Name: LGA package IC substrate
Brand: PCB Printed Circuit Board and PCBA manufacturing
Rating: 5 (1 reviews)

Description
Data Sheet

1. Land Grid Array (LGA) Packaging Fundamentals

Land Grid Array (LGA) is an advanced semiconductor packaging technology that replaces traditional pin-based interconnects with planar metal contact lands. The LGA775 (Socket T) platform marked a transformative milestone in processor packaging, featuring 775 precision contact points arranged in a grid pattern.

Unlike pin-based packages that rely on male pins for electrical connection, LGA packages utilize spring-loaded contacts integrated into the motherboard socket. The processor is secured by a retention bracket, which applies uniform pressure to ensure reliable contact between the package lands and socket contacts. This architecture shares the same grid-based interconnect principle as Ball Grid Array (BGA) packaging, with the key distinction that LGA enables field-replaceable components, while BGA employs permanent solder ball attachments.

LGA package IC substrate

2. Embedded Component Packaging for High-Density Applications

The relentless demand for higher integration, multi-functionality, and miniaturization in electronic systems has driven the development of embedded component packaging technology. This approach integrates passive components (resistors, capacitors, inductors) and even active semiconductor dies directly into the internal layers of printed circuit boards or package substrates.

Core Technical Advantages

Reduced interconnect lengths, leading to improved signal integrity and higher operating frequencies
Increased effective packaging area by eliminating surface-mounted components
Significantly reduced number of surface solder joints, enhancing long-term reliability
Lower overall system cost through optimized component placement and simplified assembly processes

Technology Evolution

While embedded passive technology has been widely adopted in PCB manufacturing for decades, its migration to IC package substrates presents greater technical challenges. Package substrates require tighter dimensional tolerances, thinner dielectric layers, and higher manufacturing precision compared to standard PCBs. Leveraging fundamental process similarities, however, embedded passive substrate technology has rapidly transitioned to volume production.

3. Maxipcb Embedded Substrate Manufacturing Capabilities

Maxipcb has established comprehensive manufacturing capabilities for embedded component substrates, supporting both passive and active component integration:

Embedded Passive Component Technology (Volume Production)

Maxipcb offers two mature embedded passive implementation methods:

Planar (Thin-Film) Embedding: Integrates micron-thick resistive and capacitive layers into the substrate, which are then patterned using photolithography and etching processes to form precise component values
Discrete Component Embedding: Embeds ultra-thin surface-mount components (01005, 0201, 0402 form factors) using advanced SMT and via-filling interconnection processes

The number of embedded components is limited only by available substrate area. While embedded substrate manufacturing costs are higher than conventional substrates, this is offset by reduced component procurement costs, simplified SMT assembly, and improved system performance, resulting in lower overall product cost.

Embedded Active Component Technology (R&D Stage)

Building on embedded passive expertise, Maxipcb is actively developing embedded IC technology, which integrates bare semiconductor dies directly into package substrates for board-level packaging. This technology is significantly more complex than passive component embedding, requiring advanced die handling, precise alignment, and reliable interconnection processes.

Maxipcb has successfully produced functional embedded IC substrate prototypes. The next phase involves collaborative development with customers to define product specifications, optimize manufacturing processes, and improve production yields and reliability. We are actively seeking industry partners to accelerate the commercialization and engineering adoption of this transformative technology.

4. Industry Trends & Strategic Outlook

As System-on-Chip (SoC) integration approaches fundamental physical limits, advanced packaging technologies—including wafer-level CSP, System-in-Package (SiP), and embedded component packaging—have emerged as the primary path for continued system integration. Leading OEMs now consider packaging design, module architecture, and embedded PCB design as integral parts of product development, seeking innovative solutions to improve reliability, reduce form factor, and drive product differentiation.

The widespread adoption of embedded component technology is expected to drive significant restructuring of the semiconductor and electronics industry value chain, requiring closer collaboration between material suppliers, IC foundries, design houses, substrate manufacturers, packaging houses, and system integrators. As a fully integrated back-end manufacturing solution provider, Maxipcb is well-positioned to lead this transition by combining expertise in PCB fabrication, IC package substrates, PCBA assembly, and advanced packaging technologies to deliver comprehensive, end-to-end solutions for our global customers.

Model: LGA package IC substrate

Material: SI165

Layers: 4L

Thickness: 0.4mm

Single size: 8 * 8mm

Resistance welding: PSR-2000 BL500

Surface treatment: ENEPIG

Minimum aperture: 0.1mm

Minimum line distance: 100um

Minimum line width: 40um

Application: LGA package IC substrate

LGA package IC substrate

Description

Data Sheet