• Rogers RO3003+RO4835+Isola 370HR PCB
  • Rogers RO3003+RO4835+Isola 370HR PCB

Rogers RO3003+RO4835+Isola 370HR PCB

Product Model: Rogers RO3003 + RO4835 + Isola 370HR Multi-Material Hybrid PCB
Dielectric Constant (Dk): 3.48 & 3.00
Stack-Up Structure: 2-layer RO3003 + 4-layer Isola 370HR + 2-layer RO4835 composite stack
Layer Configuration: 8-layer multilayer PCB
Finished Board Thickness: 2.0 mm
Base Copper Thickness: 0.5 oz
Final Copper Thickness: 0.5 oz / 1 oz
Surface Finish: Electroless Nickel Immersion Gold (ENIG)
Minimum Line Width & Spacing: 3.5 mil / 3.5 mil
Minimum Via: Laser microvia, Φ0.1 mm
Application: 24GHz radar antenna PCB, reverse sensing radar PCB
  • Rogers RO3003+RO4835+Isola 370HR PCB
  • Description

  • Data Sheet

Rogers RO3003 & RO4835 High-Frequency Substrate Technical Overview

Rogers RO3003 High-Performance Microwave Laminate

Rogers RO3003 exhibits an extremely low dielectric loss tangent (Df) of only 0.0013 at 10 GHz, with insertion loss as low as -1.8 dB/inch at 24 GHz and -2.4 dB/inch at 77 GHz, ensuring excellent signal transmission efficiency and low noise figure in millimeter‑wave systems. This ceramic‑filled PTFE composite provides exceptional electrical and mechanical stability with outstanding cost performance, making it a preferred solution for commercial RF and microwave applications.
With a melting point of 327°C, RO3003 offers excellent high‑temperature resistance and acid‑alkali corrosion resistance, supporting long‑term reliable operation in the environment of -55°C to +150°C.
The X‑Y axis CTE is 17 ppm/°C, highly matched with copper foil, which significantly improves the reliability of plated through holes under thermal cycling.
Dimensional shrinkage after etching and baking is less than 0.5 mil per inch, and the Z‑axis CTE is 24 ppm/°C, ensuring stable via structure even under 1000 cycles of thermal shock (-40℃ ~ +125℃).
RO3003 eliminates the dielectric constant step anomaly of traditional PTFE glass cloth materials near room temperature, achieving a temperature coefficient of dielectric constant (TC‑Dk) within ±30 ppm/°C from -40°C to +125°C.
Its stable mechanical performance ensures warpage value less than 0.6% in multilayer structures, effectively avoiding plate bending and reliability risks. The material can be manufactured using standard PTFE PCB processes.

Typical Applications

Automotive radar, GPS antennas, cellular base station power amplifiers and array antennas, wireless communication patch antennas, VSAT, remote meter reading, power backplanes, and high‑speed data links.

Key Performance Characteristics

  • Ultra‑low dissipation factor: Df = 0.0013 @ 10 GHz
  • Supports high‑frequency design up to 77 GHz
  • Excellent temperature‑independent mechanical stability
  • Reliable for stripline and multilayer circuit structures
  • Stable dielectric constant over wide frequency and temperature ranges
  • TC‑Dk ≤ ±30 ppm/°C
  • Compatible with hybrid lamination with epoxy FR4 multilayers
  • Ideal for bandpass filters, microstrip antennas, VCOs
  • CTE matched to copper for enhanced PTH reliability
  • SMT process adaptability with warpage < 0.6%
  • High dimensional stability for temperature‑sensitive applications
  • Suitable for mass production with good economy

Rogers RO4835 High-Frequency Thermosetting Laminate

Rogers RO4835 is a hydrocarbon‑ceramic high‑frequency laminate for commercial applications, supporting FR‑4 compatible processing, hybrid pressing with general epoxy boards, and lead‑free reflow soldering at 260°C.
At 10 GHz, its through‑thickness dielectric constant Dk = 3.48 ± 0.05, thermal conductivity = 0.69 W/(m·K), and X‑Y dimensional stability ≤ 0.04% after high temperature treatment.
Under long‑term aging at 125°C for 1000 hours, the increase of dielectric loss is less than 0.0008, showing significantly better anti‑oxidation stability than traditional thermosetting high‑frequency materials.
In electrical and mechanical properties, RO4835 is generally equivalent to RO4350B, but with a specially enhanced antioxidant system, its oxidation resistance is about 10 times higher than conventional materials, fully meeting the IPC‑4103 high‑speed & high‑frequency substrate standard.
In addition, RO4835 has higher flexural modulus ≥ 22 GPa, lower water absorption ≤ 0.12%, and better dimensional stability than RO4350B.
However, RO4835 has relatively weaker temperature stability of dielectric constant, with TC‑Dk ≈ ±50 ppm/°C and Z‑axis CTE ≈ 55 ppm/°C.
At 77 GHz, its phase deviation exceeds ±1.2°/inch, so it is not recommended for applications requiring strict phase linearity and high precision phase consistency.

Model :Rogers RO3003+R04835+lsola 370HR Hybrid PCB

DK:3.48+3.00

Structure :2Lrogres ro4350B+4L Fr4+2L rogers ro4835

Layer : 8Layers

Finished Thickness:2.0mm

Material CoThickness : 0.5oz

Finished Co Thickness :0.5oz.1oz

SurfaceTreatment :lmmersion Glod

Min Trace/ Space : 3.5mil/3.5mil

Min Hole : Laser Hole 0.1mm

Application : 24g radar antenna pcb, reverse radar pcb