Name: Rogers 5880 PCB
Brand: PCB Printed Circuit Board and PCBA manufacturing
Rating: 5 (1 reviews)

Description
Data Sheet

Rogers 5880 PCB is a high-performance high-frequency substrate, widely applied in point-to-point digital radio antennas, microstrip and stripline circuits, millimeter-wave equipment, missile guidance systems, military radar and high-frequency modules for commercial aviation communication devices.

Rogers 5880 copper clad laminates are produced by directly bonding PTFE composite layers onto copper foil surfaces. For electrodeposited (ED) copper foil, its spherical concave-convex surface forms a firm mechanical interlock with PTFE, effectively enhancing interfacial bonding stability.

Core Specifications of Rogers RT/duroid 5880

The marked thickness refers to pure dielectric thickness without copper cladding, enabling accurate impedance calculation for high-frequency circuit design.

Available dielectric thickness: 0.127 mm, 0.254 mm, 0.381 mm, 0.508 mm, 0.787 mm, 1.575 mm, 3.175 mm

Copper foil specification: Base copper in 0.5oz (18μm), 1oz (35μm), 2oz (70μm)

Maxipcb adopts 0.5oz (18μm) base copper as the standard configuration for Rogers 5880 production, with finished copper thickness stabilized at 1oz.

Key Characteristics of Rogers 5880

Ultra-low electrical loss, among the optimal levels of all reinforced PTFE substrates
Extremely low water absorption, adapting to long-term operation in high-humidity environments
Excellent substrate isotropy with consistent electrical performance at high frequencies
Outstanding chemical resistance against printing coatings, industrial solvents and chemical reagents
Stable environmental adaptability and eco-friendly material composition

Rogers RT/duroid 5880 high-frequency laminates adopt glass fiber reinforced PTFE structure. Directionally arranged microfibers optimize structural performance and processing advantages, delivering high cost-effectiveness for manufacturers and terminal products. With ultra-low dielectric constant and minimal dielectric loss, it perfectly suits high-frequency and broadband scenarios that require strict suppression of signal dispersion and transmission attenuation.

This material features excellent machinability and can undergo conventional cutting, routing, edge electroplating and hole metallization. As an isotropic high-frequency material, it maintains uniform electrical parameters across broadband ranges and is tailored for high-precision integrated circuits and micro microwave systems.

RT/duroid 5880 possesses an ultra-low dielectric constant of 1.96 @ 10 GHz, supporting high-stability signal transmission for millimeter-wave and microwave broadband applications. It is a lightweight single-filled PTFE composite material with a density of only 1.37 g/cm³ and a low Z-axis thermal expansion coefficient. These properties ensure reliable plated through-hole quality and improve structural load capacity. The dielectric constant remains consistent between batches and in wide frequency bands, with an ultra-low Z-axis DK temperature coefficient of +22 ppm/°C.

Rogers 5880 substrate

board rework, to prevent copper foil delamination.

A targeted bonding strength test was conducted on 1.59 mm thick RT/duroid 5880 laminates with 1oz ED copper foil. Samples were tested within a temperature range of 182°C to 371°C to verify the bonding reliability between copper foil and substrate. Three core test items are included:

Cold Peel Strength: After 30 seconds of solder floating, the 90° peeling force of 3.2 mm wide copper traces is measured at 21°C.
Thermal Peel Strength: After 1 minute of stable high-temperature solder soaking, the high-temperature peeling performance of copper circuits is tested at a 90° angle.
Thermal Shear Strength: After local protection and high-temperature soaking, the tensile force that causes liner separation from the substrate is detected.

Test data shows that when the temperature approaches the PTFE melting point (327°C), the bonding interface between PTFE and copper foil begins to fail. High temperature accelerates copper oxidation and triggers PTFE phase transition, which weakens the sealing and bonding effect of the composite layer. Excessive heat and forced mechanical operation will damage the circuit board structure, so standardized operation is required for manual assembly.

Rogers 5880 PCB

Product Application & Customization Service

Manufactured with strict raw material standards and mature processes, Rogers RT/duroid 5880 fills the performance gap of conventional FR-4 substrates. It meets the ultra-low loss dielectric requirements of high-speed circuits, RF microwave and high-precision radar PCBs, and greatly improves the overall performance of high-frequency electronic equipment.

Maxipcb provides professional customized Rogers 5880 PCB manufacturing services, alongside full-process technical support for high-frequency material selection and impedance design. We offer competitive pricing for RT/duroid 5880 and reliable one-stop solutions for high-frequency PCB prototyping and mass production.

Model: Rogers 5880 PCB

Material: rogers 5880 substrate

Layer: 1Layer - 24 layer

RT duroid 5880 dielectric constant: 2.2

5880 thickness: 0.2mm - 4.8mm

Surface Treatment : Immersion Gold

Rogers 5880 thickness: Base 0.5OZ,Finished 1OZ

Special process: Teflon multilayer pcb, Countersink PCB

Application: microwave, instrument, communication

Rogers 5880 PCB

Description

Data Sheet

Core Specifications of Rogers RT/duroid 5880

Key Characteristics of Rogers 5880

Product Application & Customization Service