• Rigid-Flex PCB(R-FPCB) plugged with epoxy resion PCB
  • Rigid-Flex PCB(R-FPCB) plugged with epoxy resion PCB
  • Rigid-Flex PCB(R-FPCB) plugged with epoxy resion PCB
  • Rigid-Flex PCB(R-FPCB) plugged with epoxy resion PCB

Rigid-Flex PCB(R-FPCB) plugged with epoxy resion PCB

Product Model: Rigid-Flex PCB Plugged with Epoxy Resin
Material: FR4 + PI Composite Substrate
Layer Structure: 16 Rigid Layers + 2 Flexible Layers
Copper Thickness: 1oz
Finished Thickness: 1.0mm
Surface Finish: Immersion Gold
Min Hole Diameter: 0.2mm
Trace/Space: 4mil/4mil (0.1mm/0.1mm)
Special Process: Epoxy Resin Plugging
Application: Digital Products PCB

  • Rigid-Flex PCB(R-FPCB) plugged with epoxy resion PCB
  • Rigid-Flex PCB(R-FPCB) plugged with epoxy resion PCB
  • Description

  • Data Sheet

Maxipcb is a high-tech enterprise focusing on the R&D and volume production of high-end printed circuit boards. The company has independently launched an industry-first intelligent PCB quotation and order management system. Guided by the Internet+ intelligent manufacturing strategy, Maxipcb is constructing Industry 4.0 smart production workshops, to provide customers with one-stop professional PCB technical support and customized manufacturing services.

Product Portfolio

Our product lineup covers radio frequency, microwave and hybrid high-frequency boards, conventional FR4 double-sided and multilayer boards, 1~3+N+3 HDI boards, anylayer HDI, rigid-flex composite boards, blind & buried hole boards, blind slot boards, backdrilled boards, IC substrates and heavy copper PCBs.
Widely applicable to Industry 4.0, communication equipment, industrial control, digital products, power modules, computers, automotive electronics, medical devices, aerospace, precision instruments, military equipment and IoT fields.

Surface Finishing

OSP, lead-free HASL, electroless nickel gold, full plate gold plating, flash gold, immersion tin, immersion silver and electrolytic hard gold are available for customized selection.

Core Process Capacity

We support customized processing including golden finger fabrication, heavy copper circuit, blind and buried via, precise impedance control, resin plug hole, carbon ink printing, backdrilling, countersink hole, depth-controlled drilling, half-plated hole, press-fit hole, peelable blue mask and removable solder mask, as well as oversized board production.

High-end Base Material

Adopted international high-performance substrates: Rogers series (RO4350B / RO3003 / RO4003 / RO3006), RT/Duroid 5880 / 5870, Arlon, Isola, Taconic and special materials such as PTFE and Teflon, to meet high-frequency and high-reliability design demands.

Layer & Electrical Specification

Full layer coverage from 2 layers to 30 layers.
Customizable dielectric constant: 2.20 / 2.55 / 3.00 / 3.38 / 3.48 / 3.50 / 3.6 / 6.15 / 10.2.

Main Application Scenarios

Consumer electronics, military and aerospace equipment, communication antenna systems, high-power modules, medical facilities, automotive electronics, industrial automation, handheld terminals, wireless signal equipment, radar systems and power amplifiers.

Model : Rigid-Flex PCB plugged with epoxy resion PCB

Material :FR4 +PI

Layer :Rigid 16L  + Flex 2L

Copper Thickness   :1OZ

Finished Thickness  :1.0mm

Surface Treatment   :  Immersion Gold

Min Hole  : 0.2mm

Trace/Space  : 4mil/4mil(0.1mm/0.1mm)

Application : Digital products pcb

Special process : plugged with epoxy resion pcb