency materials is maintained in regular inventory to guarantee efficient order fulfillment and short lead times.

Our consistent product quality is supported by a professional engineering team and skilled production personnel, who work in close coordination with our quality assurance system to deliver reliable and compliant high-frequency PCBs. Customer satisfaction is best reflected by continuous repeat orders, which we regard as the most valuable recognition. Quality serves as the fundamental core value of our enterprise, as we understand that stable and reliable quality is the cornerstone of sustainable long-term business partnerships. We sincerely appreciate the trust and support from global customers over the past 17 years, which has continuously driven our technological innovation and manufacturing capability improvement.

Rogers RO4350B + FR4, RO4350B + IT180, RO4003C + FR4, RO3010 + FR4, RO3003 + FR4 and other composite dielectric structures

RF and microwave printed circuit boards are widely applied across multiple industries including consumer electronics, military & aerospace, high-power equipment, medical devices, automotive electronics and industrial control systems.

OSP, ENIG (Electroless Nickel Immersion Gold), lead-free HASL, electroplated hard gold, flash gold, immersion tin, immersion silver, electrolytic gold

Gold finger, heavy copper circuitry, blind & buried vias, controlled impedance, resin plug hole, carbon ink printing, back drilling, countersink machining, depth-controlled drilling, half-plated holes, press-fit holes, peelable blue mask, peelable solder mask, extra-thick copper, oversized board production

2-layer, 4-layer, 6-layer, 8-layer, 10-layer, 12-layer, 14-layer, 16-layer, 18-layer, 20-layer, 22-layer, 24-layer, 26-layer, 28-layer, 30-layer

2.20, 2.55, 3.00, 3.38, 3.48, 3.50, 3.6, 6.15, 10.2

Consumer electronics, military & aerospace, antenna & communication systems, high-power modules, medical equipment, automotive electronics, industrial control, handheld communication devices, cellular terminals, Wi-Fi antennas, telematics & infotainment systems, computing equipment, radar systems, power modules

RO4450F, 4450B Bond Ply 14×24 unpunched sheet, 4450B Bond Ply 24×20 unpunched sheet, 4003C 24×18 1E/1E 0080±001/DI, 4003C 48×36 1E/1E 0320±002/DI, 4003C 12×18 1E/1E 0320±002/DI, 4003C 12×18 1E/1E 0080±001/DI, 4003C 24×18 5TC/5TC 0087±001/DI, 4003C 24×18 5E/5E 0080±001/DI, 4003C 48×36 5E/5E 0320±002/DI, 4003C 48×36 1E/1E 0200±0015/DI, 4003C 24×18 5E/5E 0320±002/DI-RSZ, 4003C 48×36 1E/1E 0080±001/DI, RO4003C, 4003C 24×18 5E/5E 0160±0015/DI, 4003C 24×18 1E/1E 0200±0015/DI, 4003C 48×36 5E/5E 0200±0015/DI, 4003C 24×18 5TC/5TC

Rogers RO4003C substrate does not carry UL certification.

In accordance with EU directives and REACH regulations, copper foil manufacturers are gradually eliminating the use of arsenic-based reagents in production processes. REACH legislation restricts occupational and environmental exposure to arsenic (As) and arsenic trichloride (AsCl₃), which has imposed strict limitations on the application of arsenic compounds in copper foil production and ultimately led to a full ban on arsenic-related raw materials in the European Union.

As a result, the standard electrodeposited copper foil originally supplied with Rogers RO4003C laminate has been affected. Starting in 2020, it was fully replaced by a revised grade of copper foil that fully complies with EU environmental and chemical regulatory requirements.