Name: Rogers RO3003 High Frequency Circuit Board
Brand: PCB Printed Circuit Board and PCBA manufacturing
Rating: 5 (1 reviews)

Description
Data Sheet

1. Overview of Rogers RO3003 High-Frequency Circuit Board

Rogers RO3003 is a high-performance high-frequency circuit board material based on ceramic-filled polytetrafluoroethylene (PTFE) composites. It exhibits excellent high-temperature resistance, capable of stable operation at 10GHz within a wide temperature range of -50℃ to +150℃. The material features a dielectric constant (DK) temperature coefficient of -3 ppm/℃, maintaining exceptional stability of permittivity across a broad frequency spectrum. Additionally, RO3003 laminates demonstrate an extremely low dielectric loss (DF) of 0.0013 at 10GHz, making them ideal for high-frequency applications requiring minimal signal attenuation.

2. Core Features of Rogers RO3000 Series Laminates

As a key member of the Rogers RO3000 Series, RO3003 inherits the series’ outstanding overall performance. RO3000 Series laminates are ceramic-filled PTFE-based circuit materials with consistent mechanical properties, regardless of the dielectric constant (Dk) selected. This unique characteristic enables designers to develop multi-layer board designs that adopt different dielectric constant materials for individual layers, without encountering warpage or reliability issues. Furthermore, the dielectric constant of the RO3000 Series remains stable over a wide temperature range, ensuring consistent performance in extreme environmental conditions.

3. Core Benefits of Rogers RO3003

Rogers RO3003 integrates multiple performance advantages, making it a preferred choice for high-frequency RF/microwave PCBs. Its key benefits include:

One of the lowest loss commercial laminates: Effectively reduces signal attenuation, ensuring high signal integrity in high-frequency transmission.
Available in a wide range of Dk (3.0 to 10.2): Offers flexible material selection to meet the diverse dielectric requirements of different high-frequency applications.
Available in both versions with and without woven glass reinforcements: Adapts to different structural design needs of PCBs, balancing performance and cost.
Low Z-axis thermal expansion coefficient (CTE): Ensures reliable plated through-hole (PTH) performance, enhancing the long-term stability and durability of multi-layer PCBs.

4. Thermal Expansion Coefficient of Rogers RO3003

The thermal expansion coefficient (CTE) of Rogers RO3003 is precisely matched to practical application needs, further ensuring PCB stability. The CTE in the X and Y directions is 17 ppm/℃, which is consistent with that of copper, effectively avoiding dimensional deformation caused by thermal expansion mismatch and ensuring excellent dimensional stability of the PCB. The Z-axis CTE is 25 ppm/℃, which provides reliable support for the stability of plated through-holes (PTH), even in harsh thermal operating environments.

5. RF/Microwave PCB Application Overview

Radio frequency (RF) printed circuit boards (PCBs) have become an increasingly indispensable technology in the PCB industry, with their application scope expanding rapidly alongside the development of new electronic technologies. They are classified based on operating frequency:

RF PCBs: Operate at frequencies above 5G, suitable for a variety of high-frequency electronic devices and communication systems.
Microwave PCBs: Operate at frequencies above 5GHz, mainly used in high-frequency communication, radar, and satellite equipment.

RF PCBs are widely applied in various fields, including remote controls (wireless controls), security systems, smartphones, sensors, and other electronic products. The continuous advancement of new technologies such as 5G and automotive radar has further increased the demand for RF applications, which in turn imposes higher requirements on PCB manufacturing quality standards and material selection.

Understanding the properties of various RF materials is crucial for PCB manufacturing. Choosing the right RF material is perhaps the most critical decision in the production process of RF PCBs, as it directly determines the performance, reliability, and cost-effectiveness of the final product.

6. Typical Applications of Rogers RO3003

Leveraging its excellent high-frequency performance and stability, Rogers RO3003 is widely used in various high-end RF/microwave applications, including:

Patch antennas for wireless communications
Direct broadcast satellites
Datalink on cable systems
Remote meter readers
Power backplanes
Global positioning satellite (GPS) antennas
Cellular telecommunications systems — power amplifiers and antennas
Automotive radar and advanced driver assistance systems (ADAS)

7. Technical Specifications Reference

For more detailed technical parameters and performance data of Rogers RO3003, please visit: Rogers RO3003 Technical Specifications.

Material ：Ceramic PTFE Composite Rogers RO3003

D K：3.0±0.04

Layer：2L

DielectricsThickness ：0.762mm(30mil)

Finished Thickness ：0.85mm

Material Copper Thickness ：½(17μm)H/H

Finished Copper Thickness ：1OZ(35μm)

SurfaceTreatment ：Immersion Gold

Color：Green /White

Min Trace / Space：5mil/5mil

Application ：Automotive Radar, Radio Frequency Coupler,Radar Gauges

Rogers RO3003 High Frequency Circuit Board

Description

Data Sheet