Multilayer PCB speedy circuits fabrication

Name: Multilayer PCB speedy circuits fabrication
Brand: PCB Printed Circuit Board and PCBA manufacturing
Rating: 5 (1 reviews)

Product Model: High-Speed Manufactured Multilayer PCB

Available Base Materials: FR‑4 glass epoxy, polyimide (PI), ceramic substrate, PTFE high-frequency material

Layer Structure: Double-sided & multilayer PCB

Express Lead Time: 12-hour ultra-fast prototyping service supported

Solder Mask Color: Green, blue, yellow, red, black

Finished Board Thickness: 0.15 mm – 6.0 mm

Copper Weight: 0.5 oz to 12 oz

Surface Finishing: Electroless Nickel Immersion Gold (ENIG), lead-free HASL, OSP

Minimum Design Rule: 0.1 mm trace width / 0.1 mm trace spacing

Application: General electronic equipment and commercial electronic products

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Description
Data Sheet

Rapid PCB Manufacturing & Express Prototype Service Introduction

1. Rapid Production Capability

Rapid PCB manufacturing refers to an optimized production system that completes the entire fabrication flow with highly efficient scheduling and process control.

Double-sided PCB: 12-hour expedited delivery
Multilayer PCB: 36-hour expedited delivery
Small-batch production: Completed within 3 working days

This efficient solution effectively accelerates customers’ product R&D cycles and enhances their time-to-market competitiveness.

2. Market Demand for Rapid Prototyping

The development of electronic products is inseparable from PCB prototype verification. The conventional manufacturing cycle for prototype boards generally ranges from 3 to 15 days, which greatly restricts development efficiency.

As product development typically requires 3–10 design iterations, Maxipcb’s rapid manufacturing service provides critical support for engineers to achieve efficient verification and continuous optimization.

3. Core Product Categories

Maxipcb specializes in high-performance and high-precision circuit board manufacturing, with a focus on:

PTFE (Teflon) high-frequency PCBs
Multilayer PCBs
HDI PCBs
IC substrates
IC test boards
Rigid-flex PCBs

4. Key Processes in Rapid Manufacturing

4.1 Surface Finishing

Surface finishing is a critical process ensuring solderability, conductivity and reliability. It is implemented via precision technologies including grinding, polishing, sandblasting, honing, EDM, milling, photolithography, chemical etching, laser texturing and other specialized procedures to form stable and uniform surface characteristics.

4.2 V-Cutting & Profile Machining

V-cutting and profiling process the panel into specified dimensions and structures in strict accordance with Gerber data and customer design requirements. All dimensions are calibrated against engineering drawings to ensure accuracy and consistency.

4.3 Electrical Testing

Upon completion of production, 100% electrical testing is performed on each multilayer circuit board based on original design data to verify the integrity of circuit traces and via interconnections, ensuring no open or short circuits.

Flying probe test: for small batches and prototypes
Fixture test: for volume production

TEFLON PCB, multilayer PCB speedy circuits fabrication

5. Core Advantages of Maxipcb

5.1 Stable Basic Quality & Reliable Application Performance

Our circuit boards deliver outstanding electrical interconnection performance and stable operation in terminal products such as consumer electronics, computers and military-grade equipment, with excellent adaptability to diverse application environments.

5.2 High Durability & Environmental Adaptability

Our PCBs feature high structural strength, anti-vibration performance and strong environmental resistance, ensuring long-term stability. Processing technology and material selection are continuously optimized through technological innovation.

5.3 Efficient Rapid Manufacturing & Comprehensive Service

Based on reliable quality, we provide cost-effective solutions and standardized high-efficiency rapid services. Short lead times and consistent quality strongly support customers’ R&D iterations and mass production needs.

Type : Multilayer PCB speedy circuits fabrication

Material : Fr-4, Pl. Ceramic, Teflon

Layer :2layers, multilayer pcb

Delivery : speedy circuits as fast as 12 hours

Color : green, blue, yellow, red, black

Finished Thickness :0.15-6.0mm

Copper Thickness :0.5OZ-12OZ

Surface Treatment :ENIG,HASL.OSP

Minimum line width /distance : 0.1/0.1mm

Application : electronic product