• Rigid-Flex PCBA design and manufacturing
  • Rigid-Flex PCBA design and manufacturing
  • Rigid-Flex PCBA design and manufacturing
  • Rigid-Flex PCBA design and manufacturing
  • Rigid-Flex PCBA design and manufacturing
  • Rigid-Flex PCBA design and manufacturing

Rigid-Flex PCBA design and manufacturing

Product Model: Rigid-Flex PCBA

Reinforcing Material: Glass Fiber Cloth Base
Insulating Resin: Polyimide Resin (PI)
Product Thickness: Flexible Board 0.15mm; Rigid Board 0.5mm (Tolerance ±0.03mm)
Single Chip Size: Customized per customer drawings
Copper Foil Thickness: 18μm (0.5oz)
Solder Resist Layer: Yellow Film / Black Film / White Film / Green Solder Mask
Surface Coating & Thickness: OSP (12μm–36μm)
Fire Rating: 94-V0
Temperature Resistance Test: Thermal Shock 288℃ / 10sec

  • Rigid-Flex PCBA design and manufacturing
  • Rigid-Flex PCBA design and manufacturing
  • Rigid-Flex PCBA design and manufacturing
  • Description

  • Data Sheet

1. Definition & Structural Features of Rigid-Flex PCBA

Rigid-Flex PCBA integrates the design and manufacturing technologies of rigid PCB (Printed Circuit Board) and flexible FPC (Flexible Printed Circuit Board). Most Rigid-Flex boards are composed of multi-layer flexible circuit substrates attached to one or more rigid boards from the outer and/or inner sides, with the specific structure determined by the application scenario and design requirements. The flexible substrate is designed to maintain a constant bending state, and is usually formed into a fixed bending curve during the manufacturing or installation process to adapt to the spatial layout of terminal products.

2. Design Characteristics of Rigid-Flex PCBA

Compared with the design of traditional rigid PCBA, Rigid-Flex PCBA design is more technically challenging, as it requires layout and structural design in 3D space. However, this 3D design capability also endows it with higher space utilization efficiency. Designers can twist, fold and roll the flexible substrate according to the packaging requirements of the final application, realizing customized shapes that are difficult to achieve with traditional rigid boards, thus effectively adapting to the miniaturization and integration needs of electronic products.

3. Application Scenarios of Rigid-Flex PCBA

Rigid-Flex PCBA has a wide range of application scenarios, covering consumer electronics and industrial fields. In consumer products, it is widely used in smart devices, smartphones, digital cameras and other products; in the medical field, it has been increasingly applied to medical devices such as pacemakers, which can significantly reduce the volume and weight of equipment and improve the portability and reliability of medical devices. In addition, Rigid-Flex PCBA also plays an important role in intelligent control systems, test equipment, tools and automotive PCB/PCBA, bringing obvious performance advantages to related products.




Rigid Flex PCBA design and manufacturing

4. Advantages & Disadvantages of Rigid-Flex PCBA

4.1 Core Disadvantages

Compared with the traditional combination scheme of "FPC + rigid PCB + connector", the most obvious disadvantage of Rigid-Flex PCBA is its relatively high initial manufacturing cost, which may be nearly twice that of the traditional combination scheme. However, if the cost of connectors or Hotbar (thermal compression bonding) processes is deducted, the cost gap between the two tends to be narrowed, and the specific cost difference needs to be accurately calculated based on the project's BOM (Bill of Materials) and process requirements.

Another disadvantage lies in the assembly process: both SMT (Surface Mount Technology) placement and reflow soldering require the use of carriers to support the flexible FPC part, which indirectly increases the SMT assembly cost and process complexity.

4.2 Core Advantages

Despite the cost-related disadvantages, Rigid-Flex PCBA has significant comprehensive advantages in practical applications, mainly reflected in the following aspects:

First, it effectively saves PCB installation space and eliminates the need for connectors or Hotbar processes. Since Rigid-Flex PCBA integrates rigid and flexible substrates into one, it saves the space originally required for installing connectors or implementing Hotbar processes. For high-density PCB designs, the reduction of a single connector can significantly improve space utilization, which is crucial for miniaturized electronic products. At the same time, it also saves the cost of connector components and Hotbar process costs, and the omission of connectors allows the distance between different board layers to be closer, further optimizing the product structure.

Second, it shortens signal transmission distance, improves transmission speed and overall reliability. The traditional signal transmission path of "rigid PCB - connector - FPC - connector - rigid PCB" is simplified to "rigid PCB - FPC - rigid PCB" in Rigid-Flex PCBA, which significantly shortens the signal transmission distance and reduces signal attenuation caused by transmission between different media. In traditional schemes, PCB circuits are usually made of copper, connector contact terminals are gold-plated, and solder pins are fully tinned, requiring solder paste welding on the PCB; signal transmission between these different media will inevitably lead to attenuation. Rigid-Flex PCBA reduces the types of transmission media, effectively improving signal transmission capability, which is particularly beneficial for products with high requirements for signal accuracy, helping to enhance product reliability.

Third, it simplifies product assembly and saves assembly man-hours. The use of Rigid-Flex PCBA reduces the number of connectors, thereby reducing the SMT component placement man-hours; at the same time, it eliminates the assembly steps of inserting FPC into connectors or implementing Hotbar processes, greatly reducing the overall product assembly man-hours. In addition, the reduction of components in the BOM also simplifies parts management and inventory management, reducing the corresponding management costs.

5. Maxipcb Rigid-Flex PCBA Design & Manufacturing Capabilities

Maxipcb is a professional provider of small and medium-batch electronic services integrated with sample production, holding authoritative certifications including IATF16949, UL, ISO9001 and SGS RoHS, ensuring the quality and compliance of Rigid-Flex PCBA products.

With rich experience in Rigid-Flex PCBA R&D, design and manufacturing, Maxipcb focuses on providing customized one-stop solutions to meet the diverse needs of customers in consumer electronics, medical devices, automotive electronics, intelligent control and other fields. Our services cover Rigid-Flex PCBA proofing, sample verification, small-batch trial production and large-batch mass production, with reasonable pricing, strict quality control and on-time delivery.

Maxipcb has advanced production and testing equipment imported from the United States, Japan, Germany and other countries, with mature process capabilities in flexible substrate lamination, 3D layout design, SMT placement with carriers, and reflow soldering. We have a professional technical team dedicated to optimizing Rigid-Flex PCBA design and manufacturing processes, solving technical difficulties such as flexible substrate bending stability and signal integrity, and ensuring that each product meets the technical requirements of customers.

6. Service Commitment & Consultation Guide

Maxipcb adheres to the core value of quality, continuously optimizes the production process, improves production efficiency, and is committed to establishing long-term cooperative relationships with new and old customers. We provide professional technical support throughout the whole process, from product design consultation, BOM optimization to process improvement, helping customers achieve product upgrading and market competitiveness.

For more details about Maxipcb’s Rigid-Flex PCBA design, manufacturing, customization and quotation, welcome new and old customers to consult us at any time. Our professional team will provide you with tailored solutions and timely responses.



FAQ 

What is the typical lead time for your rigid flex PCB manufacturing?
We generally require 15 to 25 business days for rigid-flex PCB projects, including design validation, sample verification, and production. Timelines may vary based on complexity and batch size. As a trusted rigid flex PCB supplier, we aim to meet delivery schedules without compromising quality.

Can you customize the thickness and materials of rigid-flex PCBs?
Yes, we offer tailored solutions using polyimide resin substrates and glass fiber cloth reinforcement. The standard thickness is 0.15mm for flexible sections and 0.5mm for rigid parts, with ±0.03mm tolerance. Custom specifications are available to fit your product requirements from design to manufacturing.

Do you provide a full-service solution from design to mass production?
We act as a one-stop rigid flex PCB manufacturer, covering everything from design, BOM optimization, sample verification, to small-lot and mass production. Our capabilities include SMT placement with carriers and reflow soldering under IPC-aligned quality controls.

How do you ensure quality and reliability in rigid-flex PCB assemblies?
Our production follows IPC standards rigorously, supported by ISO9001 and RoHS certifications. We implement strict quality assurance, using 3D layout design and advanced testing to verify signal integrity and mechanical durability in all rigid-flex PCBAs we deliver.

Rigid-Flex PCBA design and manufacturing

Reinforcing material: glass fiber cloth base

Insulating resin: polyimide resin (PI)

Product thickness: soft plate 0.15mm; 

Hardboard 0.5mm; (tolerance ± 0.03mm)

Single-chip size: it can be customized according to customer supplied drawings

Copper foil thickness: 18 μ m(0.5oz)

Solder resist film / oil: yellow film / black film / white film / green oil

Coating and thickness: OSP (12um-36um)

Fire rating: 94-V0

Temperature resistance test: thermal shock 288 ℃ 10sec

Dielectric constant: Pi 3.5: AD 3.9:

Processing cycle:4 days for samples:7 days of mass production.

Storage environment dark and vacuum storage, temperature < 25 'C, humidity < 70%

Product features:

  1. iPCB can be customized to process HDl blind hole impedance process and other difhcult Rigid-flex PCBA design and manufacturing.
  2. Suport OEM and ODM OEM, from drawing design to circuit board production and SMT processing, and cooperate with suppiers with one-stop service,
  3. Strictly control the quality and meet the ipc2 standard.

Scope of application:

Products are widely used in mobile phones, home appliances, industrial control, industry, and other felds