• RF Circuit PCB
  • RF Circuit PCB

RF Circuit PCB

Product Model: RF PCB
Material: FR-4, Teflon, PTFE, Ceramic, Hydrocarbon substrate
Quality Standard: IPC Class 2 / Class 3
Dielectric Constant (DK): 1.6–2.0
Layers: 1–2 layers and multi-layer PCB
Board Thickness: 0.254mm–12mm
Copper Weight: 0.5oz–2oz
Surface Finish: Silver, Gold, OSP
Core Features: Strict RF circuit tolerance control
Application: Antennas, instruments and electronic equipment

  • RF Circuit PCB
  • Description

  • Data Sheet

1. RF PCB Material Selection

RF PCB (Radio Frequency PCB) materials are mainly classified into organic and inorganic categories, and their selection is closely related to the operating frequency, signal transmission requirements and application scenarios of RF circuits. The core performance parameters that determine the quality of RF PCB materials include dielectric constant (εr), dissipation factor (dielectric loss, tanδ), coefficient of thermal expansion (CET) and moisture absorption rate. Among these parameters, εr directly affects the impedance matching of the circuit and the transmission rate of high-frequency signals, making it the most critical factor to be prioritized in RF circuit material selection.
Maxipcb has rich manufacturing experience in RF circuit PCBs, with mature production technology and strict quality control system, which can stably produce qualified RF PCBs that meet industry standards and customer requirements. For detailed technical guidance and options on RF PCB material selection, please click - RF PCB material.

2. Key Characteristics of RF PCB

  • Wide permittivity range: The permittivity of RF PCB materials covers 2.0 to 16, which can be flexibly selected according to different RF signal frequency ranges and transmission requirements to achieve optimal signal integrity.
  • Low dielectric loss: The optimized material formula effectively reduces the energy loss of high-frequency signals during transmission, ensuring the stability and efficiency of signal transmission.
  • High-precision impedance control: Through strict material selection and process control, the impedance of RF PCB can be accurately controlled, avoiding signal reflection caused by impedance mismatch and improving signal transmission quality.
  • High-precision circuit tolerance: Maxipcb’s RF PCB can achieve a minimum circuit tolerance of ±0.02mm, which meets the strict dimensional requirements of RF circuit design and ensures the consistency of product performance.
  • Stringent thickness control: The thickness of the substrate and copper foil of RF PCB is strictly controlled, which not only ensures the structural stability of the board but also provides reliable support for impedance matching and signal transmission.





3. RF Circuit Design Overview

With the increase of operating frequency, the wavelength of electromagnetic waves corresponding to RF signals gradually becomes comparable to the size of discrete components (resistors, capacitors, inductors). At this time, the electrical response of these discrete components will deviate from their ideal frequency characteristics, leading to signal distortion, attenuation and other problems. Conventional PCBs can no longer meet the transmission requirements of high-frequency RF signals, so RF PCBs with special material and structural design must be used.
The main components of an RF circuit include RF transmission lines, filters, power amplifiers, mixers, oscillators and RF PCB circuit boards. These components work together to realize the generation, transmission, filtering and amplification of RF signals, and the performance of each component directly affects the overall operation effect of the RF system.

4. Precautions for RF Circuit Design

4.1 Interference Between Digital Circuit Modules and Analog (RF) Circuit Modules

When analog (RF) circuits and digital circuits work independently, they can usually maintain stable performance. However, when they are integrated on the same PCB and share the same power supply system, the overall system is prone to instability. The core reason is that digital signals often swing between the ground and the positive power supply (voltage amplitude > 3V) with a very short period (usually nanosecond level). The large amplitude and fast switching speed make digital signals contain a large number of high-frequency harmonics independent of the switching frequency.
In contrast, the RF signal transmitted from the wireless tuning loop to the receiving part of the wireless device is usually less than 1μV. The signal amplitude difference between digital signals and RF signals can reach 120dB. If effective isolation measures are not taken to separate digital signals from RF signals, the weak RF signals will be seriously interfered, resulting in the degradation of wireless device performance or even complete failure.

4.2 Power Supply Noise Interference

RF circuits are extremely sensitive to power supply noise, especially high-frequency harmonics such as voltage glitches. Most modern microcontrollers adopt CMOS technology, which will suddenly absorb a large amount of current from the power supply in a short time within each internal clock cycle. For example, when a microcontroller operates at an internal clock frequency of 1MHz, it will extract current from the power supply at the same frequency. If effective power decoupling measures are not adopted, voltage glitches will be generated on the power line. Once these voltage glitches propagate to the power supply pin of the RF part, it may lead to serious malfunctions of the RF circuit.

4.3 Unreasonable Ground Wire Design

Improper handling of the ground wire in RF circuits will lead to various abnormal phenomena. Unlike digital circuit design, where most digital circuits can work normally even without a ground layer, in the RF frequency band, even a short ground wire will exhibit inductive characteristics. Roughly calculated, the inductance per millimeter of the ground wire is about 1nH, and the inductance of a 10mm PCB ground wire can reach about 27Ω at 433MHz. If a ground layer is not used in the RF PCB design, most ground wires will be relatively long, which will seriously deviate the actual performance of the circuit from the design requirements.

4.4 Radiated Interference from Antennas to Other Analog Circuits

In RF PCB design, there are usually other analog circuits on the board, such as analog-to-digital converters (ADC) and digital-to-analog converters (DAC) in many systems. The high-frequency signals emitted by the RF transmitter antenna may couple to the analog input terminal of the ADC. If the input terminal of the ADC is not properly processed, the RF signal may self-oscillate in the ESD diode at the ADC input terminal, resulting in deviations in the ADC conversion accuracy and affecting the overall performance of the system.

5. Basic Principles of RF Circuit Layout Design

To ensure the stable operation of RF circuits, the following core principles must be followed in layout design:
  • Effectively isolate the High Power Amplifier (HPA) and Low Noise Amplifier (LNA), and keep the high-power RF transmitting circuit and low-power RF receiving circuit as far apart as possible to avoid mutual interference between high-power signals and weak signals.
  • Ensure that the high-power area on the RF PCB is equipped with a complete ground layer, and no vias are allowed on this ground layer. In principle, the larger the copper foil area of the ground layer, the better, which can effectively reduce ground impedance and suppress interference.
  • Pay attention to the power decoupling design of the RF circuit. Reasonable power decoupling can effectively suppress power supply noise and ensure the stability of the power supply voltage of the RF part.
  • The RF output terminal and RF input terminal should be kept at a sufficient distance to avoid signal crosstalk between the output and input, which may lead to circuit self-oscillation.
  • Sensitive analog signals (such as ADC/DAC input signals) should be arranged away from high-speed digital signals and RF signals to reduce the interference of high-frequency signals on sensitive analog signals.

3V) with a very short period (usually nanosecond level). The large amplitude and fast switching speed make digital signals contain a large number of high-frequency harmonics independent of the switching frequency."},"attribs":{"0":"*0*1+g6"},"rows":{},"cols":{}}},"type":"text"}},"RsFwf8Pd6dQlbScSgXjcF6xAnwe":{"id":"RsFwf8Pd6dQlbScSgXjcF6xAnwe","snapshot":{"ai_extra":{"is_ai_gen":true,"rewrite_command":1},"align":"left","author":"7583471497033812923","children":[],"comments":[],"hidden":false,"locked":false,"parent_id":"FRCDdUJXloT5uGxmBBDc4zwFn5c","revisions":[],"text":{"apool":{"numToAttrib":{"0":["ai-extra","{\"is_ai_gen\":true,\"rewrite_command\":1}"],"1":["author","7583471497033812923"]},"nextNum":2,"attribToNum":{"ai-extra,{\"is_ai_gen\":true,\"rewrite_command\":1}":0,"author,7583471497033812923":1}},"initialAttributedTexts":{"text":{"0":"In contrast, the RF signal transmitted from the wireless tuning loop to the receiving part of the wireless device is usually less than 1μV. 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Most modern microcontrollers adopt CMOS technology, which will suddenly absorb a large amount of current from the power supply in a short time within each internal clock cycle. For example, when a microcontroller operates at an internal clock frequency of 1MHz, it will extract current from the power supply at the same frequency. If effective power decoupling measures are not adopted, voltage glitches will be generated on the power line. Once these voltage glitches propagate to the power supply pin of the RF part, it may lead to serious malfunctions of the RF circuit."},"attribs":{"0":"*0*1+ja"},"rows":{},"cols":{}}},"type":"text"}},"DI0FfbtPEdcB2acsqiJcl70VnGd":{"id":"DI0FfbtPEdcB2acsqiJcl70VnGd","snapshot":{"ai_extra":{"is_ai_gen":true,"rewrite_command":1},"align":"left","author":"7583471497033812923","children":[],"comments":[],"hidden":false,"locked":false,"parent_id":"FRCDdUJXloT5uGxmBBDc4zwFn5c","revisions":[],"text":{"apool":{"numToAttrib":{"0":["ai-extra","{\"is_ai_gen\":true,\"rewrite_command\":1}"],"1":["author","7583471497033812923"]},"nextNum":2,"attribToNum":{"ai-extra,{\"is_ai_gen\":true,\"rewrite_command\":1}":0,"author,7583471497033812923":1}},"initialAttributedTexts":{"text":{"0":"Improper handling of the ground wire in RF circuits will lead to various abnormal phenomena. 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Basic Principles of RF Circuit Layout Design"},"attribs":{"0":"*0*1+1b"},"rows":{},"cols":{}}},"type":"heading2"}},"YRy6fEw5Fd30Rkc53kkcMRiLnbf":{"id":"YRy6fEw5Fd30Rkc53kkcMRiLnbf","snapshot":{"ai_extra":{"is_ai_gen":true,"rewrite_command":1},"align":"left","author":"7583471497033812923","children":[],"comments":[],"hidden":false,"locked":false,"parent_id":"FRCDdUJXloT5uGxmBBDc4zwFn5c","revisions":[],"text":{"apool":{"numToAttrib":{"0":["ai-extra","{\"is_ai_gen\":true,\"rewrite_command\":1}"],"1":["author","7583471497033812923"]},"nextNum":2,"attribToNum":{"ai-extra,{\"is_ai_gen\":true,\"rewrite_command\":1}":0,"author,7583471497033812923":1}},"initialAttributedTexts":{"text":{"0":"To ensure the stable operation of RF circuits, the following core principles must be followed in layout design:"},"attribs":{"0":"*0*1+33"},"rows":{},"cols":{}}},"type":"text"}},"UaKwf15p0dwXKdcH408cYdy7nwg":{"id":"UaKwf15p0dwXKdcH408cYdy7nwg","snapshot":{"ai_extra":{"is_ai_gen":true,"rewrite_command":1},"align":"left","author":"7583471497033812923","children":[],"comments":[],"hidden":false,"locked":false,"parent_id":"FRCDdUJXloT5uGxmBBDc4zwFn5c","revisions":[],"text":{"apool":{"numToAttrib":{"0":["ai-extra","{\"is_ai_gen\":true,\"rewrite_command\":1}"],"1":["author","7583471497033812923"]},"nextNum":2,"attribToNum":{"ai-extra,{\"is_ai_gen\":true,\"rewrite_command\":1}":0,"author,7583471497033812923":1}},"initialAttributedTexts":{"text":{"0":"Effectively isolate the High Power Amplifier (HPA) and Low Noise Amplifier (LNA), and keep the high-power RF transmitting circuit and low-power RF receiving circuit as far apart as possible to avoid mutual interference between high-power signals and weak signals."},"attribs":{"0":"*0*1+7b"},"rows":{},"cols":{}}},"type":"bullet"}},"XdcIft2BVdv0YNcknRfc7vgznNg":{"id":"XdcIft2BVdv0YNcknRfc7vgznNg","snapshot":{"ai_extra":{"is_ai_gen":true,"rewrite_command":1},"align":"left","author":"7583471497033812923","children":[],"comments":[],"hidden":false,"locked":false,"parent_id":"FRCDdUJXloT5uGxmBBDc4zwFn5c","revisions":[],"text":{"apool":{"numToAttrib":{"0":["ai-extra","{\"is_ai_gen\":true,\"rewrite_command\":1}"],"1":["author","7583471497033812923"]},"nextNum":2,"attribToNum":{"ai-extra,{\"is_ai_gen\":true,\"rewrite_command\":1}":0,"author,7583471497033812923":1}},"initialAttributedTexts":{"text":{"0":"Ensure that the high-power area on the RF PCB is equipped with a complete ground layer, and no vias are allowed on this ground layer. 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Product: RF PCB

Material: FR-4, Teflon, PTFE, Ceramic, Hydrocarbon

Quality standard: IPC Class2, Class3

PCB DK: 2.0 -1.6

Layers: 1-2 Layer, Multilayer PCB

Thickness: 0.254mm - 12mm

Copper thickness: 0.5oz - 2oz

Surface technology: Silver, Gold, OSP

Features: Strict tolerance control of RF circuits

Application: Antenna, instrument, Equipment