Reinforcing Material: Glass Fiber Cloth Base
Insulating Resin: Polyimide Resin (PI)
Product Thickness: Flexible Board 0.15mm; Rigid Board 0.5mm (Tolerance ±0.03mm)
Single Chip Size: Customized per customer drawings
Copper Foil Thickness: 18μm (0.5oz)
Solder Resist Layer: Yellow Film / Black Film / White Film / Green Solder Mask
Surface Coating & Thickness: OSP (12μm–36μm)
Fire Rating: 94-V0
Temperature Resistance Test: Thermal Shock 288℃ / 10sec