Product Model: Power Module Dedicated PWB Base Material: High-Tg FR-4 Glass Epoxy Laminate Layer Configuration: 12-Layer Multilayer Structure Solder Mask & Silkscreen: Green Solder Mask with White Legend Finished Board Thickness: 1.0 mm Copper Weight: 2–3 oz Surface Finish: Electroless Nickel Immersion Gold (ENIG) Minimum Trace Width: 8 mil (0.2 mm) Minimum Trace Spacing: 8 mil Application: Integrated circuit design for power modules