Name: PWB Manufacturing
Brand: PCB Printed Circuit Board and PCBA manufacturing
Rating: 5 (1 reviews)

Description
Data Sheet

Maxipcb is a renowned global PWB manufacturer, delivering integrated services covering PWB fabrication, customized circuit design and full-turnkey assembly. With stable quality control and professional technical support, we help customers strengthen product competitiveness and expand market share.

PCB vs PWB Definition

PCB is the abbreviation of Printed Circuit Board, and PWB stands for Printed Wiring Board. Both terms refer to the same core electronic component: an insulating substrate carrying conductive circuits to realize electrical interconnection of electronic devices. The only difference comes from regional naming habits. PCB is the mainstream term adopted in China and most global regions, while PWB was the traditional customary name widely used in the UK in the early industry stage.

Six Stages of 50-Year PWB Manufacturing Technology Evolution

The development of PWB industrial technology over the past 50 years can be divided into six clear historical phases:

1. PWB Birth Period (1936) | Additive Process

The original manufacturing solution adopted the additive process, which forms conductive patterns by attaching conductive materials to the surface of insulating boards. The first patented printed boards based on this process were officially applied in radio receivers in 1936, marking the formal birth of the PWB industry.

2. Trial Production Era (1950s) | Subtractive Process

Copper-clad paper-based phenolic resin laminate (PP base material) became mainstream. The subtractive etching method was widely applied: redundant copper foil is removed by chemical agents to retain required circuit traces. Early production relied mainly on manual operation and ferric chloride corrosive liquid.

A typical representative product of this period was the PP-based single-sided PWB equipped in Sony’s portable transistor radios.

3. Material Upgrading Period (1960s) | GE Base Material Application

Glass epoxy copper-clad laminates (GE base material) were gradually introduced into PWB production. Early GE substrates suffered from defects such as thermal warping, deformation and copper foil peeling, which were continuously optimized by material suppliers.

Since 1965, Japanese material manufacturers have realized mass production of industrial-grade GE boards, while low-cost PP base materials were universally used for civilian electronic products, forming a standardized material matching system.

4. High-Density Upgrading Period (1970s) | MLB & SMT Technology

PWB evolved from 4-layer boards to multi-layer boards (MLB). Ultra-fine lines, micro holes and thin substrates became mainstream. The line width and spacing specification was gradually reduced from 0.5mm to 0.35mm, 0.2mm and 0.1mm, greatly improving unit area wiring density.

Component mounting technology achieved revolutionary iteration: traditional through-hole mounting (THT) was replaced by SMT surface mounting technology. Automatic component inserters and dual-sided SMT assembly lines were widely popularized.

5. Ultra-High Density Leap Period (1980s)

From 1982 to 1991, Japan’s PWB industry achieved rapid expansion with total output value nearly tripling. Multi-layer board output exceeded single-sided boards in 1986, and gradually caught up with double-sided boards in 1989.

High-density multi-layer boards represented by 62-layer glass-ceramic substrates accelerated the technical iteration of computers and mobile communication equipment, driving the comprehensive upgrading of ultra-high-density PWB manufacturing.

6. 21st Century Transition Period (1990s)

Affected by Japan’s economic bubble, the PWB industry declined temporarily after 1991, and resumed steady growth in 1994. Multi-layer boards and flexible circuits became the core growth drivers, while the market share of single and double-sided boards gradually declined.

Since 1998, stacked HDI multi-layer boards entered large-scale trial production with rapidly increasing output. IC packaging evolved into BGA, CSP and other array connection modes, further promoting equipment miniaturization and ultra-high-density assembly design.

Future Industry Prospects

Starting from the invention of semiconductor transistors in 1947, continuous breakthroughs in electronic technology have completely reshaped PWB manufacturing across 50 years. Electronic chips have iterated from basic integrated circuits to high-integration products such as LSI, MCM, BGA and CSP.

In the 21st century, electronic products will continue to develop in the direction of high density, miniaturization and lightweight. Supported by nanotechnology and new material innovation, circuit board manufacturing technology will continue to upgrade, leading the high-precision, high-reliability and low-carbon development of the global electronic information industry.

Model: PWB Manufacturing

Material: FR-4, High TG FR-4

Layer: 2 Layer - 70 Layer

Color: Green/Black/Blue/White

Finished Thickness: 0.4mm - 6.0mm

Copper Thickness: 1/H/H/1 OZ

Surface Treatment: Gold/HASL/OSP

Min Trace: 3mil, 0.075mm

Min Space: 3mil, 0.075mm

Application: Electrical apparatus, industrial PCB, automotive PCB, airplane PCB

PWB Manufacturing

Description

Data Sheet